• Description for Henkel Armstrong A-1 Epoxy Resin w/ A Activator

    Adhesive formulated from specification controlled epoxy resins and inert, high purity filler materials. Contain ingredients that impart low, surface free energy characteristics, giving it excellent wettability to adherents that are traditionally hard to bond.

    *See Terms of Use Below

    Brand Armstrong
    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Ceramics, Glass, Metal, Thermosetting Plastics, Rubber, Steel, Wood
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method 2 Parts
    Cure Temperature (°C) 20 to 25 Room Temperature, 74
    Cure Time (min) 10,080, 120
    Viscosity (cPs) 600,000 to 900,000, 430,000
    Color Red-Brown, Red-Brown
    Chemical Resistance Acetone, Ammonia, 28%, Distilled Water, Ethyl Acetate, Ethylenedichloride, Glacial Acetic Acid, Hexane, Salt water, Toluene
    Density (g/cm³) .058 (lbs/cubic in)
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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Viscosity Test Methods
Viscosity Temperature
600,000 to 900,000 cPs
430,000 cPs 25°C
Work / Pot Time Test Methods
Work / Pot Time Temperature
30 min 25°C
Tensile Strength Test Methods
Tensile Strength Cure Time Cure Temperature Substrate Chemical Test Time Test Temperature Test Humidity
3,000 psi 10,080 min 20 to 25°C Room Temperature
4,020 psi 120 min 74°C
1,600 psi 10,080 min 20 to 25°C Room Temperature 20 to 25°C Room Temperature
1,460 psi 10,080 min 20 to 25°C Room Temperature 82°C
1,100 psi 10,080 min 20 to 25°C Room Temperature -51°C
1,820 psi 10,080 min 20 to 25°C Room Temperature Ammonia, 28% 10,080 min
1,730 psi 10,080 min 20 to 25°C Room Temperature Distilled Water 10,080 min
1,980 psi 10,080 min 20 to 25°C Room Temperature Salt Water, 10% 10,080 min
1,980 psi 10,080 min 20 to 25°C Room Temperature Acetone 10,080 min
1,100 psi 10,080 min 20 to 25°C Room Temperature Glacial Acetic Acid 10,080 min
1,800 psi 10,080 min 20 to 25°C Room Temperature Toluene 10,080 min
2,000 psi 10,080 min 20 to 25°C Room Temperature Ethylenedichloride 10,080 min
1,380 psi 10,080 min 20 to 25°C Room Temperature Ethyl Acetate 10,080 min
1,250 psi 10,080 min 20 to 25°C Room Temperature Hexane 10,080 min
1,270 psi 10,080 min 20 to 25°C Room Temperature >10,080 min 100 %
1,850 psi 10,080 min 20 to 25°C Room Temperature Steel to Steel 20 to 25°C Room Temperature
2,400 psi 120 min 74°C 82°C
3,180 psi 120 min 74°C -51°C
1,960 psi 120 min 74°C Ammonia, 28% 10,080 min
1,930 psi 120 min 74°C Distilled Water 10,080 min
2,150 psi 120 min 74°C Salt Water, 10% 0.00 min
1,770 psi 120 min 74°C Acetone 10,080 min
2,200 psi 120 min 74°C Glacial Acetic Acid 10,080 min
2,250 psi 120 min 74°C Toluene 10,080 min
2,000 psi 120 min 74°C Ethylenedichloride 10,080 min
2,050 psi 120 min 74°C Ethyl Acetate 10,080 min
2,190 psi 120 min 74°C Hexane 10,080 min
2,580 psi 120 min 74°C 10,080 min 100 %
3,070 psi 120 min 74°C Steel to Steel
1,660 psi 120 min 74°C
Cleavage Strength Test Methods
Cleavage Strength Cure Time Cure Temperature
830 psi 10,080 min 20 to 25°C Room Temperature
1,190 psi 120 min 74°C
Compressive Strength Test Methods
Compressive Strength Cure Time Cure Temperature Test Method
15.2 (psi) x 1000 10,080 min 20 to 25°C Room Temperature Ult.
13.4 (psi) x 1000 120 min 74°C Ult.
General Bond Strength Test Methods
General Bond Strength Cure Time Cure Temperature
1,150 psi 10,080 min 20 to 25°C Room Temperature
2,070 psi 120 min 74°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
15.30 Dielectric Constant (1kc)
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.20000 Dissipation Factor (1kc)
Volume Resistivity Test Methods
Volume Resistivity Temp (°C)
3.0e14 (ohms/cm) 93°C
Elongation Test Methods
Elongation Test Method
1 % 7 days @ R.T
2 % 2 hrs @ 165°F
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
4.3e-5 (in./ in/°C) 7 days @ R.T.