Elantas (Altana) Easypoxy K-230 Datasheet Elantas (Altana) Easypoxy K-230

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  • Description for Elantas (Altana) Easypoxy K-230

    A two-component, 100% solids, room temperature cure epoxy adhesive system. General-purpose adhesive and repair compound for bonding of materials with widely different coefficients of thermal expansion.

    *See Terms of Use Below

    Brand Cytec, Easypoxy
    Application Type Bond, Repair
    1 Part or 2 Part 2-Part
    Material Form Paste
    Substrate Etched aluminum , Glass, Metal, Plastic surfaces, Aluminum
    Industry General purpose
    Manufacturer Elantas (Altana)
    Chemistry Epoxy
    Application Method Spatula
    Cure Method Low heat cure, Room temperature
    Cure Temperature (°C) 25, 65
    Cure Time (min) 1,440 to 2,160, 120
    Viscosity (cPs) Non- flowing
    Color Neutral
    Fungus Resistance Non-nutrient Fungus Resistance
    Volume Resistivity (O) 4.0e13 (ohm-cm)
    Key Specifications comply with Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 (RoHS 2.0) as amended 31 March 2015

  • Technical Data for Elantas (Altana) Easypoxy K-230

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Paste
    • Substrate
    • Industry
    • Chemistry
    • Application Method
      • Brush - Stiff brush
      • Spatula/Trowel - Spatula
    • Cure Method
      • Room Temperature / Air Dry - Room temperature
      • Heat - Low heat cure
    • Color
      • Other - Neutral
    • Key Specifications
      • RoHS (Restriction of Hazardous Substances) - comply with Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 (RoHS 2.0) as amended 31 March 2015
    • Brand
      • Easypoxy
      • Cytec
    Specifications
    Cure Specs
    Cure Temperature (°C) 25, 65
    Cure Time (min) 1,440 to 2,160, 120
    Viscosity (cPs) Non- flowing
    Linear Shrinkage (%) 0.70 Test Method
    Work / Pot Time (min) 60 Test Method
    Mix Ratio 100:45 (by weight)
    Bond Strength
    General Bond Strength (psi) High
    Shear Strength (psi) 1,400, 2,500, 1,500 Test Method
    Compressive Strength (psi) 18,000 Test Method
    Flexural Strength (psi) 10,000 Test Method
    Tensile Strength (psi) 2,450, 1,360, 1,520 Test Method
    Material Resistance
    Fungus Resistance Non-nutrient Fungus Resistance Test Method
    Conductivity
    Dissipation Factor 0.01000 Test Method
    Dielectric Strength (V/mil) Electrically insulating
    Dielectric Constant 4.60 Test Method
    Thermal Conductivity (W/m°K) 0.20 Test Method
    Volume Resistivity (O) 4.0e13 (ohm-cm) Test Method
    Hardness
    Shore D Hardness 80 Test Method
    Flexibility Semi-Flexible
    Other Properties
    % Solids (%) 100
    Business Information
    Shelf Life Details Store at or below 25°C / 77°F in a dry controlled environment out of direct sunlight. This material should be suitable for use stored under these conditions in the original sealed containers for twelve (12) months from the date of shipment. Failure to store the product as recommended above may lead to deterioration in product performance.
    Shelf Life Temperature (°F) 77
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 12

  • Best Practices for Elantas (Altana) Easypoxy K-230

    *See Terms of Use Below

    1. Surface Preparation

      High-strength bonds can only be obtained if all surfaces to be bonded are free of moisture, dirt, rust, chemicals, and mold releases. In addition, surfaces to be bonded should be sandblasted, etched, or degreased. See ELANTAS PDG Technical Bulletin TI-3000 Surface Preparation Guide for additional information.

    2. Application

      Apply adhesive with a spatula or stiff brush to both joining surfaces. Apply light pressure to ensure proper wetting and contact of bonded surfaces.

      If crystallization has occurred place the container in a 49 - 71°C / 120 - 160°F water bath until material is again pliable.

    3. Mixing

      Mix equal length beads of K-230 Part A Resin and K-230 Part B Curative from the tube kits or at 100:45 by weight until a uniform color is achieved.

    4. Curing

      Cure 24 - 36 hours at 25°C / 77°F – or – 2 hour at 65°C / 149°F The cure schedules above are based on time after the unit reaches the specified temperature and are recommendations only. The user is responsible for determining the optimum cure conditions for his application.

    5. Clean-Up

      Clean equipment before the adhesive hardens, a good hydrocarbon solvent is recommended

  • Comparable Materials for Elantas (Altana) Easypoxy K-230

    *See Terms of Use Below

    Spec Engine® Results

    • Elantas (Altana)
      Easypoxy K-45(Elantas (Altana))

      • Two-component • 100% solids • Room temperature or low heat cure • Epoxy adhesive system • High bond strength • Electrically insulating • Convenient mix ratio of 1:1 • Non-flowing paste.

    • Elantas (Altana)
      Easypoxy K-20(Elantas (Altana))

      A two-component, 100%- solids, room temperature cure epoxy adhesive system, General-purpose adhesive and repair compound for metal, wood, rubber and most plastics.

    • Compare All
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Linear Shrinkage Test Methods
Linear Shrinkage Test Method Temp
0.70 % ASTM D2566 25°C
Work / Pot Time Test Methods
Work / Pot Time Temperature
60 min 25°C
Compressive Strength Test Methods
Compressive Strength Test Temperature Test Method
18,000 psi 25°C ASTM D695
Flexural Strength Test Methods
Flexural Strength Test Temperature Test Method
10,000 psi 25°C ASTM D790
Tensile Strength Test Methods
Tensile Strength Cure Temperature Substrate Test Method
2,450 psi 25°C Etched AL/AL
1,360 psi -55°C Etched AL/AL
1,520 psi 82°C Etched AL/AL
Shear Strength Test Methods
Shear Strength Type Substrate Test Temperature Test Method
1,400 psi Lap Shear Strength Etched aluminum / aluminum -55°C ASTM D1002
2,500 psi Lap Shear Strength Etched aluminum / aluminum 25°C ASTM D1002
1,500 psi Lap Shear Strength Etched aluminum / aluminum 25°C ASTM D1002
Fungus Resistance Test Methods
Fungus Resistance Test Method
Non-nutrient Fungus Resistance ASTM G21
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
4.60 25°C 1 kHz, ASTM D150
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.01000 25°C 1 kHz, ASTM D150
Thermal Conductivity Test Methods
Thermal Conductivity Temperature Test Method
0.20 W/m°K 25°C
Volume Resistivity Test Methods
Volume Resistivity Temp (°C) Test Method
4.0e13 (ohm-cm) 25°C 1 kHz, ASTM D257
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method Hardness Temperature
80 ASTM D2240 25°C