Dow Sylgard 184 Silicone Elastomer Datasheet Dow Sylgard 184 Silicone Elastomer

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  • Description for Dow Sylgard 184 Silicone Elastomer

    Two part; 10:1 mix; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; deep section cure; repairable; good dielectric properties; flexible elastomer.

    *See Terms of Use Below

    Brand Sylgard
    Chemical Resistance Good
    Application Type Adhesive, Pot , Encapsulate
    1 Part or 2 Part 2 Part
    Material Form Liquid, Silicone elastomer
    Industry Relays, Solar cells, Sensors, Transformers, Connectors, Amplifiers, Smart Meters, High voltage resistor packs, E-Mobility Solutions, Smart Home Devices, Electronics, Lead integrated circuit
    Manufacturer Dow
    Chemistry Silicone, Solvent-free, Silicone elastomer
    Cure Method Base/Curing Agent, Heat, Room Temperature Cure
    Cure Temperature (°C) 20 to 25, 100, 125, 150
    Viscosity (cPs) 3,500, Flowable
    Color Colorless
    Ozone Resistance Ozone resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Light Refractive Index (RI) Good, 1.4118, 1.4225, 1.4028, 1.3997
    Key Specifications Mil-Spec (United States Military Standard): I-81550C: MIL-I-81550C, Type II, QPL, UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-1

  • Technical Data for Dow Sylgard 184 Silicone Elastomer

    *See Terms of Use Below

    Overview
    • Chemical Resistance
      • Chemical Resistance - Good
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
      • Part A Name - Base
      • Part B Name - Curing Agent
    • Material Form
      • Elastomer - Silicone elastomer
      • Liquid
    • Industry
      • Smart Meters
      • Smart Home Devices
      • E-Mobility Solutions
      • Electronics - Lead integrated circuit, Relays
      • Solar Energy - Solar cells
      • Sensors
      • Transformers
      • Connectors
      • Amplifiers
      • Voltage Resistors - High voltage resistor packs
      • Power Supplies
      • Industrial - Industrial controls
    • Chemistry
    • Application Method
      • Dispenser - Automated mixing, Dispensing equipment, Manual mixing
    • Cure Method
      • Room Temperature / Air Dry - Room Temperature Cure
      • Heat
      • 2-Part Cure - Base/Curing Agent
    • Color
      • Clear / Transparent - Colorless
    • Key Specifications
      • Mil-Spec (United States Military Standard): I-81550C: Type II, QPL - MIL-I-81550C, Type II, QPL
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: V-1 - UL 94 V-1
    • Brand
      • Sylgard
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25, 100, 125, 150 Test Method
    Viscosity (cPs) 3,500, Flowable
    Linear Shrinkage (%) Minimal shrinkage
    Mix Ratio 10:1 (by volume), 10:1 (by weight)
    Bond Strength
    Tensile Strength (psi) 980
    Material Resistance
    Ozone Resistance Ozone resistance
    UV Resistance UV resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00257, 0.00133 Test Method
    Dielectric Strength (V/mil) Good, Durable
    Dielectric Constant 2.72, 2.68 Test Method
    Thermal Conductivity (W/m°K) 0.27
    Volume Resistivity (O) 2.9e14(ohms/cm)
    Hardness
    Shore D Hardness 43 Test Method
    Flexibility Flexible
    Other Properties
    Light Refractive Index (RI) Good, 1.4118, 1.4225, 1.4028, 1.3997 Test Method
    Specific Gravity 1.030
    Coefficient of Thermal Expansion (CTE) 340 (Linear (micron/m °C or ppm ))
    Flash Point (°F) 213.8
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label. Refer to the product label for storage temperature requirements.
    Shelf Life Temperature (°F) 77
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 24
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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confrm adequate cure for your application, For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.
100°C These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confrm adequate cure for your application, For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.
125°C These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confrm adequate cure for your application, For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.
150°C These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confrm adequate cure for your application, For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.
Cure Time Test Methods
Cure Time Test Method
Work / Pot Time Test Methods
Work / Pot Time Temperature
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.72 Dielectric constant, 100 Hz
2.68 Dielectric constant, 100 KHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00257 Dissipation factor, 100 Hz
0.00133 Dissipation factor, 100 KHz
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
43 Durometer
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) Test Method
Good
1.4118 @ 589 nm
1.4225 @ 632.8 nm
1.4028 @1321 nm
1.3997 @ 1554 nm