Henkel Armstrong A-12 Epoxy Resin 1:1 Datasheet Henkel Armstrong A-12 Epoxy Resin 1:1

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  • Description for Henkel Armstrong A-12 Epoxy Resin 1:1

    A general purpose adhesive, combines low toxicity with good physical properties. This two-part adhesive has a non-critical mixing ratio with 1:1 used most frequently. The mix ratio can be varied to obtain a more flexible or more rigid bond by increasing or decreasing respectively, the concentration of Part B.

    *See Terms of Use Below

    Brand Armstrong
    Application Type Bond
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Substrate Al, Ceramic, Metal, Plastics, Wood
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Part A/Part B
    Cure Temperature (°C) 93, 300
    Cure Time (min) 60, 5.00
    Viscosity (cPs) 80,000
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -51
  • Technical Data for Henkel Armstrong A-12 Epoxy Resin 1:1

    Overview
    Specifications
    Cure Specs
    Cure Temperature (°C) 93, 300 Test Method
    Cure Time (min) 60, 5.00 Test Method
    Viscosity (cPs) 80,000
    Work / Pot Time (min) 120, 60 Test Method
    Mix Ratio 1:1 (by volume), 1:1 (by weight)
    Bond Strength
    General Bond Strength (psi) 2,000 Test Method
    Shear Strength (psi) 5,000, 700, 2,500 Test Method
    Cleavage Strength (psi) 1,500 Test Method
    Tensile Strength (psi) 5,000 Test Method
    Material Resistance
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -51
    Hardness
    Shore D Hardness 78
    Elongation (%) <8
    Flexibility Flexible, rigid
    Other Properties
    Specific Gravity 1.320 Test Method
    Coefficient of Thermal Expansion (CTE) 3.8e-5 (in./ in/°F)
    Business Information
    Shelf Life Details Shelf life is one year when stored below 90°F out of sunlight and in original unopened containers of pints or greater. Shelf life will vary with specialty packages.
    Shelf Life Temperature (°F) <90
    Shelf Life (mon) 12
  • Best Practices for Henkel Armstrong A-12 Epoxy Resin 1:1

    *See Terms of Use Below

    1. Surface Preparation

      The surfaces to be bonded should be clean and dry (for critical applications refer to our suggested surface preparation procedures - Bulletin No. 964)

    2. Application

      Apply the adhesive to surfaces to be bonded (preferably both surfaces) and press together. Light clamping may be used to keep parts in position during curing.

    3. Mixing

      Thoroughly mix the A-12 Part B with the A-12 part A in a clean discardable container using correct mix ratio. Avoid the introduction of excess air.

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
93°C Optimum cure
300°C Fast cure
Cure Time Test Methods
Cure Time Test Method
60 min Optimum cure
5.00 min Fast cure
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
120 min 100 gms @77°F 25°C
60 min 1# @ 77°F 25°C
Cleavage Strength Test Methods
Cleavage Strength Cure Time Cure Temperature
1,500 psi 120 min 165°C
General Bond Strength Test Methods
General Bond Strength Cure Time Cure Temperature
2,000 psi 120 min 74°C
Tensile Strength Test Methods
Tensile Strength Type Cure Time Cure Temperature Substrate
5,000 psi 120 min 74°C
Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Substrate Test Temperature
5,000 psi Tensile Shear Strength 120 min 74°C al/al 25°C
700 psi Tensile Shear Strength 120 min 74°C al/al 82°C
2,500 psi Tensile Shear Strength 120 min 74°C al/al -51°C
Specific Gravity Test Methods
Specific Gravity Temperature
1.320 25°C