Dow PI-2320 Highly ConDuctive Silver Ink

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Description for Dow PI-2320 Highly ConDuctive Silver Ink

Thermoplastic silver filled printable ink; contains proprietary additive to enhance conductivity of the system.

Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

Application Type	Adhesive, EMI shielding, Antenna for smart cards , Antenna for RFID tag
1 Part or 2 Part	1-Part
Material Form	Paste
Substrate	PVC
Industry	Screen printable conductor for flexible substrate, Printable ink, Screen-printable conductor for circuitry on flexible substrates, Via plugs for pad-on-via and through-hole filling and polyme, Ground plane conductor
Manufacturer	Dow
Cure Method	Heat
Odor Details	Low (aromatic)
Viscosity (cPs)	9,520
Color	Silver
Silver (Ag)-Filled	Filler: Silver Ink

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Application Type
- EMI Shielding
- RFI/RMI Shielding - Antenna for smart cards , Antenna for RFID tag
- Adhesive
1 Part or 2 Part
- 1-Part
Material Form
- Paste
Substrate
- Polyvinyl chloride (PVC) - PVC
- Other - Flexible substrates
Industry
- Electronics - Screen printable conductor for flexible substrate, Screen-printable conductor for circuitry on flexible substrates, Via plugs for pad-on-via and through-hole filling and polyme, Ground plane conductor
- Industrial - Membrane switches, PTF
- Printing and Graphics - Printable ink
Application Method
- Dispenser - Standard production equipment
- Screen Print - Screen printing, Stencil printing
Cure Method
- Heat
Color
- Gray - Silver

Odor Details	Low (aromatic)
Viscosity (cPs)	9,520

Thermal Conductivity (W/m°K)	1.80

Flexibility	High

Flash Point (°F)	167.0

Shelf Life Details	Shelf life is indicated by the “Use By” date found on the product label. When stored at or below 5°C, Dow Corning Highly Conductive Silver Inks have a shelf life of 6 months. To ensure uniformity, 1-kg containers should be slow-rolled prior to use. 30-cc syringes should be stored on their sides.
Shelf Life (mon)	6

Don't Use For	Antenna for smart cards, smart/RFID tags, portable electronics, Tantalum/ceramic capacitors, Via plugs for throughhole filling, Thermal management/thermal pillars