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Description for Dow Dowsil SE 9184 RTV Adhesive
One-part, non-flowing thermally conductive adhesive, fast tack-free with controlled volatility and good flame resistance.Brand Dowsil Application Type Adhesive 1 Part or 2 Part 1-Part Material Form Paste Substrate Aluminum, Ceramic, Glass, Many reactive metals, Selected plastics Industry Cooling of various electrical components, Smart Meters, E-Mobility Solutions, Smart Home Devices Manufacturer Dow Chemistry Polydimethylsiloxane, Silicone Cure Method RTV, Moisture, RT cure Cure Temperature (°C) 20 to 25 Room temperature Cure Time (min) 240 to 420, 10,080 Viscosity (cPs) Non-flowing Color White High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55, Low thermal resistance Volume Resistivity (O) 1.5e15 (ohm/cm) Durability Durable Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0 Flammability rating -
Technical Data for Dow Dowsil SE 9184 RTV Adhesive
Overview
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Application Type
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1 Part or 2 Part
- 1-Part
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Material Form
- Paste
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Industry
- Smart Meters
- Smart Home Devices
- E-Mobility Solutions
- Electronics - Cooling of various electrical components
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Chemistry
- Other - Polydimethylsiloxane
- Silicone
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Application Method
- Dispenser - Automated or manual needle dispense systems
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Cure Method
- Room Temperature / Air Dry - RT cure
- Moisture / Condensation Cure - Moisture
- RTV (Room Temperature Vulcanization) - RTV
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Color
- White
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Key Specifications
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V0 - UL 94 V-0 Flammability rating
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Brand
- Dowsil
Specifications
Cure Specs
Cure Temperature (°C) 20 to 25 Room temperature Test Method Cure Time (min) 240 to 420, 10,080 Test Method Viscosity (cPs) Non-flowing Tack Free Time (min) Fast, 3.00 Test Method Bond Strength
Shear Strength (psi) 245 Test Method Tensile Strength (psi) 460 Material Resistance
Non-Corrosive Noncorrosive Flame Resistance Good Environmental Resistance Environmental resistance High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55, Low thermal resistance Conductivity
Dissipation Factor 0.00200 Test Method Filler Thermally conductive fillers Dielectric Strength (V/mil) 500 Dielectric Constant 4.00 Test Method Thermal Conductivity (W/m°K) 0.84, High Volume Resistivity (O) 1.5e15 (ohm/cm) Hardness
Durability Durable Shore A Hardness 74 Elongation (%) 60 Other Properties
Specific Gravity 2.200 Test Method Business Information
Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label. For best results, Dow Corning RTV adhesives should be stored at or below 25°C (77°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed with head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Shelf Life Temperature (°F) <77 Shelf Life Type from date of manufacture Shelf Life (mon) 7 Not Good For
Don't Use With Plastic, rubber, Non-reactive metal substrates, Nonreactive plastic surfaces, Teflon®, Polyethylene, Polypropylene, Plastic or rubber substrates that are highly plasticized -
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Best Practices for Dow Dowsil SE 9184 RTV Adhesive
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Surface Preparation
All surfaces should be thoroughly cleaned and/or degreased with Dow Corning® brand OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others
users should determine the best techniques for their particular applications.
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Mixing
No mixing required
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Deairing/Degassing
Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of >28 inches Hg for 10 minutes or until bubbling subsides.
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Curing
The one-part moisture-cure adhesives are generally cured at room temperature and in a range of 0 to 80 percent relative humidity. Greater than 90 percent of their full physical properties should be attained within 4 to 7 hours depending on the product chosen. These materials are not typically used for highly confined or deep section cures. Materials will generally cure about 0.25 inch (6.35 mm) per 7 days.
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Testing
Substrate Testing: To ensure maximum bond strength for adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.
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Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
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20 to 25°C Room temperature | 0 to 80 percent relative humidity |
Cure Time Test Methods
Cure Time | Test Method |
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240 to 420 min | Greater than 90 percent |
10,080 min | Generally cure about 0.25 inch (6.35 mm) per 7 days |
Tack Free Time Test Methods
Tack Free Time | Tack Free Temperature |
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Fast | |
3.00 min | 25°C |
Shear Strength Test Methods
Shear Strength | Type | Substrate |
---|---|---|
245 psi | Lap shear strength | Aluminum |
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
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4.00 | 1 MHz |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
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0.00200 | 1 MHz |
Specific Gravity Test Methods
Specific Gravity | Test Method |
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2.200 | Cured |