Dow Sylgard 186 Silicone Elastomer

Dow Sylgard 186 Silicone Elastomer Datasheet
  • Description for Dow Sylgard 186 Silicone Elastomer

    Two part; 10:1 mix; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; deep section cure; repairable; good dielectric properties; flexible elastomer.

    *See Terms of Use Below

    Brand Sylgard
    Application Type Bond, Pot, Encapsulate
    1 Part or 2 Part 2 Part
    Material Form Liquid, Silicone elastomer
    Industry Amplifiers, Connectors, Relays, High voltage resistor packs, Sensors, Transformers, Solar cells, E-Mobility Solutions, Smart Meters, Smart Home Devices, Electronics, Lead integrated circuit
    Manufacturer Dow
    Chemistry Silicone elastomer, Solvent-free
    Cure Method 2-Part Cure, Heat
    Cure Temperature (°C) 100, 125, 150
    Cure Time (min) 25, 15, 15
    Viscosity (cPs) 66,700, High
    Color Translucent
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94 HB
  • Technical Data for Dow Sylgard 186 Silicone Elastomer

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Elastomer - Silicone elastomer
      • Liquid
    • Industry
      • E-Mobility Solutions
      • Electronics - Lead integrated circuit, Relays
      • Solar Energy - Solar cells
      • Amplifiers
      • Connectors
      • Voltage Resistors - High voltage resistor packs
      • Sensors
      • Transformers
      • Smart Meters
      • Smart Home Devices
      • Power Supplies
      • Industrial - Industrial controls
    • Chemistry
    • Application Method
      • Dispenser - Automated metered mixing, Dispensing equipment, Manual mixing
    • Cure Method
      • Heat
      • 2-Part Cure
    • Color
      • Translucent
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94 HB
    • Brand
      • Sylgard
    Specifications
    Cure Specs
    Cure Temperature (°C) 100, 125, 150 Test Method
    Cure Time (min) 25, 15, 15 Test Method
    Viscosity (cPs) 66,700, High Test Method
    Linear Shrinkage (%) Minimal shrinkage
    Work / Pot Time (min) 99 Test Method
    Mix Ratio 10:1 (by volume)
    Bond Strength
    Tear Strength (piw) High, 100 (ppi) Test Method
    Tensile Strength (psi) 305
    Material Resistance
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    UV Resistance UV resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00002, 0.00006 Test Method
    Dielectric Strength (V/mil) Good, Durable, 450
    Dielectric Constant 2.70, 2.68 Test Method
    Thermal Conductivity (W/m°K) 0.20
    Volume Resistivity (O) 4.98 E+15 (ohms/cm)
    Hardness
    Shore A Hardness 24
    Elongation (%) 255
    Flexibility Flexible
    Other Properties
    Specific Gravity 1.120 Test Method
    Coefficient of Thermal Expansion (CTE) 330 (Linear (micron/m °C or ppm ))
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning silicone encapsulants should be stored at or below 25°C (77°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen.
    Shelf Life Temperature (°F) 77
    Shelf Life (mon) 12
  • Best Practices for Dow Sylgard 186 Silicone Elastomer

    *See Terms of Use Below

    1. Surface Preparation

      In applications requiring adhesion, priming will be required for the silicone encapsulants. See the Primer Selection Guide or the correct primer to use with a given product. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly air dried prior to application of the silicone elastomer. Additional instructions for primer usage can be found in the Dow Corning literature, “How To Use Dow Corning Primers and Adhesion Promoters” (Form No. 10-366) and in the information sheets specific to the individual primers.

    2. Mixing

      Dow Corning® silicone encapsulants are supplied as two-part liquid component kits. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electronic applications. The 10:1 mix ratio gives one latitude to tune the modulus and hardness for specific application needs and production lines. Dow Corning silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. Dow Corning silicone elastomers require no post cure and can be placed in service immediately following the completion of the cure schedule. Standard silicone encapsulants require a surface treatment with a primer in addition to good cleaning for adhesion while primerless silicone encapsulants require only good cleaning.

    3. Deairing/Degassing

      Dow Corning® silicone encapsulants are supplied as two-part liquid component kits. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electronic applications. The 10:1 mix ratio gives one latitude to tune the modulus and hardness for specific application needs and production lines. Dow Corning silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. Dow Corning silicone elastomers require no post cure and can be placed in service immediately following the completion of the cure schedule. Standard silicone encapsulants require a surface treatment with a primer in addition to good cleaning for adhesion while primerless silicone encapsulants require only good cleaning.

    4. Curing

      Thoroughly mixed Dow Corning silicone encapsulant may be poured/dispensed directly into the container in which it is to be cured. Care should be taken to minimize air entrapment. When practical, pouring/dispensing should be done under vacuum, particularly if the component being potted or encapsulated has many small voids. If this technique cannot be used, the unit should be evacuated after the silicone encapsulant has been poured/dispensed. Dow Corning silicone encapsulants may be either room temperature (25°C/77°F) or heat cured. Room temperature cure encapsulants may also be heat accelerated for faster cure. Ideal cure conditions for each product are given in the product selection table. Twopart condensation cure encapsulants should not be heat accelerated above 60°C (140°F).

    5. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
100°C Heat Cure
125°C Heat Cure
150°C Heat Cure
Cure Time Test Methods
Cure Time Test Method
25 min Heat Cure
15 min Heat Cure
15 min Heat Cure
Viscosity Test Methods
Viscosity Test Method
66,700 cPs Mixed
High
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
99 min Pot Life 25°C
Tear Strength Test Methods
Tear Strength Test Method
High
100 (ppi) Die B
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.70 At 100 Hz
2.68 At 100 kHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00002 At 100 hz
0.00006 At 100 kHz
Specific Gravity Test Methods
Specific Gravity Test Method
1.120 Cured