Epoxy Technology Epo-Tek 301-2FL Datasheet Epoxy Technology Epo-Tek 301-2FL

Information provided by Gluespec
  • Description for Epoxy Technology Epo-Tek 301-2FL

    • Two component • Optical and semiconductor grade • Epoxy resin • Suitable for LED encapsulation • Resist<br/>yellowing over 17 days of continuous UV light exposure • Resistant to impact • Resistant to vibrations • Underfill for flip chips.<br/>

    *See Terms of Use Below

    Brand Epo-Tek
    Application Type Bond, Casting, Encapsulation, Potting
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Substrate Glass, Metals, Most Plastics, Wood, Porous objects, Wooden objects
    Industry Suitable for LED encapsulation, Underfill for flip chips, Semiconductor grade, Optical grade, Underfill for flip chips, Glob top encapsulation over wire bonds, Spin coating at wafer level, LCD optical lamination, Bonding optics inside OEM / scientific instruments, Fiber optic, Mounting optics inside fiber components, Terminating fiber into ferrule, Bundling fibers, Spectral transmission of visible and IR light, Sealing of glass plates
    Manufacturer Epoxy Technology
    Chemistry Epoxy resin
    Cure Method 2-part cure, Heat cure, Room temperature cure
    Cure Temperature (°C) 80, >23
    Cure Time (min) 180, >4,320
    Viscosity (cPs) Pourable, 100 to 200
    Non-Yellowing UV Resistance: Resist yellowing over 17 days of continuous UV light exposure
    High Temperature Resistance (°C) <250, 325
    Volume Resistivity (O) >= 0.6e12 (Ohm-cm)
    Stress Relief Low Stress
    Light Refractive Index (RI) 1.5102
  • Technical Data for Epoxy Technology Epo-Tek 301-2FL

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Substrate
      • Porous Substrates - Porous objects
      • Glass
      • Metal - Metals
      • Plastic - Most Plastics
      • Wood - Wooden objects
      • Other - Quartz
    • Industry
      • Semiconductor - Semiconductor grade
      • Optical - Optical grade, LCD optical lamination, Fiber optic, Bonding optics inside OEM / scientific instruments, Mounting optics inside fiber components, Terminating fiber into ferrule, Bundling fibers, Spectral transmission of visible and IR light, Sealing of glass plates
      • LED (Light-Emitting Diodes) - Suitable for LED encapsulation
      • Wafer - Spin coating at wafer level
      • Flip chip - Underfill for flip chips
      • Underfill - Underfill for flip chips
      • Glob Top - Glob top encapsulation over wire bonds
      • Other - Bonding glass cover slip over V-groove
    • Chemistry
    • Cure Method
      • Room Temperature / Air Dry - Room temperature cure
      • Heat - Heat cure
      • 2-Part Cure
    • Brand
      • Epo-Tek
    Specifications
    Cure Specs
    Cure Temperature (°C) 80, >23 Test Method
    Cure Time (min) 180, >4,320 Test Method
    Viscosity (cPs) Pourable, 100 to 200 Test Method
    Work / Pot Time (min) 600 Test Method
    Thixotropic Thixotropic
    Mix Ratio 100:35 (by weight)
    Bond Strength
    General Bond Strength (psi) Very good
    Shear Strength (psi) >2,000, 3,556 Test Method
    Material Resistance
    High Temperature Resistance (°C) <250, 325 Test Method
    Impact Resistance Resistant to impact
    Vibration Resistance/Shock Resistance Resistant to vibrations
    Conductivity
    Dissipation Factor Test Method
    Dielectric Constant 3.54 Test Method
    Volume Resistivity (O) >= 0.6e12 (Ohm-cm) Test Method
    Hardness
    Stress Relief Low Stress
    Shore D Hardness 70 Test Method
    Flexibility Flexible
    Modulus (psi) 318,685 Test Method
    Other Properties
    Glass Transition Temp (Tg) (°C) >45 Test Method
    Light Refractive Index (RI) 1.5102 Test Method
    Outgassing 0.50%, 0.96%, 3.52% Test Method
    Coefficient of Thermal Expansion (CTE) 56e-6 (in/in°C), 211e-6 (in/in°C) Test Method
    Business Information
    Shelf Life Temperature (°F) 68 to 77 Room temperature, -40
    Shelf Life (mon) 12 Bulk, 6 Syringe
  • Best Practices for Epoxy Technology Epo-Tek 301-2FL

    *See Terms of Use Below

  • Comparable Materials for Epoxy Technology Epo-Tek 301-2FL

    *See Terms of Use Below

    Spec Engine® Results

    Closest Results from this Manufacturer

Popular Articles

Electrically Conductive Adhesives

Read Article

Epoxies in the Medical Device Industry

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Testing the effectiveness of surface treatments

