Dow Sylgard 182 Silicone Elastomer

Dow Sylgard 182 Silicone Elastomer Datasheet
  • Description for Dow Sylgard 182 Silicone Elastomer

    A transparent; long pot life; two-part, 10:1 mix, heat cure elastomer, no exotherm during cure, repairable, good dielectric properties, flexible elastomer, low stress

    *See Terms of Use Below

    Brand Sylgard
    Application Type Bond, Potting, Encapsulant
    1 Part or 2 Part 2 Part
    Material Form Liquid, Silicone elastomer
    Industry Amplifiers, Connectors, Relays, High voltage resistor packs, Sensors, Transformers, Solar cells, E-Mobility Solutions, Smart Meters, Smart Home Devices, Electrical/PCB system applications, Electronics, Lead integrated circuit
    Manufacturer Dow
    Chemistry Silicone elastomer, No solvents
    Cure Method Heat cure, 2-Part Cure, Room temperature cure
    Cure Temperature (°C) 100, 125, 150, 25, 25 Room temperature
    Cure Time (min) 75, 30, 20, 20,160
    Viscosity (cPs) 4,575, Flowable
    Color Transparent
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 200, <60
    Low Temperature Resistance (°C) -45, -55
    Stress Relief Low stress
    Repairability Repairable
    Light Refractive Index (RI) 1.4100
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-1
  • Technical Data for Dow Sylgard 182 Silicone Elastomer

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Elastomer - Silicone elastomer
      • Liquid
    • Industry
      • E-Mobility Solutions
      • Electronics - Lead integrated circuit, Relays
      • Solar Energy - Solar cells
      • Amplifiers
      • Connectors
      • Voltage Resistors - High voltage resistor packs
      • Sensors
      • Transformers
      • Smart Meters
      • Smart Home Devices
      • Printed Circuit Board (PCB) - Electrical/PCB system applications
      • Power Supplies
      • Industrial - Industrial controls, General potting applications
    • Chemistry
    • Application Method
      • Dispenser - Automated or manual mixing and dispensing
    • Cure Method
      • Room Temperature / Air Dry - Room temperature cure
      • Heat - Heat cure
      • 2-Part Cure
    • Color
      • Clear / Transparent - Transparent
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: V-1 - UL 94 V-1
    • Brand
      • Sylgard
    Specifications
    Cure Specs
    Cure Temperature (°C) 100, 125, 150, 25, 25 Room temperature
    Cure Time (min) 75, 30, 20, 20,160
    Viscosity (cPs) 4,575, Flowable Test Method
    Linear Shrinkage (%) Minimal shrinkage
    Work / Pot Time (min) Long, 480 Test Method
    Mix Ratio 10:1 (by volume), 10:1 (by weight)
    Bond Strength
    Tear Strength (piw) 25 (ppi) Test Method
    Tensile Strength (psi) 1,105 Test Method
    Material Resistance
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    UV Resistance UV resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200, <60
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00050, 0.00050 Test Method
    Dielectric Strength (V/mil) Good, Durable, 475 Test Method
    Dielectric Constant 2.65, 2.65 Test Method
    Thermal Conductivity (W/m°K) 0.48 Test Method
    Volume Resistivity (O) 1.61 E+15 (ohm*cm) Test Method
    Hardness
    Stress Relief Low stress
    Repairability Repairable
    Shore A Hardness 51 Test Method
    Elongation (%) 105 Test Method
    Flexibility Flexible
    Modulus (psi) 1,050 Test Method
    Other Properties
    Light Refractive Index (RI) 1.4100 Test Method
    Specific Gravity 1.030 Test Method
    Coefficient of Thermal Expansion (CTE) 325 (ppm/°C) Test Method
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label. For best results, Dow silicone encapsulants should be stored at or below 25°C (77°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen.
    Shelf Life Temperature (°F) 77
    Shelf Life (mon) 24
    Not Good For
    Don't Use For Unsaturated hydrocarbon plasitcizers, Polysulfones, Organotin, Silicone rubber containing organotin catalyst, Curing agents, Some solder flux residues, Polysulfides, Other sulfur containing materials, Organometallic compounds, Chemicals, Plasticizers
    Don't Use With Sulfur, Certain materials
  • Best Practices for Dow Sylgard 182 Silicone Elastomer

