Dow Dowsil SE 1750 Adhesive

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Description for Dow Dowsil SE 1750 Adhesive

One-part, flowable adhesive with high tensile strength, Heat Cure, No added solvents, These adhesives generally have long working times so users can enjoy the greatest manufacturing flexibility and reduce waste.

*See Terms of Use Below

Brand	Dowsil
Application Type	Adhesive, Seal, Gaskets
1 Part or 2 Part	1-Part
Material Form	Liquid, Silicone elastomer
Substrate	Ceramics, Glass, Reactive metals, Plastics, Resins
Industry	Electronic components, Fixturing parts to printed circuit boards, Flyback transformer, Reinforcing parts of connectors, Smart Meters, Sealing lids and housings for ECUs, E-Mobility Solutions, Smart Home Devices, Electronic modules, PCB system assemblies, Fixing parts of connectors, Electronics parts
Manufacturer	Dow
Chemistry	Versatile cure processing controlled by temperature, Silicone elastomer, No added solvents
Cure Method	Heat Cure, Addition Cure
Cure Temperature (°C)	150
Cure Time (min)	Rapid, 30
Viscosity (cPs)	76,100, Flowable, Self-leveling after dispensing
Color	White
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Volume Resistivity (O)	1.95 E+15 (ohms/cm)

Best Practices for Dow Dowsil SE 1750 Adhesive

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Technical Data for Dow Dowsil SE 1750 Adhesive

*See Terms of Use Below

Overview

Application Type
- Gasketing - Gaskets
- Adhesive
- Sealant - Seal
1 Part or 2 Part
- 1-Part
Material Form
- Elastomer - Silicone elastomer
- Liquid
Substrate
- Ceramic - Ceramics
- Glass
- Metal - Reactive metals
- Plastic - Plastics, Resins
- Other - Laminates
Industry
- Smart Meters
- Smart Home Devices
- Electronic Control Unit - Sealing lids and housings for ECUs
- E-Mobility Solutions
- Electronics - Electronic components, Electronic modules, Electronics parts
- Printed Circuit Board (PCB) - Fixturing parts to printed circuit boards, PCB system assemblies
- Transformers - Flyback transformer
- Connectors - Reinforcing parts of connectors, Fixing parts of connectors
- Power Supplies - Sealing lids and housings for power modules
- Industrial - Condensers, Housing seals, Lids
Chemistry
- Solvent-Free - No added solvents
- Other - Versatile cure processing controlled by temperature
- Silicone - Silicone elastomer
Application Method
- Dispenser - Automated or manual needle dispense
Cure Method
- Addition cure
- Heat - Heat Cure
Color
- White
Brand
- Dowsil

Specifications

Cure Specs

Cure Temperature (°C)	150	Test Method
Cure Time (min)	Rapid, 30	Test Method
Viscosity (cPs)	76,100, Flowable, Self-leveling after dispensing
Work / Pot Time (min)	Long	Test Method

Bond Strength

General Bond Strength (psi)	Good
Shear Strength (psi)	590	Test Method
Tensile Strength (psi)	985, High

Material Resistance

Environmental Resistance	Environmental resistance
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Moisture/Humidity Resistance	Moisture/humidity resistance

Conductivity

Dissipation Factor	0.00200	Test Method
Dielectric Strength (V/mil)	Good, Durable, 725	Test Method
Dielectric Constant	3.20	Test Method
Volume Resistivity (O)	1.95 E+15 (ohms/cm)	Test Method

Hardness

Shore A Hardness	69	Test Method
Elongation (%)	115
Flexibility	Flexibility
Modulus (psi)	870	Test Method

Other Properties

Specific Gravity	1.500	Test Method

Business Information

Shelf Life Details	Shelf Life Details, Dow heat-cure adhesives should be stored at or below 25°C (77°C). Containers should be kept tightly closed and kept in cold storage at all times to extend shelf life. Shelf life is indicated by the “Use Before” date found on the product label.
Shelf Life Temperature (°F)	41, <77
Shelf Life (mon)	8

Not Good For

Don't Use For	Some solder flux residues, Organotin compounds, Unsaturated hydrocarbon plasitcizers, Organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, Polysulfides, Polysulfones, Other sulfur containing materials
Don't Use With	Plastic, Rubber, Non-reactive metal substrates, Teflon®, Non-reactive plastic surfaces, Polyethylene, Polypropylene, Plastic or Rubber Substrates that are Highly Plasticized

Best Practices for Dow Dowsil SE 1750 Adhesive

*See Terms of Use Below
1. Surface Preparation
  
  All surfaces should be thoroughly cleaned and/or degreased with Dow OS fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others
  
  users should determine the best techniques for their particular applications.
2. Mixing
  
  No mixing required
  
  Upon standing, some filler may settle to the bottom of the liquid containers after several weeks. To ensure a uniform product mix, the material in the container should be thoroughly mixed prior to use.
3. Deairing/Degassing
  
  Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of > 28 inches Hg for 10 minutes or until bubbling subsides.
Comparable Materials for Dow Dowsil SE 1750 Adhesive

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Spec Engine^® Results
- Dowsil SE 1714 Beige or Black(Dow)
  A one-part, beige or black, flowable adhesive with high tensile strength sealing lids and housings for ECUs, power modules.
- QSil 1000(CHT)
  A one-component, self-bonding siloxane elastomer that has excellent adhesion to many substrates, and is designed for use in applications up to 300 °C.
- AS1420-100(CHT)
  A heat cured, non-corrosive, neutral cure, 1-part, silicone adhesive sealant suitable for use with electronic components.
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