Elantas (Altana) K-20

Elantas (Altana) K-20 Datasheet
  • Description for Elantas (Altana) K-20

    General purpose, two-component, room temperature curing adhesive/sealants that bond a great variety of surfaces. They are relatively insensitive to mixing ratios.

    *See Terms of Use Below

    Application Type Bond, Repair, Seal
    1 Part or 2 Part 2 Part
    Material Form Paste
    Substrate Metal, Plastics, Rubber, Wood, Etched AL
    Industry Industrial: General purpose
    Manufacturer Elantas (Altana)
    Chemistry Solventless
    Application Method Spatula
    Cure Method Part A/Part B
    Cure Temperature (°C) 20 to 25, 25, 65
    Cure Time (min) 1,440, 120
    Color Black, Clear
    Fungus Resistance Fungus Resistance
  • Technical Data

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  • Best Practices

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Work / Pot Time Test Methods
Work / Pot Time Temperature
20 min 25°C
Tensile Strength Test Methods
Tensile Strength Substrate Test Temperature
2,500 psi Etched AL/AL 25°C
1,600 psi Etched AL/AL -55°C
2,300 psi Etched AL/AL 82°C
3,000 psi
Shear Strength Test Methods
Shear Strength Type Substrate Test Temperature
2,500 psi Lap shear strength Etched AL/AL 25°C
1,600 psi Lap shear strength Etched AL/AL -55°C
2,300 psi Lap shear strength Etched AL/AL 82°C
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
4.60 25°C Dielectric constant, 1 KHz
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.01200 25°C Dissipation factor, 1 KHz
Volume Resistivity Test Methods
Volume Resistivity Temp (°C)
4.0e13 (ohm-cm) 25°C