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Description for Elantas (Altana) Easypoxy K-230
A two-component, 100% solids, room temperature cure epoxy adhesive system. General-purpose adhesive and repair compound for bonding of materials with widely different coefficients of thermal expansion.Brand Cytec, Easypoxy Application Type Bond, Repair 1 Part or 2 Part 2 Part Material Form Paste Substrate Etched aluminum , Glass, Metal, Plastic surfaces, Aluminum Industry General purpose Manufacturer Elantas (Altana) Chemistry Epoxy Application Method Spatula Cure Method Room temperature, Low heat cure Cure Temperature (°C) 25, 65 Cure Time (min) 1,440 to 2,160, 120 Viscosity (cPs) Non- flowing Color Neutral Fungus Resistance Non-nutrient Fungus Resistance Key Specifications comply with Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 (RoHS 2.0) as amended 31 March 2015 -
Comparable Materials for Elantas (Altana) Easypoxy K-230
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Loctite Ablestik 2902(Henkel)● Two components ● Electrically conductive ● Thermally conductive ● Solvent-free ● High adhesion ● Room temperature cure ● Good adhesion to a variety of substrates
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Underwater Repair Putty (UW)(Devcon (ITW))Makes (effective) repairs to metal, concrete, wood surfaces in wet and dry environments.
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Easypoxy K-20(Elantas (Altana))A two-component, 100%- solids, room temperature cure epoxy adhesive system, General-purpose adhesive and repair compound for metal, wood, rubber and most plastics.
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Linear Shrinkage Test Methods
| Linear Shrinkage | Test Method | Temp |
|---|---|---|
| 0.70 % | ASTM D2566 | 25°C |
Work / Pot Time Test Methods
| Work / Pot Time | Temperature |
|---|---|
| 60 min | 25°C |
Compressive Strength Test Methods
| Compressive Strength | Test Temperature | Test Method |
|---|---|---|
| 18,000 psi | 25°C | ASTM D695 |
Flexural Strength Test Methods
| Flexural Strength | Test Temperature | Test Method |
|---|---|---|
| 10,000 psi | 25°C | ASTM D790 |
Tensile Strength Test Methods
| Tensile Strength | Cure Temperature | Substrate | Test Method |
|---|---|---|---|
| 2,450 psi | 25°C | Etched AL/AL | |
| 1,360 psi | -55°C | Etched AL/AL | |
| 1,520 psi | 82°C | Etched AL/AL |
Shear Strength Test Methods
| Shear Strength | Type | Substrate | Test Temperature | Test Method |
|---|---|---|---|---|
| 1,400 psi | Lap Shear Strength | Etched aluminum / aluminum | -55°C | ASTM D1002 |
| 2,500 psi | Lap Shear Strength | Etched aluminum / aluminum | 25°C | ASTM D1002 |
| 1,500 psi | Lap Shear Strength | Etched aluminum / aluminum | 25°C | ASTM D1002 |
Fungus Resistance Test Methods
| Fungus Resistance | Test Method |
|---|---|
| Non-nutrient Fungus Resistance | ASTM G21 |
Dielectric Constant Test Methods
| Dielectric Constant | Temperature | Test Method |
|---|---|---|
| 4.60 | 25°C | 1 kHz, ASTM D150 |
Dissipation Factor Test Methods
| Dissipation Factor | Temperature | Test Method |
|---|---|---|
| 0.01000 | 25°C | 1 kHz, ASTM D150 |
Thermal Conductivity Test Methods
| Thermal Conductivity | Temperature | Test Method |
|---|---|---|
| 0.20 W/m°K | 25°C |
Volume Resistivity Test Methods
| Volume Resistivity | Temp (°C) | Test Method |
|---|---|---|
| 4.0e13 (ohm-cm) | 25°C | 1 kHz, ASTM D257 |
Shore D Hardness Test Methods
| Shore D Hardness | Shore Hardness Test Method | Hardness Temperature |
|---|---|---|
| 80 | ASTM D2240 | 25°C |
