Henkel Armstrong A-12 Epoxy Resin 1:1

Henkel Armstrong A-12 Epoxy Resin 1:1 Datasheet
  • Description for Henkel Armstrong A-12 Epoxy Resin 1:1

    A general purpose adhesive, combines low toxicity with good physical properties. This two-part adhesive has a non-critical mixing ratio with 1:1 used most frequently. The mix ratio can be varied to obtain a more flexible or more rigid bond by increasing or decreasing respectively, the concentration of Part B.

    *See Terms of Use Below

    Brand Armstrong
    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Ceramic, Metal, Plastics, Wood, Al
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Part A/Part B
    Cure Temperature (°C) 93, 300
    Cure Time (min) 60, 5.00
    Viscosity (cPs) 80,000
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -51
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
93°C Optimum cure
300°C Fast cure
Cure Time Test Methods
Cure Time Test Method
60 min Optimum cure
5.00 min Fast cure
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
120 min 100 gms @77°F 25°C
60 min 1# @ 77°F 25°C
Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Substrate Test Temperature
5,000 psi Tensile Shear Strength 120 min 74°C al/al 25°C
700 psi Tensile Shear Strength 120 min 74°C al/al 82°C
2,500 psi Tensile Shear Strength 120 min 74°C al/al -51°C
Tensile Strength Test Methods
Tensile Strength Type Cure Time Cure Temperature Substrate
5,000 psi 120 min 74°C
Cleavage Strength Test Methods
Cleavage Strength Cure Time Cure Temperature
1,500 psi 120 min 165°C
General Bond Strength Test Methods
General Bond Strength Cure Time Cure Temperature
2,000 psi 120 min 74°C
Specific Gravity Test Methods
Specific Gravity Temperature
1.320 25°C