Dow PI-2200 Highly ConDuctive Silver Ink

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Description for Dow PI-2200 Highly ConDuctive Silver Ink

Low temperature curing silver filled printable ink; contains proprietary additive to enhance conductivity of system.

Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

*See Terms of Use Below

Application Type	Adhesive, EMI shielding, Antenna for smart cards, Antenna for RFID tags
1 Part or 2 Part	1-Part
Material Form	Paste
Substrate	Coated paper, Engineering plastics, PET, High performance plastics
Industry	Antenna for portable electronics, Printable Ink, Polymer thick film, Electronics, Via plugs for pad-on-via and through-hole filling, Screen printable conductor for flexible substrate, Tantalum, Tantalum/ceramic capacitors, Ground plane conductor
Manufacturer	Dow
Cure Method	Heat
Cure Temperature (°C)	Low, 85
Odor Details	Low (aromatic)
Cure Time (min)	20
Viscosity (cPs)	18,000
Color	Silver
Silver (Ag)-Filled	Filler: Silver Ink

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Technical Data for Dow PI-2200 Highly ConDuctive Silver Ink

*See Terms of Use Below

Overview

Application Type
- EMI Shielding
- RFI/RMI Shielding - Antenna for smart cards, Antenna for RFID tags
- Adhesive
1 Part or 2 Part
- 1-Part
Material Form
- Paste
Substrate
- Plastic - Engineering plastics, High performance plastics
- Polyethylene Terephthalate (PET) - PET
- Paper - Coated paper
- Other - Flexible substrates, Rigid substrates
Industry
- Electronics - Antenna for portable electronics, Screen printable conductor for flexible substrate, Tantalum, Tantalum/ceramic capacitors, Via plugs for pad-on-via and through-hole filling, Ground plane conductor
- Thick Film Materials - Polymer thick film
- Industrial - Membrane switches, PTF Dielectrics
- Printing and Graphics - Printable Ink
Application Method
- Dispenser - Standard production equipment
- Screen Print - Screen printing, Stencil printing
Cure Method
- Heat
Color
- Gray - Silver

Specifications

Cure Specs

Cure Temperature (°C)	Low, 85
Odor Details	Low (aromatic)
Cure Time (min)	20
Viscosity (cPs)	18,000

Conductivity

Thermal Conductivity (W/m°K)	1.00

Hardness

Flexibility	High

Other Properties

Flash Point (°F)	183.2

Business Information

Shelf Life Details	Shelf life is indicated by the “Use By” date found on the product label. When stored at or below 5°C, Dow Corning Highly Conductive Silver Inks have a shelf life of 6 months. To ensure uniformity, 1-kg containers should be slow-rolled prior to use. 30-cc syringes should be stored on their sides.
Shelf Life (mon)	6

Not Good For

Don't Use For	Via plugs for throughhole filling, Thermal management/thermal pillars

Best Practices

Best Practices information currently not available.
Comparable Materials for Dow PI-2200 Highly ConDuctive Silver Ink

*See Terms of Use Below

Spec Engine^® Results
- 5420(Henkel)
  Used for automotive sensor bonding and gasketing of EMI/RF shielded enclosures.
- Epo-Tek H31(Epoxy Technology)
  A single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging. Creamy thixotropic paste allows for high volume dispensing and pin transfer methods of application.
- Loctite Ablestik 3880(Henkel)
  Designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required. Syringe or stencil dispense.
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