Henkel Armstrong A-2 Epoxy Resin w/ E Activator

Overview

• Chemical Resistance

  • Chemical Resistance : Fluid Resistance : Water Resistance - Ammonia, 28%, Salt water
  • Chemical Resistance - Acetone, Distilled Water, Ethyl Acetate, Ethylenedichloride, Hexane, Toluene
  • Chemical Resistance : Acid Resistance - Glacial Acetic Acid

• Application Type

  • Adhesive - Bond

• 1 Part or 2 Part

  • 2-Part

• Material Form

  • Paste

• Substrate

  • Ceramic - Ceramics
  • Glass
  • Aluminum - Aluminium
  • Copper
  • Steel
  • Iron - Cast iron
  • Titanium
  • Magnesium
  • Acrylic (PMMA) - Acrylics
  • Nylon
  • Polycarbonate
  • Phenolic - Phenolics
  • ABS
  • Wood
  • Polyester
  • Other - Porcelain, Acetates

• Industry

  • Electronics - Electrical

• Chemistry

  • Epoxy

• Cure Method

  • 2-Part Cure - 2 Parts

• Color

  • Off-White - Off White
  • Yellow - Bronze

• Brand

  • Armstrong

Specifications

Cure Specs

Cure Temperature (°C)	93
Cure Time (min)	60
Viscosity (cPs)	5,000, 5.00 to 15, 170,000	Test Method
Work / Pot Time (min)	120 to 180
Mix Ratio	100:6 (by weight)

Bond Strength

General Bond Strength (psi)	4,520	Test Method
Cleavage Strength (psi)	1,860	Test Method
Compressive Strength (psi)	16,500	Test Method
Tensile Strength (psi)	2,500, 2,960, 2,850, 3,050, 2,930, 3,380, 3,030, 2,350, 3,600, 3,050, 2,000, 2,520, 2,400, 6,570	Test Method

Material Resistance

High Temperature Resistance (°C)	82
Low Temperature Resistance (°C)	-51
Moisture/Humidity Resistance	Moisture/humidity resistance

Conductivity

Filler	Non-metallic oxide
Dielectric Strength (V/mil)	Excellent

Hardness

Elongation (%)	3	Test Method
Flexibility	Rigid

Other Properties

Specific Gravity	0.830, 1.800
Coefficient of Thermal Expansion (CTE)	Low, 4.0e-5 (in./ in/°F)

Business Information

Shelf Life Details	Store below 25°C out of sunlight and in original unopened containers.