Brand Cytec Application Type Bond 1 Part or 2 Part 2 Part Material Form Paste Substrate aluminum, ceramics, fabrics, glass, metals, most hard plastics, steel, wood, Etched AL Industry Electrical insulation, Industrial wheels Manufacturer Elantas (Altana) Chemistry Epoxy Application Method Spatula Cure Method Heat Cure Temperature (°C) 25, 65 Cure Time (min) 1,440, 60 Color Light Amber Fungus Resistance Fungus Resistance
Technical Data for Elantas (Altana) K-45
Cure Temperature (°C) 25, 65 Cure Time (min) 1,440, 60 Set Time (min) 4.00 to 6 Test Method Linear Shrinkage (%) 1.00 Work / Pot Time (min) 4.00 to 6 Test Method Thixotropic Non-flow Mix Ratio 1:1 (by volume), 1:1 (by weight)
Compressive Strength (psi) 15,000 Flexural Strength (psi) 7,800 Tensile Strength (psi) 2,520, 1,800, 440, 3,000 Test Method
Fungus Resistance Fungus Resistance
Dissipation Factor 0.01800 Test Method Dielectric Constant 4.10 Test Method Thermal Conductivity (W/m°K) 5.0e-4 (cal/sec/cm2/°C/cm) Volume Resistivity (O) 2.5e14 (ohm/cm) Test Method
Shore D Hardness 85 Flexibility Semi-Flexible
% Solids (%) 100
Shelf Life Details Recommended storage temperature is 20°C-30°C (68°F-86°F). If material is crystallized on opening see instructions above to liquefy.;EASYPOXY K-5 Part A and Part B have a shelf life of 18 months from date of manufacture when stored in their original, unopened container at 20°C-30°C (68°F-86°F)., Recommended storage temperature is 20°C-30°C (68°F-86°F). If material is crystallized on opening see instructions above to liquefy.;EASYPOXY K-5 Part A and Part B have a shelf life of 18 months from date of manufacture when stored in their original, unopened container at 20°C-30°C (68°F-86°F). Shelf Life Temperature (°F) 68 to 86, 68 to 86 Shelf Life Type From date of manufacture, From date of manufacture Shelf Life (mon) 18 Part A, 18 Part B
Best Practices for Elantas (Altana) K-45
Apply to dry oil-free surfaces. Remove mold release from plastic surfaces. When bonding to metals, degrease and dry. Chemical etching of the metal surface gives optimum results.
Apply adhesive with spatula or stiff brush to each surface. Apply light pressure to insure good wetting of the surface and good contact.
Mix equal part by weight or by volume to a uniform color.
Pot Life of mixture is 4-6 minutes @ 25°C. Gelation is 10 minutes @ 25°C, and cure is achieved in 24 hours at 25°C. Cure can be accelerated with heating @ 65°C for 1 hour
Clean equipment before the adhesive hardens
a good hydrocarbon solvent is recommended.
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Set Time Test Methods
|Set Time||Set Temperature|
|4.00 to 6 min||25°C|
Work / Pot Time Test Methods
|Work / Pot Time||Temperature|
|4.00 to 6 min||25°C|
Tensile Strength Test Methods
|Tensile Strength||Cure Temperature||Substrate|
|2,520 psi||25°C||Etched AL/AL|
|1,800 psi||-55°C||Etched AL/AL|
|440 psi||82°C||Etched AL/AL|
Dielectric Constant Test Methods
|Dielectric Constant||Temperature||Test Method|
|4.10||25°C||Dielectric constant, 1 KHz|
Dissipation Factor Test Methods
|Dissipation Factor||Temperature||Test Method|
|0.01800||25°C||Dissipation Factor, 1 KHz|
Volume Resistivity Test Methods
|Volume Resistivity||Temp (°C)|