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article

Featured Ads

Gluespec Poll

Who do you read or follow for engineering news and entertainment?
Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
80°C Recommended cure
>23°C Minimum alternative cure
Cure Time Test Methods
Cure Time Test Method
180 min Recommended cure
>4,320 min Minimum alternative cure
Viscosity Test Methods
Viscosity Test Method Temperature
Pourable Cure condition: 80°C / 3 Hours; Different batches, conditions & applications yield differing results.; Data is not guaranteed.; To be used as a guide only, not as a specification.; Test on lot acceptance basis
100 to 200 cPs @ 100 rpm; Cure condition: 80°C / 3 Hours; Different batches, conditions & applications yield differing results.; Data is not guaranteed.; To be used as a guide only, not as a specification.; Test on lot acceptance basis 23°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
600 min Pot life
Shear Strength Test Methods
Shear Strength Type Cure Temperature Test Method
>2,000 psi Lap shear 23°C Cure condition: 80°C / 3 Hours; Different batches, conditions & applications yield differing results.; Data is not guaranteed.; To be used as a guide only, not as a specification.
3,556 psi Die shear 23°C Cure condition: 80°C / 3 Hours; Different batches, conditions & applications yield differing results.; Data is not guaranteed.; To be used as a guide only, not as a specification.; Test on lot acceptance basis.
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
<250°C Intermittent; Suggested operating temperature; Cure condition: 80°C / 3 Hours; Different batches, conditions & applications yield differing results.; Data is not guaranteed.; To be used as a guide only, not as a specification.; Test on lot acceptance basis.
325°C Degradation temperature; Cure condition: 80°C / 3 Hours; Different batches, conditions & applications yield differing results.; Data is not guaranteed.; To be used as a guide only, not as a specification.
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.54 1KHz; Cure condition: 80°C / 3 Hours; Different batches, conditions & applications yield differing results.; Data is not guaranteed.; To be used as a guide only, not as a specification.; Test on lot acceptance basis.
Dissipation Factor Test Methods
Dissipation Factor Test Method
Volume Resistivity Test Methods
Volume Resistivity Temp (°C) Test Method
>= 0.6e12 (Ohm-cm) 23°C Cure condition: 80°C / 3 Hours; Different batches, conditions & applications yield differing results.; Data is not guaranteed.; To be used as a guide only, not as a specification.; Test on lot acceptance basis.
Modulus Test Methods
Modulus Test Method
318,685 psi Storage modulus; Cure condition: 80°C / 3 Hours; Different batches, conditions & applications yield differing results.; Data is not guaranteed.; To be used as a guide only, not as a specification.
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
70 Cure condition: 80°C / 3 Hours; Different batches, conditions & applications yield differing results.; Data is not guaranteed.; To be used as a guide only, not as a specification.; Test on lot acceptance basis.
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
56e-6 (in/in°C) Below Tg; Cure condition: 80°C / 3 Hours; Different batches, conditions & applications yield differing results.; Data is not guaranteed.; To be used as a guide only, not as a specification.; Test on lot acceptance basis.
211e-6 (in/in°C) Above Tg; Cure condition: 80°C / 3 Hours; Different batches, conditions & applications yield differing results.; Data is not guaranteed.; To be used as a guide only, not as a specification.; Test on lot acceptance basis.
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
>45°C Dynamic cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min; Cure condition: 80°C / 3 Hours; Different batches, conditions & applications yield differing results.; Data is not guaranteed.; To be used as a guide only, not as a specification.; Test on lot acceptance basis.
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) Temperature Test Method
1.5102 23°C @ 589 nm; Cure condition: 80°C / 3 Hours; Different batches, conditions & applications yield differing results.; Data is not guaranteed.; To be used as a guide only, not as a specification.; Test on lot acceptance basis.
Outgassing Test Methods
Outgassing Temperature (°C) Test Method
0.50% 200°C Weight loss; Cure condition: 80°C / 3 Hours; Different batches, conditions & applications yield differing results.; Data is not guaranteed.; To be used as a guide only, not as a specification.; Test on lot acceptance basis.
0.96% 250°C Weight loss; Cure condition: 80°C / 3 Hours; Different batches, conditions & applications yield differing results.; Data is not guaranteed.; To be used as a guide only, not as a specification.; Test on lot acceptance basis.
3.52% 300°C Weight loss; Cure condition: 80°C / 3 Hours; Different batches, conditions & applications yield differing results.; Data is not guaranteed.; To be used as a guide only, not as a specification.; Test on lot acceptance basis.