-
Description for Henkel Armstrong A-2 Epoxy Resin w/ W Activator
An off-white, versatile, filled paste resin that has low coefficient of thermal expansion making it ideal for bonding porcelain, glass and ceramics. Exhibits excellent wetting properties and provides strong bonds to rigid materials. Versatility is achieved by selecting one of four recommended activators. Non-metallic oxide fillers provide excellent electrical insulation properties.Brand Armstrong Chemical Resistance Acetone, Chemical Resistance: Glacial Acetic Acid, Chemical Resistance: Fluid Resistance: Distilled Water, Ammonia, 28%, Chemical Resistance: Fluid Resistance: Salt water, Hexane, Ethyl Acetate, Ethylenedichloride, Toluene Application Type Bond 1 Part or 2 Part 2-Part Material Form Paste Substrate Acrylies, Aluminium, Ceramics, Copper, Glass, Nylon, Polycarbonate, Polyester, Steel, Wood, Cast iron, Titanium, Magnesium, Phenolics, ABS Industry Electrical Manufacturer Henkel Chemistry Epoxy Cure Method 2 Parts Cure Temperature (°C) 93, 149 Cure Time (min) 30, 5.00 Viscosity (cPs) 5,000, 10,000, 130,000 Color Off White, Bronze High Temperature Resistance (°C) 82 Low Temperature Resistance (°C) -51 -
Technical Data for Henkel Armstrong A-2 Epoxy Resin w/ W Activator
Overview
-
Chemical Resistance
- Chemical Resistance : Fluid Resistance : Water Resistance - Distilled Water, Salt water
- Chemical Resistance - Acetone, Ammonia, 28%, Ethyl Acetate, Ethylenedichloride, Hexane, Toluene
- Chemical Resistance : Acid Resistance - Glacial Acetic Acid
-
Application Type
- Adhesive - Bond
-
1 Part or 2 Part
- 2-Part
-
Material Form
- Paste
-
Industry
- Electronics - Electrical
- Industrial - Cryogenic
-
Chemistry
-
Cure Method
- 2-Part Cure - 2 Parts
-
Color
- Off-White - Off White
- Yellow - Bronze
-
Brand
- Armstrong
Specifications
Cure Specs
Cure Temperature (°C) 93, 149 Cure Time (min) 30, 5.00 Viscosity (cPs) 5,000, 10,000, 130,000 Test Method Work / Pot Time (min) 60 to 120 Mix Ratio 100:36 (by weight) Bond Strength
General Bond Strength (psi) 4,700 Test Method Cleavage Strength (psi) 1,700 Test Method Tensile Strength (psi) 4,300, 1,400, 3,100, 5,100 Test Method Material Resistance
High Temperature Resistance (°C) 82 Low Temperature Resistance (°C) -51 Conductivity
Filler Non-metallic oxide Dielectric Strength (V/mil) Excellent Hardness
Elongation (%) 6 Test Method Flexibility Flexible, rigid Other Properties
Specific Gravity 1.450, 1.800, 0.970 Coefficient of Thermal Expansion (CTE) Low, 2.4e-5 (in./ in/°F) Business Information
Shelf Life Details Store below 25°C out of sunlight and in original unopened containers. -
-
Best Practices for Henkel Armstrong A-2 Epoxy Resin w/ W Activator
-
Comparable Materials for Henkel Armstrong A-2 Epoxy Resin w/ W Activator
Spec Engine® Results
-
Armstrong A-2 Epoxy Resin w/ A Activator(Henkel)An off-white, versatile, filled paste resin that has low coefficient of thermal expansion making it ideal for bonding porcelain, glass and ceramics. Exhibits excellent wetting properties and provides strong bonds to rigid materials. Versatility is achieved by selecting one of four recommended activators. Non-metallic oxide fillers provide excellent electrical insulation properties.
-
Armstrong A-2 Epoxy Resin w/ H20 Activator(Henkel)
An off-white, versatile, filled paste resin that has low coefficient of thermal expansion making it ideal for bonding porcelain, glass and ceramics. Exhibits excellent wetting properties and provides strong bonds to rigid materials. Versatility is achieved by selecting one of four recommended activators. Non-metallic oxide fillers provide excellent electrical insulation properties.
-
Armstrong A-2 Epoxy Resin w/ E Activator(Henkel)
An off-white, versatile, filled paste resin that has low coefficient of thermal expansion making it ideal for bonding porcelain, glass and ceramics. Exhibits excellent wetting properties and provides strong bonds to rigid materials. Versatility is achieved by selecting one of four recommended activators. Non-metallic oxide fillers provide excellent electrical insulation properties.
- Compare All
-
Popular Articles
Testing the effectiveness of surface treatments
Read Article
Epoxies in the Medical Device Industry
Read Article
Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation
Read Article
Electrically Conductive Adhesives
Read ArticleSponsored Articles
Unique Advantages of Contact Adhesives
Read Article
Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials
Read Article
Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:
Read Article
Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive
Read ArticleFeatured Ads
Viscosity Test Methods
| Viscosity | Temperature |
|---|---|
| 5,000 cPs | 25°C |
| 10,000 cPs | 40°C |
| 130,000 cPs |
Cleavage Strength Test Methods
| Cleavage Strength | Test Method |
|---|---|
| 1,700 psi | ASTM D1602 |
General Bond Strength Test Methods
| General Bond Strength | Test Method |
|---|---|
| 4,700 psi | ASTM D897 |
Tensile Strength Test Methods
| Tensile Strength | Substrate | Test Temperature | Test Method |
|---|---|---|---|
| 4,300 psi | Aluminum to Aluminum .064" - 2024-T3 | 20 to 25°C Room Temperature | ASTM D-1002 |
| 1,400 psi | Aluminum to Aluminum .064" - 2024-T3 | 82°C | ASTM D-1002 |
| 3,100 psi | Aluminum to Aluminum .064" - 2024-T3 | -51°C | ASTM D-1002 |
| 5,100 psi | ASTM D638 |
Elongation Test Methods
| Elongation | Test Method |
|---|---|
| 6 % | ASTM D638 |
1 VIEW FREE
Don't Leave!
View Henkel - Armstrong A-2 Epoxy Resin w/ W Activator now.
