Dow SE 4410 Encapsulant Datasheet Dow SE 4410 Encapsulant

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  • Description for Dow SE 4410 Encapsulant

    • Two-part • Heat cure • Polydimethylsiloxane encapsulant • Flexible elastomer •Durable dielectric insulation

    *See Terms of Use Below

    Chemical Resistance Good
    Application Type Bond, Pot, Encapsulant
    1 Part or 2 Part 2-Part
    Material Form Liquid, Silicone elastomer
    Substrate Aluminum
    Industry Electronic, Heat sink, High-voltage transformer, Sensors, Ink jet printer heads, IC
    Manufacturer Dow
    Chemistry Silicone elastomer, Polydimethylsiloxane
    Cure Method Heat cure, 2 Parts
    Cure Temperature (°C) 150, 150, 70
    Cure Time (min) 30, 60, 30
    Viscosity (cPs) Low, 3,000, Flowable
    Color Gray
    Ozone Resistance Ozone resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Volume Resistivity (O) 4E+15 (ohms/cm)
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0
  • Technical Data for Dow SE 4410 Encapsulant

    Overview
    • Chemical Resistance
      • Chemical Resistance - Good
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Elastomer - Silicone elastomer
      • Liquid
    • Substrate
    • Industry
    • Chemistry
      • Silicone - Silicone elastomer, Polydimethylsiloxane
    • Application Method
      • Dispenser - Automated airless dispense equipment
    • Cure Method
      • Heat - Heat cure
      • 2-Part Cure - 2 Parts
    • Color
      • Gray
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V0 - UL 94 V-0
    Specifications
    Cure Specs
    Cure Temperature (°C) 150, 150, 70 Test Method
    Cure Time (min) 30, 60, 30 Test Method
    Viscosity (cPs) Low, 3,000, Flowable Test Method
    Work / Pot Time (min) 360 Test Method
    Mix Ratio 1:1
    Bond Strength
    Shear Strength (psi) 580 Test Method
    Tensile Strength (psi) 1,030
    Material Resistance
    Ozone Resistance Ozone resistance
    UV Resistance UV resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Conductivity
    Dissipation Factor 2E-03 Test Method
    Dielectric Strength (V/mil) Durable dielectric insulation, 600
    Dielectric Constant 4.40 Test Method
    Thermal Conductivity (W/m°K) Moderate, 0.92 Test Method
    Volume Resistivity (O) 4E+15 (ohms/cm)
    Hardness
    Shore A Hardness 88 Test Method
    Elongation (%) 50
    Flexibility Flexible
    Other Properties
    Specific Gravity 2.150 Test Method
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers.
    Shelf Life Temperature (°F) 90
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 12
    Not Good For
    Don't Use With non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene
  • Best Practices for Dow SE 4410 Encapsulant

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.

    2. Mixing

      Upon standing, some filler may settle to the bottom of the liquid after several weeks. To ensure a uniform product mix, the material in each container should be thoroughly mixed prior to use. Two-part materials should be mixed in the proper ratio either by weight or volume. The presence of light-colored streaks or marbling indicates inadequate mixing.

    3. Deairing/Degassing

      Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of >28 inches Hg (or a residual pressure of 10-20 mm of Hg) for 10 minutes or until bubbling subsides.

    4. Curing

      Addition-cure adhesives should be cured at 100°C (212°F) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). Thin sections of less than mils may be cured in 15 minutes at 150°C (30°F). For thicker sections, a precure at 70°C (158°F) may be necessary to reduce voids in the elastomer. Length of precure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70°C (158°F) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no byproducts from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These adhesives generally have long working times.

    5. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength for elastomers and adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
150°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus additional time may be required for the part to warm to near oven temperature.
150°C Heat Cure Time
70°C Pre-cure time
Cure Time Test Methods
Cure Time Test Method
30 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus additional time may be required for the part to warm to near oven temperature.
60 min Heat Cure Time
30 min Pre-cure time
Viscosity Test Methods
Viscosity Test Method
Low
3,000 cPs Mixed
Flowable
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
360 min Pot Life – hours 25°C
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
580 psi Lap shear Aluminum Unprimed Adhesion
Dielectric Constant Test Methods
Dielectric Constant Test Method
4.40 At 1 MHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
2E-03 At 1 MHz
Thermal Conductivity Test Methods
Thermal Conductivity Temperature
Moderate
0.92 W/m°K 25°C
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
88 Durometer Shore A (JIS)
Specific Gravity Test Methods
Specific Gravity Test Method
2.150 Cured