Dow PI-2000 Highly ConDuctive Silver Ink Datasheet Dow PI-2000 Highly ConDuctive Silver Ink

CONTACT REP
Information provided by Gluespec

  • Description for Dow PI-2000 Highly ConDuctive Silver Ink

    Thermosetting silver-filled printable ink with proprietary additive to enhance conductivity of system to give superior electrical performance.

    Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

    *See Terms of Use Below

    Application Type Adhesive, EMI shielding, Antenna for RFID tag, Antenna for smart cards
    1 Part or 2 Part 1-Part
    Material Form Paste
    Substrate Coated paper, Engineering plastics, PET, High performance plastics
    Industry Tantalum and ceramic capacitors, Printable Ink, Polymer thick film , Antenna for portable electronics, Electronics, Via plugs for pad-on-via and through-hole filling, Screen printable conductor for flexible substrate, Ground-plane conductor
    Manufacturer Dow
    Cure Method Heat
    Odor Details Low (aromatic)
    Viscosity (cPs) 17,000
    Color Silver
    Silver (Ag)-Filled Filler: Silver Ink

  • Technical Data for Dow PI-2000 Highly ConDuctive Silver Ink

    *See Terms of Use Below

    Overview
    • Application Type
      • EMI Shielding
      • RFI/RMI Shielding - Antenna for smart cards , Antenna for RFID tag
      • Adhesive
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Paste
    • Substrate
      • Plastic - Engineering plastics, High performance plastics
      • Polyethylene Terephthalate (PET) - PET
      • Paper - Coated paper
      • Other - Flexible substrates, Rigid substrates
    • Industry
      • Electronics - Antenna for portable electronics, Screen printable conductor for flexible substrate, Tantalum and ceramic capacitors, Via plugs for pad-on-via and through-hole filling, Ground-plane conductor
      • Thick Film Materials - Polymer thick film
      • Industrial - Membrane switches, PTF Dielectrics, Thermal management/thermal pillars
      • Printing and Graphics - Printable Ink
    • Application Method
      • Dispenser - Standard production equipment
      • Screen Print - Screen printing, Stencil printing
    • Cure Method
      • Heat
    • Color
      • Gray - Silver
    Specifications
    Cure Specs
    Odor Details Low (aromatic)
    Viscosity (cPs) 17,000
    Conductivity
    Thermal Conductivity (W/m°K) 3.90
    Hardness
    Flexibility High
    Other Properties
    Flash Point (°F) 212.0
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. When stored at or below 5°C, Dow Corning Highly Conductive Silver Inks have a shelf life of 6 months. To ensure uniformity, 1-kg containers should be slow-rolled prior to use. 30-cc syringes should be stored on their sides.
    Shelf Life (mon) 6
    Not Good For
    Don't Use For Tantalum/ceramic capacitors, Ground plane conductor and/or EMI shielding

  • Best Practices

    Best Practices information currently not available.

  • Comparable Materials for Dow PI-2000 Highly ConDuctive Silver Ink

    *See Terms of Use Below

    Spec Engine® Results

    • Henkel
      5420(Henkel)

      Used for automotive sensor bonding and gasketing of EMI/RF shielded enclosures.

    • Epoxy Technology
      Epo-Tek H31(Epoxy Technology)

      A single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging. Creamy thixotropic paste allows for high volume dispensing and pin transfer methods of application.

    • Henkel
      Loctite Ablestik 3880(Henkel)

      Designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required. Syringe or stencil dispense.

    • Compare All

    Closest Results from this Manufacturer

  Download Technical Data Sheet   Save This Material   Compare View Saved Items

Popular Articles

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Lightweighting drives automotive adhesives demand

Read Article

Testing the effectiveness of surface treatments

Read Article

6 objects held together by adhesives you probably can't live without

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article

Featured Ads

Top Catalog Pages for Dow PI-2000 Highly ConDuctive Silver Ink

All Dow Materials
View Now

Gluespec Poll

Which answer best describes a project you are currently working on?