    *See Terms of Use Below

    1. Surface Preparation

      In applications requiring adhesion, priming will be required for the silicone encapsulants. See the Primer Selection Guide for the correct primer to use with a given product. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly air dried prior to application of the silicone elastomer. Additional instructions for primer usage can be found in the information sheets specific to the individual primers.

    2. Mixing

      Dow silicone 10:1 encapsulants are supplied in two parts as lot-matched base and curing agent that are mixed in a ratio of 10 parts base to one part curing agent, by weight. After thoroughly mixing base and curing agent, agitate gently to reduce the amount of air introduced. Allowing the mixture to set for 30 minutes before pouring may be adequate for removal of the air introduced during mixing.

    3. Deairing/Degassing

      If air bubbles are still present, vacuum deairing may be required. Deair in a container with at least four times the liquid volume to allow for expansion of material. Air entrapped in the mixture can be removed by using a vacuum of 28 to 30 inches Hg. Continue the vacuum until the liquid expands and settles to its original volume and bubbling subsides. This may take 15 minutes to 2 hours depending on the amount of air introduced during stirring. For best curing results, glassware and glass or metal stirring implements should be used. Mix with a smooth action that does not introduce excess air.

    4. Curing

      Thoroughly mixed Dow silicone encapsulant may be poured/dispensed directly into the container in which it is to be cured. Care should be taken to minimize air entrapment. When practical, pouring/dispensing should be done under vacuum, particularly if the component being potted or encapsulated has many small voids. If this technique cannot be used, the unit should be evacuated after the silicone encapsulant has been poured/dispensed. Dow silicone encapsulants may be either room temperature (25°C/77°F) or heat cured. Room temperature cure encapsulants may also be heat accelerated for faster cure. Ideal cure conditions for each product are given in the product selection table. Two-part condensation cure encapsulants should not be heat accelerated above 60°C (140°F).

    5. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

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    *See Terms of Use Below

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Viscosity Test Methods
Viscosity Test Method
4,575 cPs These values are not intended for use in preparing specifications.
Flowable
Work / Pot Time Test Methods
Work / Pot Time Temperature
Long
480 min 25°C
Tensile Strength Test Methods
Tensile Strength Test Time
1,105 psi These values are not intended for use in preparing specifications.
Tear Strength Test Methods
Tear Strength Test Method
25 (ppi) Die B, These values are not intended for use in preparing specifications.
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.65 At 100 Hz, These values are not intended for use in preparing specifications.
2.65 At 100 kHz, These values are not intended for use in preparing specifications.
Dielectric Strength Test Methods
Dielectric Strength Test Method
Good
Durable
475 V/mil These values are not intended for use in preparing specifications.
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00050 At 100 hz, These values are not intended for use in preparing specifications.
0.00050 At 100 kHz, These values are not intended for use in preparing specifications.
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
0.48 W/m°K These values are not intended for use in preparing specifications.
Volume Resistivity Test Methods
Volume Resistivity Test Method
1.61 E+15 (ohm*cm) These values are not intended for use in preparing specifications.
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
51 Durometer, These values are not intended for use in preparing specifications.
Elongation Test Methods
Elongation Test Method
105 % These values are not intended for use in preparing specifications.
Modulus Test Methods
Modulus Test Method
1,050 psi Tensile Modulus, These values are not intended for use in preparing specifications.
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
325 (ppm/°C) Linear CTE (by TMA), These values are not intended for use in preparing specifications.
Specific Gravity Test Methods
Specific Gravity Test Method
1.030 Cured, These values are not intended for use in preparing specifications.
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) Test Method
1.4100 These values are not intended for use in preparing specifications.