Henkel Armstrong A-2 Epoxy Resin w/ A Activator

Overview

• Application Type

  • Adhesive - Bond

• 1 Part or 2 Part

  • 1 Part or 2 Part - 2 Part

• Material Form

  • Paste

• Substrate

  • Ceramic - Ceramics
  • Glass
  • Copper
  • Aluminum - Aluminium
  • Iron - Cast iron
  • Magnesium
  • Titanium
  • Steel
  • Plastic - ABS
  • Phenolic - Phenolics
  • Nylon
  • Acrylic (PMMA) - Acrylics
  • Polycarbonate
  • Wood
  • Polyester
  • Other - Porcelain, Acetates

• Industry

  • Electronics - Electrical

• Chemistry

  • Epoxy

• Cure Method

  • 2-Part Cure - 2 Parts

• Color

  • Off-White - Off White
  • Yellow - Bronze

• Key Specifications

  • Mil-Spec (United States Military Standard): A-47284 - MIL-A-47284

• Brand

  • Armstrong

Specifications

Cure Specs

Cure Temperature (°C)	20 to 25 Room Temperature, 74, 93
Cure Time (min)	Short, 120, 10
Viscosity (cPs)	5,000, 5 to 15, 210,000	Test Method
Work / Pot Time (min)	30
Mix Ratio	100:4 (by weight)

Bond Strength

General Bond Strength (psi)	2,270	Test Method
Cleavage Strength (psi)	1,560	Test Method
Compressive Strength (psi)	17,900	Test Method
Tensile Strength (psi)	2,900, 3,500, 2,500, 1,530, 1,650, 3,070, 2,530, 980, 2,850, 3,010, 2,530, 2,320, 3,370, 3,000	Test Method

Material Resistance

Chemical Resistance	Acetone, Ammonia, 28%, Distilled Water, Ethyl Acetate, Ethylenedichloride, Glacial Acetic Acid, Hexane, Salt water, Toluene
High Temperature Resistance (°C)	82
Low Temperature Resistance (°C)	-51
Moisture/Humidity Resistance	Moisture/humidity resistance

Conductivity

Filler	Non-metallic oxide
Dielectric Strength (V/mil)	Excellent

Hardness

Elongation (%)	2	Test Method
Flexibility	Rigid

Other Properties

Specific Gravity	0.950, 1.800
Coefficient of Thermal Expansion (CTE)	Low, 3.9e-5 (in./ in/°F)

Business Information

Shelf Life Details	Store below 25°C out of sunlight and in original unopened containers.