Dow SE 4410 Encapsulant Datasheet Dow SE 4410 Encapsulant

Information provided by Gluespec
  • Description for Dow SE 4410 Encapsulant

    • Two-part • Heat cure • Polydimethylsiloxane encapsulant • Flexible elastomer •Durable dielectric insulation

    *See Terms of Use Below

    Chemical Resistance Good
    Application Type Bond, Pot, Encapsulant
    1 Part or 2 Part 2 Part
    Material Form Liquid, Silicone elastomer
    Substrate Aluminum
    Industry Electronic, Heat sink, Sensors, High-voltage transformer, Ink jet printer heads, IC
    Manufacturer Dow
    Chemistry Silicone elastomer, Polydimethylsiloxane
    Cure Method 2 Parts, Heat cure
    Cure Temperature (°C) 150, 150, 70
    Cure Time (min) 30, 60, 30
    Viscosity (cPs) Low, 3,000, Flowable
    Color Gray
    Ozone Resistance Ozone resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0

Popular Articles

Electrically Conductive Adhesives

Read Article

Testing the effectiveness of surface treatments

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

6 objects held together by adhesives you probably can't live without

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article

Featured Ads

Top Catalog Pages for Dow SE 4410 Encapsulant

Gluespec Poll

Who do you read or follow for engineering news and entertainment?
Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
150°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus additional time may be required for the part to warm to near oven temperature.
150°C Heat Cure Time
70°C Pre-cure time
Cure Time Test Methods
Cure Time Test Method
30 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus additional time may be required for the part to warm to near oven temperature.
60 min Heat Cure Time
30 min Pre-cure time
Viscosity Test Methods
Viscosity Test Method
Low
3,000 cPs Mixed
Flowable
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
360 min Pot Life – hours 25°C
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
580 psi Lap shear Aluminum Unprimed Adhesion
Dielectric Constant Test Methods
Dielectric Constant Test Method
4.40 At 1 MHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
2E-03 At 1 MHz
Thermal Conductivity Test Methods
Thermal Conductivity Temperature
Moderate
0.92 W/m°K 25°C
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
88 Durometer Shore A (JIS)
Specific Gravity Test Methods
Specific Gravity Test Method
2.150 Cured