Application Type Bond 1 Part or 2 Part 1 Part Material Form Liquid, Silicone elastomer Substrate Al Industry Heat sinks, ICs, Ink Jet Printer heads Manufacturer Dupont Chemistry Silicone elastomer Cure Method Heat Cure Temperature (°C) 150 Cure Time (min) 30 Viscosity (cPs) 66,000 Color Gray Ozone Resistance Ozone resistance Chemical Resistance Good High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55
Technical Data for Dupont SE 4450 Thermally ConDuctive Adhesive
Cure Temperature (°C) 150 Cure Time (min) 30 Viscosity (cPs) 66,000
Shear Strength (psi) 500 Test Method Tensile Strength (psi) 965, High
Ozone Resistance Ozone resistance Chemical Resistance Good UV Resistance UV resistance Environmental Resistance Environmental resistance High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance Moisture/humidity resistance
Dissipation Factor 0.00300 Test Method Dielectric Strength (V/mil) Durable, 610 Dielectric Constant 0.01 Test Method Thermal Conductivity (W/m°K) Outstanding, 1.92 Volume Resistivity (O) 3.3E15 (ohms/cm)
Shore A Hardness 95 Test Method Elongation (%) 46 Flexibility Flexible
Specific Gravity 2.730 Test Method
Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers. Shelf Life Temperature (°F) <39 Shelf Life (mon) 6
Not Good For
Don't Use With Non-reactive metal substrates, Non-reactive plastic surfaces, Teflon, Polyethylene, Polypropylene
Best Practices for Dupont SE 4450 Thermally ConDuctive Adhesive
All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.
The one-part moisture-cure adhesives are generally cured at room temperature and in a range of 20 to 80 percent relative humidity. Greater than 90 percent of their full physical properties should be attained within 24 to 72 hours depending on the product chosen. These materials are not typically used for highly confined or deep section cures. Materials will generally cure about 0.25 inch (6.35 mm) per 7 days. Addition-cure adhesives should be cured at 100ºC (212ºF) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). Thin sections of less than 2 mils may be cured in 15 minutes at 150ºC (302ºF). For thicker sections, a pre-cure at 70ºC (158ºF) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70ºC (158ºF) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These adhesives generally have long working times.
To ensure maximum bond strength for adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.
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Shear Strength Test Methods
|500 psi||Lap shear strength||AL|
Dielectric Constant Test Methods
|Dielectric Constant||Test Method|
|0.01||Dielectric Constant at 1 MHz|
Dissipation Factor Test Methods
|Dissipation Factor||Test Method|
|0.00300||Dissipation Factor at 1 MHz|
Shore A Hardness Test Methods
|Shore A Hardness||Shore Hardness Test Method|
Specific Gravity Test Methods
|Specific Gravity||Test Method|