Henkel Armstrong A-2 Epoxy Resin w/ H20 Activator

Henkel Armstrong A-2 Epoxy Resin w/ H20 Activator Datasheet
  • Description for Henkel Armstrong A-2 Epoxy Resin w/ H20 Activator

    An off-white, versatile, filled paste resin that has low coefficient of thermal expansion making it ideal for bonding porcelain, glass and ceramics. Exhibits excellent wetting properties and provides strong bonds to rigid materials. Versatility is achieved by selecting one of four recommended activators. Non-metallic oxide fillers provide excellent electrical insulation properties.

    *See Terms of Use Below

    Brand Armstrong
    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Paste
    Substrate Ceramics, Copper, Phenolics, Glass, Aluminium, Cast iron, Magnesium, Titanium, Nylon, ABS, Acrylics, Polycarbonate, Polyester, Steel, Wood
    Industry Electrical
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method 2 Parts
    Cure Temperature (°C) 74, 93
    Cure Time (min) 30, 10
    Viscosity (cPs) 5,000, 10 to 25, 15,000
    Color Off White, Bronze
    Chemical Resistance Acetone, Ammonia, 28%, Distilled Water, Ethyl Acetate, Ethylenedichloride, Glacial Acetic Acid, Hexane, Salt water, Toluene
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -51
  • Technical Data for Henkel Armstrong A-2 Epoxy Resin w/ H20 Activator

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Paste
    • Substrate
    • Industry
    • Chemistry
    • Cure Method
      • 2-Part Cure - 2 Parts
    • Color
      • Off-White - Off White
      • Yellow - Bronze
    • Brand
      • Armstrong
    Specifications
    Cure Specs
    Cure Temperature (°C) 74, 93
    Cure Time (min) 30, 10
    Viscosity (cPs) 5,000, 10 to 25, 15,000 Test Method
    Work / Pot Time (min) Long, 45 to 90
    Mix Ratio 100:10 (by weight)
    Bond Strength
    General Bond Strength (psi) 3,500 Test Method
    Cleavage Strength (psi) 1,600 Test Method
    Tensile Strength (psi) 3,800, 900, 2,700, 3,800 Test Method
    Material Resistance
    Chemical Resistance Acetone, Ammonia, 28%, Distilled Water, Ethyl Acetate, Ethylenedichloride, Glacial Acetic Acid, Hexane, Salt water, Toluene
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -51
    Conductivity
    Filler Non-metallic oxide
    Dielectric Strength (V/mil) Excellent
    Hardness
    Elongation (%) 4 Test Method
    Flexibility Rigid
    Other Properties
    Specific Gravity 1.670, 1.800, 1.010
    Coefficient of Thermal Expansion (CTE) Low, 2.2e-5 (in./ in/°F)
    Business Information
    Shelf Life Details Store below 25°C out of sunlight and in original unopened containers.
  • Best Practices for Henkel Armstrong A-2 Epoxy Resin w/ H20 Activator

    *See Terms of Use Below

  • Comparable Materials for Henkel Armstrong A-2 Epoxy Resin w/ H20 Activator

    *See Terms of Use Below

    Spec Engine® Results

Questions about this material?

Get personal assistance with your specific application needs.

Your Profile Edit
  1. 92db9e53-4d10-4346-bed4-da330c7a541b
  2. 92db9e53-4d10-4346-bed4-da330c7a541b

Popular Articles

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Testing the effectiveness of surface treatments

Read Article

Epoxies in the Medical Device Industry

Read Article

Electrically Conductive Adhesives

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article
Information provided by Gluespec

Why Register?

  • View Technical Details
  • View Test Methods
  • View Key Specifications
  • View Similar Materials
  • Save your Project Searches

Already registered? Sign in.

Questions? Learn more about Gluespec

Gluespec Poll

When you're researching or sourcing materials online, what device are you using?
Viscosity Test Methods
Viscosity Temperature
5,000 cPs 25°C
10 to 25 cPs 25°C
15,000 cPs
Tensile Strength Test Methods
Tensile Strength Substrate Test Temperature Test Method
3,800 psi Aluminum to Aluminum .064" - 2024-T3 20 to 25°C Room Temperature ASTM D-1002
900 psi Aluminum to Aluminum .064" - 2024-T3 82°C ASTM D-1002
2,700 psi Aluminum to Aluminum .064" - 2024-T3 -51°C ASTM D-1002
3,800 psi ASTM D638
Cleavage Strength Test Methods
Cleavage Strength Test Method
1,600 psi ASTM D1602
General Bond Strength Test Methods
General Bond Strength Test Method
3,500 psi ASTM D897
Elongation Test Methods
Elongation Test Method
4 % ASTM D638