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Description for Elantas (Altana) Conapoxy AD-10
A one-component, 100% solids, elevated temperature cure epoxy adhesive system and miniature electronic potting compound ideal for electrical applications.Brand Cytec, Conapoxy Chemical Resistance Resistant to many bases, Chemical Resistance: Resistant to many acids Application Type Bond, Potting, Sealing 1 Part or 2 Part 1-Part Material Form Paste Substrate Aluminum, Ceramics, Metal, Plastics Industry Miniature electronic potting compound, Magnet assemblies, Filters, Electrical applications, Batteries Manufacturer Elantas (Altana) Chemistry Epoxy Cure Method Heat cure, Elevated temperature cure Cure Temperature (°C) 93, 107, 121, 135, 149, 163, 204 Cure Time (min) 120 to 150, 65 to 80, 30 to 40, 12 to 20, 8 to 12, 5.00 to 8, 2.00 to 4.00 Viscosity (cPs) Non-flow Color Brown High Temperature Resistance (°C) 150 Low Temperature Resistance (°C) -55 Key Specifications Complies with Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 (RoHS 2.0) -
Technical Data for Elantas (Altana) Conapoxy AD-10
Overview
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Chemical Resistance
- Chemical Resistance - Resistant to many bases
- Chemical Resistance : Acid Resistance - Resistant to many acids
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Application Type
- Fixture/Stake - Staking
- Adhesive - Bond
- Pottant / Encapsulant - Potting
- Sealant - Sealing
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1 Part or 2 Part
- 1-Part
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Material Form
- Paste
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Industry
- Electronics - Miniature electronic potting compound, Batteries, Electrical applications
- Speakers - Speaker assemblies
- Magnet - Magnet assemblies
- Filters
- Other - End cap filling, Structural materials, Miniature potting , Miniature staking
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Chemistry
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Cure Method
- Heat - Heat cure, Elevated temperature cure
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Color
- Brown
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Key Specifications
- RoHS (Restriction of Hazardous Substances) - Complies with Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 (RoHS 2.0)
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Brand
- Conapoxy
- Cytec
Specifications
Cure Specs
Cure Temperature (°C) 93, 107, 121, 135, 149, 163, 204 Cure Time (min) 120 to 150, 65 to 80, 30 to 40, 12 to 20, 8 to 12, 5.00 to 8, 2.00 to 4.00 Viscosity (cPs) Non-flow Test Method Thixotropic Thixotropic Bond Strength
Structural/Load-Bearing Structural General Bond Strength (psi) High Shear Strength (psi) 3,000 Test Method Material Resistance
High Temperature Resistance (°C) 150 Test Method Low Temperature Resistance (°C) -55 Test Method Conductivity
Dissipation Factor 0.00600 Test Method Dielectric Strength (V/mil) Good dielectric properties, >375 Test Method Dielectric Constant 4.00 Test Method Hardness
Shore D Hardness 85 Test Method Other Properties
Specific Gravity 1.270 Test Method Flash Point (°F) >201.2 Test Method % Solids (%) 100 Business Information
Shelf Life Details Store in a cool, dry area. Storage conditions should not exceed 26°C (80ºF). Under these conditions storage life is expected to be at least four months. The shelf life may be extended up to eight months by storing at 5ºC (41°F)., Store in a cool, dry area. Storage conditions should not exceed 26°C (80ºF). Under these conditions storage life is expected to be at least four months. The shelf life may be extended up to eight months by storing at 5ºC (41°F)., Store at or below 25°C / 77°F in a dry controlled environment out of direct sunlight. This material should be suitable for use stored under these conditions in the original sealed containers for four (4) months from the date of shipment.; The shelf life for CONAPOXY® AD-10 may be extended when stored at or below 5°C / 41°F.; Failure to store the product as recommended above may lead to deterioration in product performance. Shelf Life Temperature (°F) 77, 41, <77 Shelf Life Type From the date of shipment Shelf Life (mon) 8, 4, 4 -
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Best Practices for Elantas (Altana) Conapoxy AD-10
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Surface Preparation
High-strength bonds can only be obtained if all surfaces to be bonded are free of moisture, dirt, rust, chemicals, and mold releases. In addition, surfaces to be bonded should be sandblasted, etched, or degreased.
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Application
For bonding, apply CONAPOXY® AD-10 by suitable means adjusting the glue line from 1 to 10 mils. Contact pressure is suitable for most bonding applications.
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Viscosity Test Methods
Viscosity | Test Method | Temperature |
---|---|---|
Non-flow | As Supplied | 25°C |
Shear Strength Test Methods
Shear Strength | Type | Cure Temperature | Substrate | Test Method |
---|---|---|---|---|
3,000 psi | Lap shear strength | 25°C | Aluminum / aluminum | ASTM D1002, The above properties are typical values and are not intended for specification use. |
High Temperature Resistance Test Methods
High Temperature Resistance | Test Method |
---|---|
150°C | Operating Temperature, The above properties are typical values and are not intended for specification use. |
Low Temperature Resistance Test Methods
Low Temperature Resistance | Test Method |
---|---|
-55°C | Operating Temperature, The above properties are typical values and are not intended for specification use. |
Dielectric Constant Test Methods
Dielectric Constant | Temperature | Test Method |
---|---|---|
4.00 | 25°C | 1 kHz, ASTM D150, The above properties are typical values and are not intended for specification use. |
Dielectric Strength Test Methods
Dielectric Strength | Temperature | Test Method |
---|---|---|
Good dielectric properties | 25°C | ASTM D149, The above properties are typical values and are not intended for specification use. |
>375 V/mil |
Dissipation Factor Test Methods
Dissipation Factor | Temperature | Test Method |
---|---|---|
0.00600 | 25°C | 1 kHz, ASTM D150, The above properties are typical values and are not intended for specification use. |
Shore D Hardness Test Methods
Shore D Hardness | Shore Hardness Test Method | Hardness Temperature |
---|---|---|
85 | ASTM D2240, The above properties are typical values and are not intended for specification use. | 25°C |
Flash Point Test Methods
Flash Point | Test Method |
---|---|
>201.2°F | ASTM D93, As Supplied |
Specific Gravity Test Methods
Specific Gravity | Temperature | Test Method |
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1.270 | 25°C | As Supplied |