Dow SE 4486 CV Thermally ConDuctive Adhesive

Dow SE 4486 CV Thermally ConDuctive Adhesive Datasheet
  • Description for Dow SE 4486 CV Thermally ConDuctive Adhesive

    One part, white, moisture cure, thermally conductive silicone adhesive. Is designed to provide efficient thermal transfer for the cooling of modules, including home appliance devices.

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Industry Heat sinks, ICs, Ink Jet Printer heads, Power Supply components, Efficient thermal transfer for the cooling of modules
    Manufacturer Dow
    Chemistry Polydimethylsiloxane
    Cure Method Moisture cure, RTV-cure
    Cure Temperature (°C) 20 to 25, 20 to 25
    Cure Time (min) Fast, 7,200
    Viscosity (cPs) 19,000, Semi-flowable
    Color White
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
  • Technical Data for Dow SE 4486 CV Thermally ConDuctive Adhesive

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Liquid
    • Industry
      • Electronics - Heat sinks, ICs, Ink Jet Printer heads, Power Supply components, Efficient thermal transfer for the cooling of modules
      • Power Supplies - Power Supply components
      • Appliances - Home appliance devices
    • Chemistry
    • Application Method
      • Dispenser - Automated, Manual dispensing
    • Cure Method
      • Moisture / Condensation Cure - Moisture cure
      • RTV (Room Temperature Vulcanization) - RTV-cure
    • Color
      • White
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25, 20 to 25 Test Method
    Cure Time (min) Fast, 7,200 Test Method
    Viscosity (cPs) 19,000, Semi-flowable
    Tack Free Time (min) Fast, 4.00 Test Method
    Work / Pot Time (min) <4.00 Test Method
    Bond Strength
    General Bond Strength (psi) Good
    Shear Strength (psi) 200 Test Method
    Tensile Strength (psi) 570
    Material Resistance
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    UV Resistance UV resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00807, 0.00325, 0.00300 Test Method
    Filler Filler
    Dielectric Strength (V/mil) Good, Durable, 329
    Dielectric Constant 4.16, 4.12, 4.80 Test Method
    Thermal Conductivity (W/m°K) Thermally conductive, 1.53 Test Method
    Volume Resistivity (O) 2E+14 (ohms/cm)
    Hardness
    Shore A Hardness 78
    Elongation (%) 43
    Flexibility Flexible
    Other Properties
    Specific Gravity 2.600 Test Method
    Coefficient of Thermal Expansion (CTE) 124 (Linear (micron/m °C or ppm ))
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 12
    Not Good For
    Don't Use With non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene
  • Best Practices for Dow SE 4486 CV Thermally ConDuctive Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.

    2. Curing

      The one-part moisture-cure adhesives are generally cured at room temperature and in a range of 20 to 80 percent relative humidity. Greater than 90 percent of their full physical properties should be attained within 24 to 72 hours depending on the product chosen. These materials are not typically used for highly confined or deep section cures. Materials will generally cure about 0.25 inch (6.35 mm) per 7 days. Addition-cure adhesives should be cured at 100ºC (212ºF) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). Thin sections of less than 2 mils may be cured in 15 minutes at 150ºC (302ºF). For thicker sections, a pre-cure at 70ºC (158ºF) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70ºC (158ºF) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These adhesives generally have long working times.

    3. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength for elastomers and adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C
20 to 25°C Cure time for 3 mm thickness at 20°C (68°F) and 55 percent relative humidity.
Cure Time Test Methods
Cure Time Test Method
Fast
7,200 min Cure time for 3 mm thickness at 20°C (68°F) and 55 percent relative humidity.
Tack Free Time Test Methods
Tack Free Time Tack Free Temperature
Fast
4.00 min 25°C
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
<4.00 min Time to double initial mixed viscosity. 25°C
Shear Strength Test Methods
Shear Strength Type
200 psi Lap shear strength
Dielectric Constant Test Methods
Dielectric Constant Test Method
4.16 Dielectric constant, 100 Hz
4.12 Dielectric constant, 100 KHz
4.80 Dielectric constant, 100 MHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00807 Dissipation factor, 100 Hz
0.00325 Dissipation factor, 100 KHz
0.00300 Dissipation factor, 100 MHz
Thermal Conductivity Test Methods
Thermal Conductivity Temperature
Thermally conductive 25°C
1.53 W/m°K
Specific Gravity Test Methods
Specific Gravity Test Method
2.600 Cured