Elantas (Altana) Easypoxy K-230 Datasheet Elantas (Altana) Easypoxy K-230

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  • Description for Elantas (Altana) Easypoxy K-230

    A two-component, 100% solids, room temperature cure epoxy adhesive system. General-purpose adhesive and repair compound for bonding of materials with widely different coefficients of thermal expansion.

    *See Terms of Use Below

    Brand Cytec, Easypoxy
    Application Type Bond, Repair
    1 Part or 2 Part 2 Part
    Material Form Paste
    Substrate Etched aluminum , Glass, Metal, Plastic surfaces, Aluminum
    Industry General purpose
    Manufacturer Elantas (Altana)
    Chemistry Epoxy
    Application Method Spatula
    Cure Method Room temperature, Low heat cure
    Cure Temperature (°C) 25, 65
    Cure Time (min) 1,440 to 2,160, 120
    Viscosity (cPs) Non- flowing
    Color Neutral
    Fungus Resistance Non-nutrient Fungus Resistance
    Key Specifications comply with Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 (RoHS 2.0) as amended 31 March 2015
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Linear Shrinkage Test Methods
Linear Shrinkage Test Method Temp
0.70 % ASTM D2566 25°C
Work / Pot Time Test Methods
Work / Pot Time Temperature
60 min 25°C
Compressive Strength Test Methods
Compressive Strength Test Temperature Test Method
18,000 psi 25°C ASTM D695
Flexural Strength Test Methods
Flexural Strength Test Temperature Test Method
10,000 psi 25°C ASTM D790
Tensile Strength Test Methods
Tensile Strength Cure Temperature Substrate Test Method
2,450 psi 25°C Etched AL/AL
1,360 psi -55°C Etched AL/AL
1,520 psi 82°C Etched AL/AL
Shear Strength Test Methods
Shear Strength Type Substrate Test Temperature Test Method
1,400 psi Lap Shear Strength Etched aluminum / aluminum -55°C ASTM D1002
2,500 psi Lap Shear Strength Etched aluminum / aluminum 25°C ASTM D1002
1,500 psi Lap Shear Strength Etched aluminum / aluminum 25°C ASTM D1002
Fungus Resistance Test Methods
Fungus Resistance Test Method
Non-nutrient Fungus Resistance ASTM G21
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
4.60 25°C 1 kHz, ASTM D150
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.01000 25°C 1 kHz, ASTM D150
Thermal Conductivity Test Methods
Thermal Conductivity Temperature Test Method
0.20 W/m°K 25°C
Volume Resistivity Test Methods
Volume Resistivity Temp (°C) Test Method
4.0e13 (ohm-cm) 25°C 1 kHz, ASTM D257
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method Hardness Temperature
80 ASTM D2240 25°C