Henkel Armstrong A-1 Epoxy Resin w/ E Activator Datasheet Henkel Armstrong A-1 Epoxy Resin w/ E Activator

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  • Description for Henkel Armstrong A-1 Epoxy Resin w/ E Activator

    Adhesive formulated from specification controlled epoxy resins and inert, high purity filler materials. Contain ingredients that impart low, surface free energy characteristics, giving it excellent wettability to adherents that are traditionally hard to bond.

    *See Terms of Use Below

    Brand Armstrong
    Chemical Resistance Acetone, Chemical Resistance: Fluid Resistance: Distilled Water, Chemical Resistance: Glacial Acetic Acid, Ammonia, 28%, Chemical Resistance: Fluid Resistance: Salt water, Hexane, Ethyl Acetate, Ethylenedichloride, Toluene
    Application Type Bond
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Substrate Ceramics, Glass, Metal, Thermosetting Plastics, Rubber, Steel, Wood
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method 2 Parts
    Cure Temperature (°C) 93
    Cure Time (min) 60
    Viscosity (cPs) 600,000 to 900,000, 400,000
    Color Red-Brown, Red-Brown
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -51
    Volume Resistivity (O) 3.0e14 (ohms/cm)
    Density (g/cm³) 0.061 lbs/cubic in

  • Technical Data for Henkel Armstrong A-1 Epoxy Resin w/ E Activator

    *See Terms of Use Below

    Overview
    • Chemical Resistance
      • Chemical Resistance : Fluid Resistance : Water Resistance - Distilled Water, Salt water
      • Chemical Resistance - Acetone, Ammonia, 28%, Ethyl Acetate, Ethylenedichloride, Hexane, Toluene
      • Chemical Resistance : Acid Resistance - Glacial Acetic Acid
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Substrate
    • Chemistry
    • Cure Method
      • 2-Part Cure - 2 Parts
    • Color
      • Brown - Red-Brown
      • Red - Red-Brown
    • Brand
      • Armstrong
    Specifications
    Cure Specs
    Cure Temperature (°C) 93
    Cure Time (min) 60
    Viscosity (cPs) 600,000 to 900,000, 400,000 Test Method
    Set Time (min) Fast initial
    Work / Pot Time (min) 120 to 180 Test Method
    Mix Ratio 100:6 (by weight)
    Bond Strength
    General Bond Strength (psi) 4,650 Test Method
    Cleavage Strength (psi) 1,810 Test Method
    Compressive Strength (psi) 15.4 (psi) x 1000) Test Method
    Tensile Strength (psi) 3,960, 3,010, 3,450, 1,940, 2,880, 2,830, 2,850, 3,000, 2,700, 3,030, 3,000, 2,000, 2,580, 2,700, 3,350 Test Method
    Material Resistance
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -51
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.20000 Test Method
    Filler Inert, High purity materials
    Dielectric Constant 15.30 Test Method
    Volume Resistivity (O) 3.0e14 (ohms/cm) Test Method
    Hardness
    Shore D Hardness 86
    Elongation (%) 1, 2 Test Method
    Other Properties
    Specific Gravity 1.600
    Coefficient of Thermal Expansion (CTE) 4.3e-5 (in./ in/°C) Test Method
    Density (g/cm³) 0.061 lbs/cubic in
    Business Information
    Shelf Life Details Shelf life is one year when stored below 90°F out of sunlight and in original unopened containers of pints or greater. Shelf life will vary with specialty packages.
    Shelf Life Temperature (°F) <90
    Shelf Life (mon) 12

  • Best Practices for Henkel Armstrong A-1 Epoxy Resin w/ E Activator

    *See Terms of Use Below

    1. Surface Preparation

      The surface to be bonded should be clean and dry. For most applications mechanical and/or solvent degreasing is satisfactory. For some critical applications special chemical surface preparations should be used.

    2. Mixing

      Combine the two components in a clean, discardable container in correct proportions and mix thoroughly. Avoid the introduction of excess air, which reduces the effectiveness of the adhesive. In selecting the amount of adhesive to mix at one time the limited working life should be taken into account.

  • Comparable Materials for Henkel Armstrong A-1 Epoxy Resin w/ E Activator

    *See Terms of Use Below

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Viscosity Test Methods
Viscosity Temperature
600,000 to 900,000 cPs
400,000 cPs 25°C
Work / Pot Time Test Methods
Work / Pot Time Temperature
120 to 180 min 25°C
Tensile Strength Test Methods
Tensile Strength Cure Time Cure Temperature Substrate Chemical Test Time Test Temperature Test Humidity
3,960 psi 60 min 93°C
3,010 psi 60 min 93°C 20 to 25°C Room Temperature
3,450 psi 60 min 93°C 82°C
1,940 psi 60 min 93°C -51°C
2,880 psi 60 min 93°C Ammonia 28% 10,080 min
2,830 psi 60 min 93°C Distilled water 10,080 min
2,850 psi 60 min 93°C Salt Water, 10% 10,080 min
3,000 psi 60 min 93°C Acetone 10,080 min
2,700 psi 60 min 93°C Glacial Acetic Acid 10,080 min
3,030 psi 60 min 93°C Toluene 10,080 min
3,000 psi 60 min 93°C Ethylenedichloride 10,080 min
2,000 psi 60 min 93°C Ethyl Acetate 10,080 min
2,580 psi 60 min 93°C Hexane 10,080 min
2,700 psi 60 min 93°C 10,080 min 100 %
3,350 psi 60 min 93°C Steel to Steel
Cleavage Strength Test Methods
Cleavage Strength Cure Time Cure Temperature
1,810 psi 60 min 93°C
Compressive Strength Test Methods
Compressive Strength Test Method
15.4 (psi) x 1000) Ult.
General Bond Strength Test Methods
General Bond Strength Cure Time Cure Temperature
4,650 psi 60 min 93°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
15.30 (1kc)
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.20000 (1kc)
Volume Resistivity Test Methods
Volume Resistivity Temp (°C)
3.0e14 (ohms/cm) 93°C
Elongation Test Methods
Elongation Test Method
1 % 7 days @ R.T
2 % 1 hr @ 200 °F
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
4.3e-5 (in./ in/°C) 1 hr @