Dow Dowsil SE 4430 A & B

Dow Dowsil SE 4430 A & B Datasheet
  • Description for Dow Dowsil SE 4430 A & B

    Two-part; thermally conductive elastomer; soft; good thermal conductivity; low viscosity.

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Gel, Silicone elastomer
    Industry Cooler Device , Heat Sink, PCB system assemblies, Consumer devices
    Manufacturer Dow
    Chemistry Silicone elastomer, Polydimethylsiloxane matrix
    Cure Method Heat, 2-Part Cure
    Cure Temperature (°C) 20 to 25, 100, 125, 150, 120
    Cure Time (min) 10,080, 3.50, 2.50, 1.90, 30
    Viscosity (cPs) Low, 6,700, Good Flowability, Thin Bond Line Thicknesses (BLTs)
    Color Gray
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -45, -55, Low thermal resistance
    Other Resistance Low Thermal Resistance
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL V-0 recognized
  • Technical Data for Dow Dowsil SE 4430 A & B

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Elastomer - Silicone elastomer
      • Gel
    • Industry
      • Electronics - Consumer devices, Cooler Device
      • Heat sink
      • Printed Circuit Board (PCB) - PCB system assemblies
      • Power Supplies - Power Supply
    • Chemistry
      • Other - Polydimethylsiloxane matrix
      • Silicone - Silicone elastomer
    • Application Method
      • Dispenser - Automated meter-mix
      • Brush - Manual
    • Cure Method
      • Heat
      • 2-Part Cure
    • Color
      • Gray
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: V0 - UL V-0 recognized
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25, 100, 125, 150, 120 Test Method
    Cure Time (min) 10,080, 3.50, 2.50, 1.90, 30 Test Method
    Viscosity (cPs) Low, 6,700, Good Flowability, Thin Bond Line Thicknesses (BLTs) Test Method
    Work / Pot Time (min) 120 Test Method
    Mix Ratio 1:1
    Bond Strength
    Tensile Strength (psi) 620
    Material Resistance
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    UV Resistance UV resistance
    High Temperature Resistance (°C) 150 Test Method
    Low Temperature Resistance (°C) -45, -55, Low thermal resistance Test Method
    Other Resistance Low Thermal Resistance
    Conductivity
    Dissipation Factor 0.00200, 0.00020 Test Method
    Filler Thermally Conductive Fillers
    Dielectric Strength (V/mil) Durable, 454
    Dielectric Constant 4.60, 4.60 Test Method
    Thermal Conductivity (W/m°K) High, 0.96, 1.10 Test Method
    Volume Resistivity (O) 1.9E+14 (Ohm-cm)
    Hardness
    Elongation (%) 400
    Shore OO Hardness 70 Durometer
    Flexibility Soft
    Other Properties
    Specific Gravity 2.230 Test Method
    Coefficient of Thermal Expansion (CTE) 175 (ppm/ºC) Test Method
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 8
    Not Good For
    Don't Use With Non-reactive metal substrates, Non-reactive plastic surfaces, Teflon, Polyethylene, Polypropylene
  • Best Practices for Dow Dowsil SE 4430 A & B

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.

    2. Mixing

      MIXING AND DE-AIRING Upon standing, some filler may settle to the bottom of the liquid after several weeks. To ensure a uniform product mix, the material in each container should be thoroughly mixed prior to use. Two-part materials should be mixed in the proper ratio either by weight or volume. The presence of light-colored streaks or marbling indicates inadequate mixing.

    3. Deairing/Degassing

      Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of >28 inches Hg (or a residual pressure of 10-20 mm of Hg) for 10 minutes or until bubbling subsides.

    4. Curing

      PROCESSING/CURING Cure rates are rapidly accelerated with heat (see heat-cure times in Typical Properties table). Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These materials generally have long working times.

      POT LIFE AND CURE RATE Cure reaction begins with the mixing process. Initially, cure is evidenced by a gradual increase in iscosity, followed by gelation and conversion to its final state. Pot life is defined as the time required for viscosity to double after Parts A and B (base and curing agent) are mixed.

    5. Testing

      To ensure maximum bond strength for elastomers and adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C
100°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
125°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
150°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
120°C Heat Cure
Cure Time Test Methods
Cure Time Test Method
10,080 min
3.50 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
2.50 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
1.90 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
30 min Heat Cure
Viscosity Test Methods
Viscosity Test Method
Low
6,700 cPs Mixed
Good Flowability
Thin Bond Line Thicknesses (BLTs)
Work / Pot Time Test Methods
Work / Pot Time Temperature
120 min 25°C
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
150°C Long Periods
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-45°C Long Periods
-55°C
Low thermal resistance
Dielectric Constant Test Methods
Dielectric Constant Test Method
4.60 100 Hz
4.60 100 kHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00200 100 Hz
0.00020 100 kHz
Thermal Conductivity Test Methods
Thermal Conductivity Temperature
High 25°C
0.96 W/m°K
1.10 W/m°K
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
175 (ppm/ºC) (Linear CTE)
Specific Gravity Test Methods
Specific Gravity Test Method
2.230 Cured