Elantas (Altana) K-230

Elantas (Altana) K-230 Datasheet
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  • Description for Elantas (Altana) K-230

    A two-component, 100% solids system, which is used in thin films to bond glass. This adhesive is recommended for bonding substrates with widely different coefficients of expansion because of its cured resiliency.

    *See Terms of Use Below

    Brand Cytec
    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Paste
    Substrate Glass, Metal, Plastic surfaces, Etched AL
    Manufacturer Elantas (Altana)
    Chemistry Epoxy Resins
    Application Method Spatula
    Cure Method Part A/Part B
    Cure Temperature (°C) 25, 65
    Cure Time (min) 1,440 to 2,160, 120
    Color Clear
    Fungus Resistance Fungus Resistance

  • Technical Data for Elantas (Altana) K-230

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Paste
    • Substrate
    • Industry
    • Chemistry
    • Application Method
      • Brush - Stiff brush
      • Spatula/Trowel - Spatula
    • Cure Method
      • 2-Part Cure - Part A/Part B
    • Color
      • Clear / Transparent - Clear
    • Brand
      • Cytec
    Specifications
    Cure Specs
    Cure Temperature (°C) 25, 65
    Cure Time (min) 1,440 to 2,160, 120
    Linear Shrinkage (%) 0.67
    Work / Pot Time (min) 60 Test Method
    Mix Ratio 100:45 (by weight)
    Bond Strength
    Compressive Strength (psi) 18,000
    Flexural Strength (psi) 10,000
    Tensile Strength (psi) 2,450, 1,360, 1,520 Test Method
    Material Resistance
    Fungus Resistance Fungus Resistance
    Conductivity
    Dissipation Factor 0.01200 Test Method
    Dielectric Constant 4.60 Test Method
    Thermal Conductivity (W/m°K) 50e-4 (cal/sec/cm5/°C/cm)
    Volume Resistivity (O) 4.0e13 (ohm-cm) Test Method
    Hardness
    Shore D Hardness 80
    Flexibility Semi-Flexible
    Other Properties
    % Solids (%) 100
    Business Information
    Shelf Life Details original unopened containers
    Shelf Life Temperature (°F) 149 to 185
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 18

  • Best Practices for Elantas (Altana) K-230

    *See Terms of Use Below

    1. Surface Preparation

      Apply to dry oil-free surfaces. Remove mold releases from plastic surfaces. When bonding metals, degrease and dry. Chemical etching the metal surface gives optimum results.

    2. Application

      Apply adhesive with spatula or stiff brush to each surface. Apply light pressure to ensure good wetting and contact of the bonded surfaces.

    3. Mixing

      Mix equal length beads from the convenient two-tube kit, or in bulk packages mix 100 pbw, Part A and 45 pbw, Part B.

    4. Curing

      Pot Life of mixture is 60 minutes at 25°C(77°F), and cure is achieved in 24-36 hours at 25°C (77°F). Cure can be accelerated by heating at 65 C (149°F) for 2 hours.

    5. Clean-Up

      Clean equipment before the adhesive hardens, a good hydrocarbon solvent is recommended

  • Comparable Materials for Elantas (Altana) K-230

    *See Terms of Use Below

    Spec Engine® Results

    • Resinlab
      EP11HT(Resinlab)

      A two part filled epoxy adhesive, room temperature to a tough, semi-rigid material, good wetting to most surfaces and is very thixotropic to resist running and sagging, very good vibration and impact resistance.

    • Henkel
      E32(Henkel)

      A two-part, toughened epoxy adhesive that cures at room temperature. Resistant to a wide range of chemical and environmental conditions. Has excellent impact resistance and outstanding electrical insulation properties. The adhesive will bond well to almost all types of metal surfaces including painted or epoxy coated metal surfaces.

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Work / Pot Time Test Methods
Work / Pot Time Temperature
60 min 25°C
Tensile Strength Test Methods
Tensile Strength Cure Temperature Substrate
2,450 psi 25°C Etched AL/AL
1,360 psi -55°C Etched AL/AL
1,520 psi 82°C Etched AL/AL
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
4.60 25°C Dielectric constant, 1 KHz
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.01200 25°C Dissipation Factor, 1 KHz
Volume Resistivity Test Methods
Volume Resistivity Temp (°C)
4.0e13 (ohm-cm) 25°C
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