Dow Dowsil SE 1750 Adhesive

Dow Dowsil SE 1750 Adhesive Datasheet
  • Description for Dow Dowsil SE 1750 Adhesive

    One-part, flowable adhesive with high tensile strength, Heat Cure, No added solvents, These adhesives generally have long working times so users can enjoy the greatest manufacturing flexibility and reduce waste.

    *See Terms of Use Below

    Brand Dowsil
    Application Type Adhesive, Seal, Gaskets
    1 Part or 2 Part 1 Part
    Material Form Liquid, Silicone elastomer
    Substrate Ceramics, Glass, Reactive metals, Plastics, Resins
    Industry Electronic components, Fixturing parts to printed circuit boards, Flyback transformer, Reinforcing parts of connectors, Smart Meters, Sealing lids and housings for ECUs, E-Mobility Solutions, Smart Home Devices, Electronic modules, PCB system assemblies, Fixing parts of connectors, Electronics parts
    Manufacturer Dow
    Chemistry Versatile cure processing controlled by temperature, Silicone elastomer, No added solvents
    Cure Method Heat Cure, Addition Cure
    Cure Temperature (°C) 150
    Cure Time (min) Rapid, 30
    Viscosity (cPs) 76,100, Flowable, Self-leveling after dispensing
    Color White
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
  • Technical Data for Dow Dowsil SE 1750 Adhesive

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Elastomer - Silicone elastomer
      • Liquid
    • Substrate
    • Industry
      • Electronic Control Unit - Sealing lids and housings for ECUs
      • E-Mobility Solutions
      • Electronics - Electronic components, Electronic modules, Electronics parts
      • Printed Circuit Board (PCB) - Fixturing parts to printed circuit boards, PCB system assemblies
      • Transformers - Flyback transformer
      • Connectors - Reinforcing parts of connectors, Fixing parts of connectors
      • Smart Meters
      • Smart Home Devices
      • Power Supplies - Sealing lids and housings for power modules
      • Industrial - Condensers, Housing seals, Lids
    • Chemistry
      • Solvent-Free - No added solvents
      • Other - Versatile cure processing controlled by temperature
      • Silicone - Silicone elastomer
    • Application Method
      • Dispenser - Automated or manual needle dispense
    • Cure Method
      • Addition cure
      • Heat - Heat Cure
    • Color
      • White
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 150 Test Method
    Cure Time (min) Rapid, 30 Test Method
    Viscosity (cPs) 76,100, Flowable, Self-leveling after dispensing
    Work / Pot Time (min) Long Test Method
    Bond Strength
    General Bond Strength (psi) Good
    Shear Strength (psi) 590 Test Method
    Tensile Strength (psi) 985, High
    Material Resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00200 Test Method
    Dielectric Strength (V/mil) Good, Durable, 725 Test Method
    Dielectric Constant 3.20 Test Method
    Volume Resistivity (O) 1.95 E+15 (ohms/cm) Test Method
    Hardness
    Shore A Hardness 69 Test Method
    Elongation (%) 115
    Flexibility Flexibility
    Modulus (psi) 870 Test Method
    Other Properties
    Specific Gravity 1.500 Test Method
    Business Information
    Shelf Life Details Shelf Life Details, Dow heat-cure adhesives should be stored at or below 25°C (77°C). Containers should be kept tightly closed and kept in cold storage at all times to extend shelf life. Shelf life is indicated by the “Use Before” date found on the product label.
    Shelf Life Temperature (°F) 41, <77
    Shelf Life (mon) 8
    Not Good For
    Don't Use For Some solder flux residues, Organotin compounds, Unsaturated hydrocarbon plasitcizers, Organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, Polysulfides, Polysulfones, Other sulfur containing materials
    Don't Use With Plastic, Rubber, Non-reactive metal substrates, Teflon®, Non-reactive plastic surfaces, Polyethylene, Polypropylene, Plastic or Rubber Substrates that are Highly Plasticized
  • Best Practices for Dow Dowsil SE 1750 Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with Dow OS fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others

      users should determine the best techniques for their particular applications.

    2. Mixing

      No mixing required

      Upon standing, some filler may settle to the bottom of the liquid containers after several weeks. To ensure a uniform product mix, the material in the container should be thoroughly mixed prior to use.

    3. Deairing/Degassing

      Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of > 28 inches Hg for 10 minutes or until bubbling subsides.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
150°C Heat Cure
Cure Time Test Methods
Cure Time Test Method
Rapid
30 min Heat Cure
Work / Pot Time Test Methods
Work / Pot Time Temperature
Long
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
590 psi Lap shear strength Aluminum Unprimed Adhesion
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.20 JIS K 6249, @ 1MHz
Dielectric Strength Test Methods
Dielectric Strength Test Method
Good
Durable
725 V/mil JIS K 6249
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00200 JIS K 6249, @ 1MHZ
Volume Resistivity Test Methods
Volume Resistivity Test Method
1.95 E+15 (ohms/cm) JIS K 6249
Modulus Test Methods
Modulus Test Method
870 psi Tensile Modulus
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
69 JIS, Durometer
Specific Gravity Test Methods
Specific Gravity Test Method
1.500 Cured