Dow Dowsil SE 4422 Thermally Conductive Adhesive

Dow Dowsil SE 4422 Thermally Conductive Adhesive Datasheet
  • Description for Dow Dowsil SE 4422 Thermally Conductive Adhesive

    • One-part • Gray • Moisture cure • Thermally conductive filler • Semi-flowable • Fast tack-free time • Good adhesion.

    *See Terms of Use Below

    Brand Dowsil
    Application Type Bond, Seal
    1 Part or 2 Part 1 Part
    Material Form Liquid, Silicone elastomer
    Substrate Many reactive metals, Plastics, Ceramics, Glass, Aluminum
    Industry Efficient thermal transfer for the cooling of modules, E-Mobility Solutions, Smart Meters, Smart Home Devices, PCB system assemblies, ICs, Ink Jet Printer heads, Power Supply components, Heat sinks
    Manufacturer Dow
    Chemistry Silicone elastomer, Polydimethylsiloxane
    Cure Method Moisture cure, RTV
    Cure Temperature (°C) 20 to 25, 20 to 25 Room temperature
    Cure Time (min) 8,640
    Viscosity (cPs) High, 200,000, Semi-flowable
    Color Gray
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    Relative Solvent Resistance Chemical Resistance: Resistance to minimal solvent exposure, Chemical Resistance: Resistance to intermittent solvent exposure
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55, Low Thermal Resistance
    Stress Relief Low-stress
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-1
  • Technical Data for Dow Dowsil SE 4422 Thermally Conductive Adhesive

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Elastomer - Silicone elastomer
      • Liquid
    • Substrate
    • Industry
      • E-Mobility Solutions
      • Electronics - Heat sinks, ICs, Ink Jet Printer heads, Power Supply components, Efficient thermal transfer for the cooling of modules
      • Smart Meters
      • Smart Home Devices
      • Printed Circuit Board (PCB) - PCB system assemblies
      • Power Supplies - Power Supply components
      • Industrial - Heater burners
      • Appliances - Home appliance devices
    • Chemistry
      • Volatile Content: VOC - 99.4 (% )
      • Silicone - Silicone elastomer, Polydimethylsiloxane
    • Application Method
      • Dispenser - Automated, Manual dispensing
    • Cure Method
      • Moisture / Condensation Cure - Moisture cure
      • RTV (Room Temperature Vulcanization) - RTV
    • Color
      • Gray
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: V-1 - UL 94 V-1
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25, 20 to 25 Room temperature Test Method
    Cure Time (min) 8,640 Test Method
    Viscosity (cPs) High, 200,000, Semi-flowable
    Tack Free Time (min) Fast, 11 Test Method
    Work / Pot Time (min) <10 Test Method
    Bond Strength
    General Bond Strength (psi) Good
    Shear Strength (psi) 206 Test Method
    Tensile Strength (psi) 740 Test Method
    Material Resistance
    Ozone Resistance Ozone resistance
    Non-Corrosive Non-Corrosive
    Chemical Resistance Good
    Relative Solvent Resistance Chemical Resistance: Resistance to intermittent solvent exposure, Chemical Resistance: Resistance to minimal solvent exposure
    Relative Solvent Resistance Chemical Resistance: Resistance to intermittent solvent exposure, Chemical Resistance: Resistance to minimal solvent exposure
    UV Resistance UV resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200 Test Method
    Low Temperature Resistance (°C) -45, -55, Low Thermal Resistance Test Method
    Moisture/Humidity Resistance Moisture resistance, Humidity resistance
    Conductivity
    Dissipation Factor 0.00498, 0.00498, 0.00600 Test Method
    Filler Thermally conductive filler
    Dielectric Strength (V/mil) Good, Durable, 365
    Dielectric Constant 4.44, 4.38, 4.90 Test Method
    Thermal Conductivity (W/m°K) High, 0.90, Thermally conductive Test Method
    Volume Resistivity (O) 5E+15 (ohms/cm)
    Hardness
    Stress Relief Low-stress
    Shore A Hardness 68 Test Method
    Elongation (%) 130 Test Method
    Flexibility Flexible
    Other Properties
    Specific Gravity 2.200 Test Method
    Coefficient of Thermal Expansion (CTE) 203 (Linear (micron/m °C or ppm ))
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers., The product should be stored in its original packaging with the cover tightly attached to avoid any contamination. Store in accordance with any special instructions listed on the product label. The product should be used by the indicated Expiration Date found on the label.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 9
    Not Good For
    Don't Use With Non-reactive metal substrates, Non-reactive plastic surfaces, Teflon, Polyethylene, Polypropylene, Rubber
  • Best Practices for Dow Dowsil SE 4422 Thermally Conductive Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A fnal surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.

    2. Curing

      The one-part moisture-cure adhesives are generally cured at room temperature and in a range of 0 to 80 percent relative humidity. These materials are not typically used for highly confined or deep section cures. Materials will generally cure about 0.25 inch (6.35 mm) per 7 days.

    3. Testing

      To ensure maximum bond strength for adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C Cure time for 3 mm thickness at 20°C (68°F) and 55 percent relative humidity.
20 to 25°C Room temperature 0 to 80 percent relative humidity
Cure Time Test Methods
Cure Time Test Method
8,640 min Cure time for 3 mm thickness at 20°C (68°F) and 55 percent relative humidity.
Tack Free Time Test Methods
Tack Free Time Tack Free Temperature
Fast
11 min 25°C
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
<10 min Time to double initial mixed viscosity. 20 to 25°C
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
206 psi Lap shear Aluminum Unprimed Adhesion, Specification Writers: These values are not intended for use in preparing specifications.
Tensile Strength Test Methods
Tensile Strength Test Method
740 psi Specification Writers: These values are not intended for use in preparing specifications.
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
200°C For long periods
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-45°C For long periods
-55°C
Low Thermal Resistance
Dielectric Constant Test Methods
Dielectric Constant Test Method
4.44 Dielectric Constant, 100 Hz
4.38 Dielectric Constant, 100 KHz
4.90 Dielectric Constant, 100 MHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00498 Dissipation Factor, 100 Hz
0.00498 Dissipation Factor, 100 KHz
0.00600 Dissipation Factor, 100 MHz
Thermal Conductivity Test Methods
Thermal Conductivity Temperature Test Method
High
0.90 W/m°K 25°C Specification Writers: These values are not intended for use in preparing specifications.
Thermally conductive
Elongation Test Methods
Elongation Test Method
130 % Specification Writers: These values are not intended for use in preparing specifications.
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
68 Durometer, JIS, Specification Writers: These values are not intended for use in preparing specifications.
Specific Gravity Test Methods
Specific Gravity Test Method
2.200 Cured, Specification Writers: These values are not intended for use in preparing specifications.