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Description for Henkel 4E98
A single component fast heat curing epoxy. It offers a fast low temperature cure which makes it ideal for bonding heat sensitive substrates used within the medical device industry. This product passes USP Cytotoxicity tests when cured.Brand Bondmaster Application Type Bond 1 Part or 2 Part 1-Part Material Form Liquid Substrate Aluminum Industry Medical device industry Manufacturer Henkel Chemistry Epoxy Cure Method Heat Cure Temperature (°C) low temperature, 80, 90, 100, 120 Cure Time (min) Fast, 60, 15, 10, 5.00 Viscosity (cPs) 40,000 Color Light Green, Cream High Temperature Resistance (°C) 135 Low Temperature Resistance (°C) -40 -
Technical Data for Henkel 4E98
Overview
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Application Type
- Adhesive - Bond
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1 Part or 2 Part
- 1-Part
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Material Form
- Liquid
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Substrate
- Aluminum
- Other - Heat sensitive substrates
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Industry
- Industrial - Medical device industry
- Medical - Medical device industry
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Chemistry
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Cure Method
- Heat
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Color
- Green - Light Green
- Off-White - Cream
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Brand
- Bondmaster
Specifications
Cure Specs
Cure Temperature (°C) low temperature, 80, 90, 100, 120 Cure Time (min) Fast, 60, 15, 10, 5.00 Viscosity (cPs) 40,000 Test Method Bond Strength
Shear Strength (psi) 2,000 Test Method Tensile Strength (psi) 6,000 Material Resistance
High Temperature Resistance (°C) 135 Low Temperature Resistance (°C) -40 Hardness
Shore D Hardness 85 Elongation (%) 6 Other Properties
Specific Gravity 1.300 Business Information
Shelf Life Details STORAGE & HANDLING: Store at 5°C (40°F). If cold stored, return to ambient temperature prior to use. Shelf Life Temperature (°F) 41 Shelf Life (mon) 6 -
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Best Practices for Henkel 4E98
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Surface Preparation
The surfaces should be clean and dry. The adhesive should be extruded using a bead diameter that will allow complete coverage of the bond area. Care should be taken not to include or trap any air within the joint. Normally it should be applied to only one surface.
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