Dow SE 4451 Thermally ConDuctive Adhesive Datasheet Dow SE 4451 Thermally ConDuctive Adhesive

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  • Description for Dow SE 4451 Thermally ConDuctive Adhesive

    One-part; heat cure; very high thermal conductivity, low viscosity.

    Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

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    Chemical Resistance Good
    Application Type Bond
    1 Part or 2 Part 2-Part
    Material Form Liquid, Silicone elastomer
    Industry Heat sinks, ICs, Ink jet printed heads, Power supply components
    Manufacturer Dow
    Chemistry Silicone elastomer
    Cure Method 2 Parts, Heat
    Cure Temperature (°C) 20 to 25, 100, 125, 150
    Cure Time (min) Fast, 90, 60, 30
    Viscosity (cPs) Low, 32,000
    Color Gray
    Ozone Resistance Ozone resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Volume Resistivity (O) 1.8E+14 (ohms/cm)

  • Technical Data for Dow SE 4451 Thermally ConDuctive Adhesive

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    Overview
    • Chemical Resistance
      • Chemical Resistance - Good
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Elastomer - Silicone elastomer
      • Liquid
    • Industry
    • Chemistry
    • Application Method
      • Dispenser - Automated, Manual dispensing
    • Cure Method
      • Heat
      • 2-Part Cure - 2 Parts
    • Color
      • Gray
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25, 100, 125, 150 Test Method
    Cure Time (min) Fast, 90, 60, 30 Test Method
    Viscosity (cPs) Low, 32,000
    Work / Pot Time (min) 240 Test Method
    Bond Strength
    Shear Strength (psi) 340 Test Method
    Tensile Strength (psi) 425
    Material Resistance
    Ozone Resistance Ozone resistance
    UV Resistance UV resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00130, <0.00010 Test Method
    Dielectric Strength (V/mil) Good, 14,842,520, Durable
    Dielectric Constant 6.29, 6.26 Test Method
    Thermal Conductivity (W/m°K) Very high, 3.00 Test Method
    Volume Resistivity (O) 1.8E+14 (ohms/cm)
    Hardness
    Shore A Hardness 87
    Elongation (%) 0
    Flexibility Flexible
    Other Properties
    Specific Gravity 3.040
    Coefficient of Thermal Expansion (CTE) 105 (Linear (micron/m °C or ppm ))
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 6
    Not Good For
    Don't Use With non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene.

  • Best Practices for Dow SE 4451 Thermally ConDuctive Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.

    2. Mixing

      Upon standing, some filler may settle to the bottom of the liquid after several weeks. To ensure a uniform product mix, the material in each container should be thoroughly mixed prior to use. Two-part materials should be mixed in the proper ratio either by weight or volume. The presence of light-colored streaks or marbling indicates inadequate mixing.

    3. Deairing/Degassing

      Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of >28 inches Hg (or a residual pressure of 10-20 mm of Hg) for 10 minutes or until bubbling subsides.

    4. Curing

      The one-part moisture-cure adhesives are generally cured at room temperature and in a range of 20 to 80 percent relative humidity. Greater than 90 percent of their full physical properties should be attained within 24 to 72 hours depending on the product chosen. These materials are not typically used for highly confined or deep section cures. Materials will generally cure about 0.25 inch (6.35 mm) per 7 days. Addition-cure adhesives should be cured at 100ºC (212ºF) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). Thin sections of less than 2 mils may be cured in 15 minutes at 150ºC (302ºF). For thicker sections, a pre-cure at 70ºC (158ºF) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70ºC (158ºF) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These adhesives generally have long working times.

    5. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength for elastomers and adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

  • Comparable Materials for Dow SE 4451 Thermally ConDuctive Adhesive

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C
100°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
125°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
150°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
Cure Time Test Methods
Cure Time Test Method
Fast
90 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
60 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
30 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
240 min Time to double initial mixed viscosity. 25°C
Shear Strength Test Methods
Shear Strength Type
340 psi Lap shear strength
Dielectric Constant Test Methods
Dielectric Constant Test Method
6.29 Dielectric constant, 100 Hz
6.26 Dielectric constant, 100 KHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00130 Dissipation factor, 100 Hz
<0.00010 Dissipation factor, 100 KHz
Thermal Conductivity Test Methods
Thermal Conductivity Temperature
Very high 25°C
3.00 W/m°K