Elantas (Altana) K-230

Elantas (Altana) K-230 Datasheet
  • Description for Elantas (Altana) K-230

    A two-component, 100% solids system, which is used in thin films to bond glass. This adhesive is recommended for bonding substrates with widely different coefficients of expansion because of its cured resiliency.

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Paste
    Substrate Glass, Metal, Plastic surfaces, Etched AL
    Manufacturer Elantas (Altana)
    Chemistry Epoxy Resins
    Application Method Spatula
    Cure Method Part A/Part B
    Cure Temperature (°C) 25, 65
    Cure Time (min) 1,440 to 2,160, 120
    Color Clear
    Fungus Resistance Fungus Resistance
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Work / Pot Time Test Methods
Work / Pot Time Temperature
60 min 25°C
Tensile Strength Test Methods
Tensile Strength Cure Temperature Substrate
2,450 psi 25°C Etched AL/AL
1,360 psi -55°C Etched AL/AL
1,520 psi 82°C Etched AL/AL
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
4.60 25°C Dielectric constant, 1 KHz
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.01200 25°C Dissipation Factor, 1 KHz
Volume Resistivity Test Methods
Volume Resistivity Temp (°C)
4.0e13 (ohm-cm) 25°C