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Description for Dow Dowsil SE 1750 Adhesive
One-part, flowable adhesive with high tensile strength, Heat Cure, No added solvents, These adhesives generally have long working times so users can enjoy the greatest manufacturing flexibility and reduce waste.Brand Dowsil Application Type Adhesive, Seal, Gaskets 1 Part or 2 Part 1-Part Material Form Liquid, Silicone elastomer Substrate Ceramics, Glass, Reactive metals, Plastics, Resins Industry Electronic components, Fixturing parts to printed circuit boards, Flyback transformer, Reinforcing parts of connectors, Smart Meters, Sealing lids and housings for ECUs, E-Mobility Solutions, Smart Home Devices, Electronic modules, PCB system assemblies, Fixing parts of connectors, Electronics parts Manufacturer Dow Chemistry Versatile cure processing controlled by temperature, Silicone elastomer, No added solvents Cure Method Heat Cure, Addition Cure Cure Temperature (°C) 150 Cure Time (min) Rapid, 30 Viscosity (cPs) 76,100, Flowable, Self-leveling after dispensing Color White High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Volume Resistivity (O) 1.95 E+15 (ohms/cm) -
Technical Data for Dow Dowsil SE 1750 Adhesive
Overview
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1 Part or 2 Part
- 1-Part
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Material Form
- Elastomer - Silicone elastomer
- Liquid
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Industry
- Smart Meters
- Smart Home Devices
- Electronic Control Unit - Sealing lids and housings for ECUs
- E-Mobility Solutions
- Electronics - Electronic components, Electronic modules, Electronics parts
- Printed Circuit Board (PCB) - Fixturing parts to printed circuit boards, PCB system assemblies
- Transformers - Flyback transformer
- Connectors - Reinforcing parts of connectors, Fixing parts of connectors
- Power Supplies - Sealing lids and housings for power modules
- Industrial - Condensers, Housing seals, Lids
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Chemistry
- Solvent-Free - No added solvents
- Other - Versatile cure processing controlled by temperature
- Silicone - Silicone elastomer
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Application Method
- Dispenser - Automated or manual needle dispense
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Cure Method
- Addition cure
- Heat - Heat Cure
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Color
- White
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Brand
- Dowsil
Specifications
Cure Specs
Cure Temperature (°C) 150 Test Method Cure Time (min) Rapid, 30 Test Method Viscosity (cPs) 76,100, Flowable, Self-leveling after dispensing Work / Pot Time (min) Long Test Method Bond Strength
General Bond Strength (psi) Good Shear Strength (psi) 590 Test Method Tensile Strength (psi) 985, High Material Resistance
Environmental Resistance Environmental resistance High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance Moisture/humidity resistance Conductivity
Dissipation Factor 0.00200 Test Method Dielectric Strength (V/mil) Good, Durable, 725 Test Method Dielectric Constant 3.20 Test Method Volume Resistivity (O) 1.95 E+15 (ohms/cm) Test Method Hardness
Shore A Hardness 69 Test Method Elongation (%) 115 Flexibility Flexibility Modulus (psi) 870 Test Method Other Properties
Specific Gravity 1.500 Test Method Business Information
Shelf Life Details Shelf Life Details, Dow heat-cure adhesives should be stored at or below 25°C (77°C). Containers should be kept tightly closed and kept in cold storage at all times to extend shelf life. Shelf life is indicated by the “Use Before” date found on the product label. Shelf Life Temperature (°F) 41, <77 Shelf Life (mon) 8 Not Good For
Don't Use For Some solder flux residues, Organotin compounds, Unsaturated hydrocarbon plasitcizers, Organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, Polysulfides, Polysulfones, Other sulfur containing materials Don't Use With Plastic, Rubber, Non-reactive metal substrates, Teflon®, Non-reactive plastic surfaces, Polyethylene, Polypropylene, Plastic or Rubber Substrates that are Highly Plasticized -
Best Practices for Dow Dowsil SE 1750 Adhesive
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Surface Preparation
All surfaces should be thoroughly cleaned and/or degreased with Dow OS fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others
users should determine the best techniques for their particular applications.
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Mixing
No mixing required
Upon standing, some filler may settle to the bottom of the liquid containers after several weeks. To ensure a uniform product mix, the material in the container should be thoroughly mixed prior to use.
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Deairing/Degassing
Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of > 28 inches Hg for 10 minutes or until bubbling subsides.
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Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
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150°C | Heat Cure |
Cure Time Test Methods
Cure Time | Test Method |
---|---|
Rapid | |
30 min | Heat Cure |
Work / Pot Time Test Methods
Work / Pot Time | Temperature |
---|---|
Long |
Shear Strength Test Methods
Shear Strength | Type | Substrate | Test Method |
---|---|---|---|
590 psi | Lap shear strength | Aluminum | Unprimed Adhesion |
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
---|---|
3.20 | JIS K 6249, @ 1MHz |
Dielectric Strength Test Methods
Dielectric Strength | Test Method |
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Good | |
Durable | |
725 V/mil | JIS K 6249 |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
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0.00200 | JIS K 6249, @ 1MHZ |
Volume Resistivity Test Methods
Volume Resistivity | Test Method |
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1.95 E+15 (ohms/cm) | JIS K 6249 |
Modulus Test Methods
Modulus | Test Method |
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870 psi | Tensile Modulus |
Shore A Hardness Test Methods
Shore A Hardness | Shore Hardness Test Method |
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69 | JIS, Durometer |
Specific Gravity Test Methods
Specific Gravity | Test Method |
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1.500 | Cured |