Dow EA-6054 Thixotropic Fast Low Temp Cure Adhesive Kit

Dow EA-6054 Thixotropic Fast Low Temp Cure Adhesive Kit Datasheet
  • Description for Dow EA-6054 Thixotropic Fast Low Temp Cure Adhesive Kit

    Noncorrosive; rapid low-temperature cure; non-slump; contains UV indicator for automated inspection.

    Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

    *See Terms of Use Below

    Application Type Bond, Seal, Gasket
    1 Part or 2 Part 2 Part
    Material Form Liquid, Silicone elastomer
    Manufacturer Dow
    Chemistry Silicone elastomer
    Cure Method Heat, Addition cure, Part A/Part B
    Cure Temperature (°C) Low, >100, 90, 125, 150
    Cure Time (min) Rapid, 60, 30, 10
    Color Black
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
  • Technical Data for Dow EA-6054 Thixotropic Fast Low Temp Cure Adhesive Kit

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Elastomer - Silicone elastomer
      • Liquid
    • Industry
    • Chemistry
    • Cure Method
      • Heat
      • 2-Part Cure - Addition cure, Part A/Part B
    • Color
      • Black
    Specifications
    Cure Specs
    Cure Temperature (°C) Low, >100, 90, 125, 150
    Cure Time (min) Rapid, 60, 30, 10
    Work / Pot Time (min) Long, 115 Test Method
    Thixotropic Non-slump, NonFlow
    Mix Ratio 1:1 (by volume)
    Bond Strength
    Shear Strength (psi) 780 Test Method
    Tensile Strength (psi) 800
    Material Resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00200, <0.00020 Test Method
    Dielectric Strength (V/mil) Good, 21,653,543, Durable
    Dielectric Constant 3.08, 3.02 Test Method
    Volume Resistivity (O) 2.8E+14 (ohms/cm)
    Hardness
    Shore A Hardness 63
    Elongation (%) 2
    Flexibility Flexible
    Other Properties
    Specific Gravity 1.290
    Coefficient of Thermal Expansion (CTE) 250 (Linear (micron/m °C or ppm ))
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label. For best results, Dow Corning RTV adhesives should be stored at or below 25°C (77°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed with head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 12
    Not Good For
    Don't Use With Plastic, rubber
  • Best Practices for Dow EA-6054 Thixotropic Fast Low Temp Cure Adhesive Kit

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with Dow Corning® brand OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others

      users should determine the best techniques for their particular applications.

    2. Mixing

      Upon standing, some filler may settle to the bottom of the liquid containers after several weeks. To ensure a uniform product mix, the material in each container should be thoroughly mixed prior to use. Two-part materials should be mixed in the proper ratio (1:1 or 10:1) either by weight or volume. The presence of light colored streaks or marbling indicates inadequate mixing.

    3. Deairing/Degassing

      Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of >28 inches Hg for 10 minutes or until bubbling subsides.

  • Comparable Materials for Dow EA-6054 Thixotropic Fast Low Temp Cure Adhesive Kit

    *See Terms of Use Below

    Spec Engine® Results

Questions about this material?

Get personal assistance with your specific application needs.

Your Profile Edit
  1. 04189bb1-3080-4a8b-bce4-e19c56c3c5e1
  2. 04189bb1-3080-4a8b-bce4-e19c56c3c5e1

Popular Articles

What Are the Differences Between Adhesives and Sealants?

Read Article

Silicones in LED Lighting | Gluespec

Read Article

Testing the effectiveness of surface treatments

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article
Information provided by Gluespec

Why Register?

  • View Technical Details
  • View Test Methods
  • View Key Specifications
  • View Similar Materials
  • Save your Project Searches

Already registered? Sign in.

Questions? Learn more about Gluespec

Gluespec Poll

Which answer best describes a project you are currently working on?
Work / Pot Time Test Methods
Work / Pot Time Temperature
Long
115 min Room temp.
Shear Strength Test Methods
Shear Strength Type
780 psi Lap shear strength
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.08 Dielectric constant, 100 Hz
3.02 Dielectric constant, 100 KHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00200 Dissipation factor, 100 Hz
<0.00020 Dissipation factor, 100 KHz