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Description for Elantas (Altana) Easypoxy K-230
A two-component, 100% solids, room temperature cure epoxy adhesive system. General-purpose adhesive and repair compound for bonding of materials with widely different coefficients of thermal expansion.Brand Cytec, Easypoxy Application Type Bond, Repair 1 Part or 2 Part 2 Part Material Form Paste Substrate Etched aluminum , Glass, Metal, Plastic surfaces, Aluminum Industry General purpose Manufacturer Elantas (Altana) Chemistry Epoxy Application Method Spatula Cure Method Room temperature, Low heat cure Cure Temperature (°C) 25, 65 Cure Time (min) 1,440 to 2,160, 120 Viscosity (cPs) Non- flowing Color Neutral Fungus Resistance Non-nutrient Fungus Resistance Key Specifications comply with Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 (RoHS 2.0) as amended 31 March 2015 -
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Linear Shrinkage Test Methods
Linear Shrinkage | Test Method | Temp |
---|---|---|
0.70 % | ASTM D2566 | 25°C |
Work / Pot Time Test Methods
Work / Pot Time | Temperature |
---|---|
60 min | 25°C |
Compressive Strength Test Methods
Compressive Strength | Test Temperature | Test Method |
---|---|---|
18,000 psi | 25°C | ASTM D695 |
Flexural Strength Test Methods
Flexural Strength | Test Temperature | Test Method |
---|---|---|
10,000 psi | 25°C | ASTM D790 |
Tensile Strength Test Methods
Tensile Strength | Cure Temperature | Substrate | Test Method |
---|---|---|---|
2,450 psi | 25°C | Etched AL/AL | |
1,360 psi | -55°C | Etched AL/AL | |
1,520 psi | 82°C | Etched AL/AL |
Shear Strength Test Methods
Shear Strength | Type | Substrate | Test Temperature | Test Method |
---|---|---|---|---|
1,400 psi | Lap Shear Strength | Etched aluminum / aluminum | -55°C | ASTM D1002 |
2,500 psi | Lap Shear Strength | Etched aluminum / aluminum | 25°C | ASTM D1002 |
1,500 psi | Lap Shear Strength | Etched aluminum / aluminum | 25°C | ASTM D1002 |
Fungus Resistance Test Methods
Fungus Resistance | Test Method |
---|---|
Non-nutrient Fungus Resistance | ASTM G21 |
Dielectric Constant Test Methods
Dielectric Constant | Temperature | Test Method |
---|---|---|
4.60 | 25°C | 1 kHz, ASTM D150 |
Dissipation Factor Test Methods
Dissipation Factor | Temperature | Test Method |
---|---|---|
0.01000 | 25°C | 1 kHz, ASTM D150 |
Thermal Conductivity Test Methods
Thermal Conductivity | Temperature | Test Method |
---|---|---|
0.20 W/m°K | 25°C |
Volume Resistivity Test Methods
Volume Resistivity | Temp (°C) | Test Method |
---|---|---|
4.0e13 (ohm-cm) | 25°C | 1 kHz, ASTM D257 |
Shore D Hardness Test Methods
Shore D Hardness | Shore Hardness Test Method | Hardness Temperature |
---|---|---|
80 | ASTM D2240 | 25°C |