Elantas (Altana) K-22

Elantas (Altana) K-22 Datasheet
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  • Description for Elantas (Altana) K-22

    General purpose, two-component, room temperature curing adhesive/sealants that bond a great variety of surfaces. It is relatively insensitive to mixing ratios.

    *See Terms of Use Below

    Brand Cytec
    Application Type Bond, Repair, Seal
    1 Part or 2 Part 2 Part
    Material Form Paste
    Substrate Metal, Plastics, rubber, wood, Etched AL
    Industry General purpose
    Manufacturer Elantas (Altana)
    Chemistry Solventless
    Application Method Spatula
    Cure Method Part A/Part B
    Cure Temperature (°C) 20 to 25, 25, 65
    Cure Time (min) 1,440, 120
    Color Black, Clear
    Fungus Resistance Fungus Resistance

  • Technical Data for Elantas (Altana) K-22

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Paste
    • Substrate
    • Industry
    • Chemistry
    • Application Method
      • Brush - Stiff brush
      • Spatula/Trowel - Spatula
    • Cure Method
      • 2-Part Cure - Part A/Part B
    • Color
      • Black
      • Clear / Transparent - Clear
    • Brand
      • Cytec
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25, 25, 65
    Cure Time (min) 1,440, 120
    Linear Shrinkage (%) 0.70
    Work / Pot Time (min) 20 Test Method
    Mix Ratio 100:45 (by weight)
    Bond Strength
    General Bond Strength (psi) High
    Shear Strength (psi) 2,500, 1,600, 2,300 Test Method
    Compressive Strength (psi) 10,000
    Flexural Strength (psi) 6,000
    Tensile Strength (psi) 2,500, 1,600, 2,300, 3,000 Test Method
    Material Resistance
    Fungus Resistance Fungus Resistance
    Conductivity
    Dissipation Factor 0.01200 Test Method
    Dielectric Constant 4.60 Test Method
    Thermal Conductivity (W/m°K) 5.7 (cal/sec/cm2/°C/cm x 10-4)
    Volume Resistivity (O) 4.0e13 (ohm-cm) Test Method
    Hardness
    Shore D Hardness 85
    Other Properties
    % Solids (%) 100
    Business Information
    Shelf Life Details Recommended storage temperature is 65º-85ºF. If material is crystallized on opening, heat in oven at 120ºF for 40-60 minutes.;EASYPOXY® K-20 and K-22, Parts A and B, have a shelf life of 18 months from date of manufacture when stored in their original, unopened containers at 20ºC-30ºC (65º-85ºF).
    Shelf Life Temperature (°F) 65 to 85
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 18

  • Best Practices for Elantas (Altana) K-22

    *See Terms of Use Below

    1. Surface Preparation

      Apply to dry oil-free surfaces. Remove mold release from plastic surface. When bonding to metals, degrease and dry. Chemical etching of the metal surface gives optimum results.

    2. Application

      Apply adhesive with spatula or stiff brush to each surface. Apply light pressure to ensure good wetting and contact of the bonded surfaces.

    3. Curing

      Pot life of mixture is 20 minutes at 25°C. Cure is achieved in 24 hours at 25°C. Cure can be accelerated with heating at 65°C for 2 hours

    4. Clean-Up

      Clean equipment before the adhesive hardens

      a good hydrocarbon solvent is recommended.

  • Comparable Materials for Elantas (Altana) K-22

    *See Terms of Use Below

    Spec Engine® Results

    • Henkel
      BA-2902(Henkel)

      • Two component - requires mixing • Room Temperature or Heat Cure • Electrically conductive • Thermally conductive • Solvent-free • High adhesion • Two component • Room temperature cure • Good adhesion to a variety of substrates

    • Elantas (Altana)
      K-20(Elantas (Altana))

      General purpose, two-component, room temperature curing adhesive/sealants that bond a great variety of surfaces. They are relatively insensitive to mixing ratios.

    • Henkel
      916H03(Henkel)

      Recommended for electronic bonding and sealing application that require the combination of high conductivity coupled with good mechanical properties.

    • Compare All
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Work / Pot Time Test Methods
Work / Pot Time Temperature
20 min 25°C
Tensile Strength Test Methods
Tensile Strength Substrate Test Temperature
2,500 psi Etched AL/AL 25°C
1,600 psi Etched AL/AL -55°C
2,300 psi Etched AL/AL 82°C
3,000 psi
Shear Strength Test Methods
Shear Strength Type Substrate Test Temperature
2,500 psi Lap Shear strength Etched AL/AL 25°C
1,600 psi Lap Shear strength Etched AL/AL -55°C
2,300 psi Lap Shear strength Etched AL/AL 82°C
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
4.60 25°C Dielectric.constant, 1 KHz
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.01200 25°C Dissipation Factor, 1 KHz
Volume Resistivity Test Methods
Volume Resistivity Temp (°C)
4.0e13 (ohm-cm) 25°C
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