• Description for Dow SE 9189 L

    Fast tack-free time; noncorrosive; controlled volatility.

    *See Terms of Use Below

    Application Type Bond, Sealing
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Substrate Glass
    Industry Circuit board, E-Mobility Solutions, Smart Meters, Smart Home Devices, Headlamp assemblies, PDP module assembly
    Manufacturer Dow
    Chemistry Silicone, Polydimethylsiloxane
    Cure Method Moisture, RTV
    Cure Temperature (°C) 20 to 25
    Cure Time (min) 4,320
    Viscosity (cPs) 22,000, NonFlow
    Color Gray, White
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0
  • Technical Data for Dow SE 9189 L

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Liquid
    • Substrate
    • Industry
      • E-Mobility Solutions
      • Headlamp - Headlamp assemblies
      • Electronics - Circuit board, PDP module assembly
      • Smart Meters
      • Smart Home Devices
    • Chemistry
    • Application Method
      • Dispenser - Automated or manual needle
      • Flow
    • Cure Method
      • Moisture / Condensation Cure - Moisture
      • RTV (Room Temperature Vulcanization) - RTV
    • Color
      • Gray
      • White
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: V0 - UL 94 V-0
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25
    Cure Time (min) 4,320
    Viscosity (cPs) 22,000, NonFlow
    Tack Free Time (min) Fast, 8 Test Method
    Bond Strength
    Shear Strength (psi) 131 (N/cm²) Test Method
    Tensile Strength (psi) 284
    Material Resistance
    Flame Resistance Good flame resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00040 Test Method
    Dielectric Strength (V/mil) 625 Test Method
    Dielectric Constant 3.10 Test Method
    Volume Resistivity (O) 9E+14 (ohms/cm) Test Method
    Hardness
    Shore A Hardness 33 Test Method
    Elongation (%) 220
    Flexibility Flexible
    Other Properties
    Specific Gravity 1.190 Test Method
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label.
    Shelf Life Temperature (°F) <90
    Shelf Life Type from date of manufacture
    Shelf Life (mon) 15
    Not Good For
    Don't Use With Plastic, rubber
  • Best Practices for Dow SE 9189 L

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with Dow Corning® brand OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others

      users should determine the best techniques for their particular applications.

    2. Mixing

      Upon standing, some filler may settle to the bottom of the liquid containers after several weeks. To ensure a uniform product mix, the material in each container should be thoroughly mixed prior to use. Two-part materials should be mixed in the proper ratio (1:1 or 10:1) either by weight or volume. The presence of light colored streaks or marbling indicates inadequate mixing.

    3. Deairing/Degassing

      Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of >28 inches Hg for 10 minutes or until bubbling subsides.

    4. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is desired. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or can detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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Tack Free Time Test Methods
Tack Free Time Tack Free Temperature
Fast
8 min 25°C
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
131 (N/cm²) Lap shear strength Glass Unprimed Adhesion
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.10 Dielectric Constant @ 1MHz (JIS K 6249)
Dielectric Strength Test Methods
Dielectric Strength Test Method
625 V/mil JIS K 6249
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00040 Dissipation Factor @ 1MHz (JIS K 6249)
Volume Resistivity Test Methods
Volume Resistivity Test Method
9E+14 (ohms/cm) JIS K 6249
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
33 JIS
Specific Gravity Test Methods
Specific Gravity Test Method
1.190 Cured