Dow Dowsil SE 9186

Dow Dowsil SE 9186 Datasheet
  • Description for Dow Dowsil SE 9186

    One-part, black, translucent or white, flowable, fast tack-free, controlled volatility adhesive

    *See Terms of Use Below

    Brand Dowsil
    Application Type Adhesive , Seal
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Substrate Ceramics, Glass, Many reactive metals, Plastics
    Industry Circuit board, Smart Meters, E-Mobility Solutions, Electronic equipment and modules
    Manufacturer Dow
    Chemistry Polydimethylsiloxane, Silicone
    Cure Method Moisture, Heat, Room temperature Cure
    Cure Temperature (°C) Lower temperature, 20 to 25
    Cure Time (min) Faster, 2,880
    Viscosity (cPs) 64,000, Flowable, Controlled, Self-leveling
    Color Black, White, Translucent
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
  • Technical Data for Dow Dowsil SE 9186

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Liquid
    • Substrate
    • Industry
      • E-Mobility Solutions
      • Electronics - Circuit board, Electronic equipment and modules
      • Smart Meters
      • Other - Sealing against potential stress cracks
    • Chemistry
    • Application Method
      • Dispenser - Simple needle dispensing systems, Automated systems are normally used for high volume processes, Manual dispensing for low volumes
    • Cure Method
      • Room Temperature / Air Dry - Room temperature Cure
      • Moisture
      • Heat
    • Color
      • Translucent
      • Black
      • White
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) Lower temperature, 20 to 25
    Cure Time (min) Faster, 2,880
    Viscosity (cPs) 64,000, Flowable, Controlled, Self-leveling
    Tack Free Time (min) Fast, 8 Test Method
    Bond Strength
    Shear Strength (psi) 185 Test Method
    Tensile Strength (psi) 360
    Material Resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00130 Test Method
    Dielectric Strength (V/mil) Good, Durable, 575
    Dielectric Constant 2.70 Test Method
    Volume Resistivity (O) 2.0E +16 (ohm*cm) Test Method
    Hardness
    Shore A Hardness 20
    Elongation (%) 550
    Flexibility Flexible
    Other Properties
    Specific Gravity 1.030 Test Method
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label., For best results, Dow RTV adhesives should be stored at or below the storage temperature listed on the product label. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed with head or air space minimized.
    Shelf Life Type from date of manufacture
    Shelf Life (mon) 15
    Not Good For
    Don't Use With Non-reactive metal substrates, Nonreactive plastic surfaces, Plastic substrates that are highly plasticized, Teflon, Polyethylene, Polypropylene, Rubber substrates that are highly plasticized
  • Best Practices for Dow Dowsil SE 9186

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with DOWSIL™ brand OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others

      users should determine the best techniques for their particular applications.

    2. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength on a particular substrate, cohesive failure of the product in a lap shear or similar test is needed to ensure compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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    *See Terms of Use Below

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Tack Free Time Test Methods
Tack Free Time Tack Free Temperature
Fast
8 min 25°C
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
185 psi Lap shear strength Glass Adhesion Lap Shear
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.70 Dielectric Constant @ 1MHz (JIS K 6249)
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00130 Dissipation Factor @ 1MHz (JIS K 6249)
Volume Resistivity Test Methods
Volume Resistivity Test Method
2.0E +16 (ohm*cm) JIS K 6249
Specific Gravity Test Methods
Specific Gravity Test Method
1.030 Cured