• Description for Henkel 4E98

    A single component fast heat curing epoxy. It offers a fast low temperature cure which makes it ideal for bonding heat sensitive substrates used within the medical device industry. This product passes USP Cytotoxicity tests when cured.

    *See Terms of Use Below

    Brand Bondmaster
    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Substrate Aluminum
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Heat
    Cure Temperature (°C) low temperature, 80, 90, 100, 120
    Cure Time (min) Fast, 60, 15, 10, 5.00
    Viscosity (cPs) 40,000
    Color Light Green, Cream
    High Temperature Resistance (°C) 135
    Low Temperature Resistance (°C) -40
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Viscosity Test Methods
Viscosity Temperature
40,000 cPs 25°C
Shear Strength Test Methods
Shear Strength Type Substrate
2,000 psi Lap shear strength Aluminum to Aluminum