Henkel Armstrong A-2 Epoxy Resin w/ H20 Activator

Henkel Armstrong A-2 Epoxy Resin w/ H20 Activator Datasheet
  • Description for Henkel Armstrong A-2 Epoxy Resin w/ H20 Activator

    An off-white, versatile, filled paste resin that has low coefficient of thermal expansion making it ideal for bonding porcelain, glass and ceramics. Exhibits excellent wetting properties and provides strong bonds to rigid materials. Versatility is achieved by selecting one of four recommended activators. Non-metallic oxide fillers provide excellent electrical insulation properties.

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    Brand Armstrong
    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Paste
    Substrate Acrylics, Aluminium, Ceramics, Copper, Glass, Nylon, ABS, Polycarbonate, Polyester, Steel, Wood, Cast iron, Titanium, Magnesium, Phenolics
    Industry Electrical
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method 2 Parts
    Cure Temperature (°C) 74, 93
    Cure Time (min) 30, 10
    Viscosity (cPs) 5,000, 10 to 25, 15,000
    Color Off White, Bronze
    Chemical Resistance Acetone, Ammonia, 28%, Distilled Water, Ethyl Acetate, Ethylenedichloride, Glacial Acetic Acid, Hexane, Salt water, Toluene
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -51
  • Technical Data

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  • Best Practices

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Viscosity Test Methods
Viscosity Temperature
5,000 cPs 25°C
10 to 25 cPs 25°C
15,000 cPs
Cleavage Strength Test Methods
Cleavage Strength Test Method
1,600 psi ASTM D1602
General Bond Strength Test Methods
General Bond Strength Test Method
3,500 psi ASTM D897
Tensile Strength Test Methods
Tensile Strength Substrate Test Temperature Test Method
3,800 psi Aluminum to Aluminum .064" - 2024-T3 20 to 25°C Room Temperature ASTM D-1002
900 psi Aluminum to Aluminum .064" - 2024-T3 82°C ASTM D-1002
2,700 psi Aluminum to Aluminum .064" - 2024-T3 -51°C ASTM D-1002
3,800 psi ASTM D638
Elongation Test Methods
Elongation Test Method
4 % ASTM D638