

-
Description for Elantas (Altana) Easypoxy K-230
A two-component, 100% solids, room temperature cure epoxy adhesive system. General-purpose adhesive and repair compound for bonding of materials with widely different coefficients of thermal expansion.Brand Cytec, Easypoxy Application Type Bond, Repair 1 Part or 2 Part 2-Part Material Form Paste Substrate Etched aluminum , Glass, Metal, Plastic surfaces, Aluminum Industry General purpose Manufacturer Elantas (Altana) Chemistry Epoxy Application Method Spatula Cure Method Low heat cure, Room temperature Cure Temperature (°C) 25, 65 Cure Time (min) 1,440 to 2,160, 120 Viscosity (cPs) Non- flowing Color Neutral Fungus Resistance Non-nutrient Fungus Resistance Volume Resistivity (O) 4.0e13 (ohm-cm) Key Specifications comply with Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 (RoHS 2.0) as amended 31 March 2015 -
Technical Data for Elantas (Altana) Easypoxy K-230
Overview
-
Application Type
- Adhesive - Bond
- Repair & Maintenance - Repair
-
1 Part or 2 Part
- 2-Part
-
Material Form
- Paste
-
Industry
- Industrial
- General Purpose
-
Chemistry
-
Application Method
- Brush - Stiff brush
- Spatula/Trowel - Spatula
-
Cure Method
- Room Temperature / Air Dry - Room temperature
- Heat - Low heat cure
-
Color
- Other - Neutral
-
Key Specifications
- RoHS (Restriction of Hazardous Substances) - comply with Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 (RoHS 2.0) as amended 31 March 2015
-
Brand
- Easypoxy
- Cytec
Specifications
Cure Specs
Cure Temperature (°C) 25, 65 Cure Time (min) 1,440 to 2,160, 120 Viscosity (cPs) Non- flowing Linear Shrinkage (%) 0.70 Test Method Work / Pot Time (min) 60 Test Method Mix Ratio 100:45 (by weight) Bond Strength
General Bond Strength (psi) High Shear Strength (psi) 1,400, 2,500, 1,500 Test Method Compressive Strength (psi) 18,000 Test Method Flexural Strength (psi) 10,000 Test Method Tensile Strength (psi) 2,450, 1,360, 1,520 Test Method Material Resistance
Fungus Resistance Non-nutrient Fungus Resistance Test Method Conductivity
Dissipation Factor 0.01000 Test Method Dielectric Strength (V/mil) Electrically insulating Dielectric Constant 4.60 Test Method Thermal Conductivity (W/m°K) 0.20 Test Method Volume Resistivity (O) 4.0e13 (ohm-cm) Test Method Hardness
Shore D Hardness 80 Test Method Flexibility Semi-Flexible Other Properties
% Solids (%) 100 Business Information
Shelf Life Details Store at or below 25°C / 77°F in a dry controlled environment out of direct sunlight. This material should be suitable for use stored under these conditions in the original sealed containers for twelve (12) months from the date of shipment. Failure to store the product as recommended above may lead to deterioration in product performance. Shelf Life Temperature (°F) 77 Shelf Life Type From date of manufacture Shelf Life (mon) 12 -
-
Best Practices for Elantas (Altana) Easypoxy K-230
-
Surface Preparation
High-strength bonds can only be obtained if all surfaces to be bonded are free of moisture, dirt, rust, chemicals, and mold releases. In addition, surfaces to be bonded should be sandblasted, etched, or degreased. See ELANTAS PDG Technical Bulletin TI-3000 Surface Preparation Guide for additional information.
-
Application
Apply adhesive with a spatula or stiff brush to both joining surfaces. Apply light pressure to ensure proper wetting and contact of bonded surfaces.
If crystallization has occurred place the container in a 49 - 71°C / 120 - 160°F water bath until material is again pliable.
-
Mixing
Mix equal length beads of K-230 Part A Resin and K-230 Part B Curative from the tube kits or at 100:45 by weight until a uniform color is achieved.
-
Curing
Cure 24 - 36 hours at 25°C / 77°F – or – 2 hour at 65°C / 149°F The cure schedules above are based on time after the unit reaches the specified temperature and are recommendations only. The user is responsible for determining the optimum cure conditions for his application.
-
Clean-Up
Clean equipment before the adhesive hardens, a good hydrocarbon solvent is recommended
-
-
Comparable Materials for Elantas (Altana) Easypoxy K-230
Spec Engine® Results
Popular Articles
Epoxy Adhesives for Medical Devices
Read ArticleElectrically Conductive Adhesives
Read ArticleInfographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation
Read ArticleTesting the effectiveness of surface treatments
Read ArticleSponsored Articles
Unique Advantages of Contact Adhesives
Read ArticleUsing LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials
Read ArticleSylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:
Read ArticleCase Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive
Read ArticleFeatured Ads

Linear Shrinkage Test Methods
Linear Shrinkage | Test Method | Temp |
---|---|---|
0.70 % | ASTM D2566 | 25°C |
Work / Pot Time Test Methods
Work / Pot Time | Temperature |
---|---|
60 min | 25°C |
Compressive Strength Test Methods
Compressive Strength | Test Temperature | Test Method |
---|---|---|
18,000 psi | 25°C | ASTM D695 |
Flexural Strength Test Methods
Flexural Strength | Test Temperature | Test Method |
---|---|---|
10,000 psi | 25°C | ASTM D790 |
Tensile Strength Test Methods
Tensile Strength | Cure Temperature | Substrate | Test Method |
---|---|---|---|
2,450 psi | 25°C | Etched AL/AL | |
1,360 psi | -55°C | Etched AL/AL | |
1,520 psi | 82°C | Etched AL/AL |
Shear Strength Test Methods
Shear Strength | Type | Substrate | Test Temperature | Test Method |
---|---|---|---|---|
1,400 psi | Lap Shear Strength | Etched aluminum / aluminum | -55°C | ASTM D1002 |
2,500 psi | Lap Shear Strength | Etched aluminum / aluminum | 25°C | ASTM D1002 |
1,500 psi | Lap Shear Strength | Etched aluminum / aluminum | 25°C | ASTM D1002 |
Fungus Resistance Test Methods
Fungus Resistance | Test Method |
---|---|
Non-nutrient Fungus Resistance | ASTM G21 |
Dielectric Constant Test Methods
Dielectric Constant | Temperature | Test Method |
---|---|---|
4.60 | 25°C | 1 kHz, ASTM D150 |
Dissipation Factor Test Methods
Dissipation Factor | Temperature | Test Method |
---|---|---|
0.01000 | 25°C | 1 kHz, ASTM D150 |
Thermal Conductivity Test Methods
Thermal Conductivity | Temperature | Test Method |
---|---|---|
0.20 W/m°K | 25°C |
Volume Resistivity Test Methods
Volume Resistivity | Temp (°C) | Test Method |
---|---|---|
4.0e13 (ohm-cm) | 25°C | 1 kHz, ASTM D257 |
Shore D Hardness Test Methods
Shore D Hardness | Shore Hardness Test Method | Hardness Temperature |
---|---|---|
80 | ASTM D2240 | 25°C |