Henkel Armstrong A-2 Epoxy Resin w/ W Activator

Henkel Armstrong A-2 Epoxy Resin w/ W Activator Datasheet
  • Description for Henkel Armstrong A-2 Epoxy Resin w/ W Activator

    An off-white, versatile, filled paste resin that has low coefficient of thermal expansion making it ideal for bonding porcelain, glass and ceramics. Exhibits excellent wetting properties and provides strong bonds to rigid materials. Versatility is achieved by selecting one of four recommended activators. Non-metallic oxide fillers provide excellent electrical insulation properties.

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    Brand Armstrong
    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Paste
    Substrate Ceramics, Copper, Phenolics, Glass, Aluminium, Cast iron, Magnesium, Titanium, Nylon, ABS, Acrylies, Polycarbonate, Polyester, Steel, Wood
    Industry Electrical
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method 2 Parts
    Cure Temperature (°C) 93, 149
    Cure Time (min) 30, 5.00
    Viscosity (cPs) 5,000, 10,000, 130,000
    Color Off White, Bronze
    Chemical Resistance Acetone, Ammonia, 28%, Distilled Water, Ethyl Acetate, Ethylenedichloride, Glacial Acetic Acid, Hexane, Salt water, Toluene
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -51
  • Technical Data for Henkel Armstrong A-2 Epoxy Resin w/ W Activator

    Overview
    Specifications
    Cure Specs
    Cure Temperature (°C) 93, 149
    Cure Time (min) 30, 5.00
    Viscosity (cPs) 5,000, 10,000, 130,000 Test Method
    Work / Pot Time (min) 60 to 120
    Mix Ratio 100:36 (by weight)
    Bond Strength
    General Bond Strength (psi) 4,700 Test Method
    Cleavage Strength (psi) 1,700 Test Method
    Tensile Strength (psi) 4,300, 1,400, 3,100, 5,100 Test Method
    Material Resistance
    Chemical Resistance Acetone, Ammonia, 28%, Distilled Water, Ethyl Acetate, Ethylenedichloride, Glacial Acetic Acid, Hexane, Salt water, Toluene
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -51
    Conductivity
    Filler Non-metallic oxide
    Dielectric Strength (V/mil) Excellent
    Hardness
    Elongation (%) 6 Test Method
    Flexibility Flexible, rigid
    Other Properties
    Specific Gravity 1.450, 1.800, 0.970
    Coefficient of Thermal Expansion (CTE) Low, 2.4e-5 (in./ in/°F)
    Business Information
    Shelf Life Details Store below 25°C out of sunlight and in original unopened containers.
  • Best Practices for Henkel Armstrong A-2 Epoxy Resin w/ W Activator

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Viscosity Test Methods
Viscosity Temperature
5,000 cPs 25°C
10,000 cPs 40°C
130,000 cPs
Tensile Strength Test Methods
Tensile Strength Substrate Test Temperature Test Method
4,300 psi Aluminum to Aluminum .064" - 2024-T3 20 to 25°C Room Temperature ASTM D-1002
1,400 psi Aluminum to Aluminum .064" - 2024-T3 82°C ASTM D-1002
3,100 psi Aluminum to Aluminum .064" - 2024-T3 -51°C ASTM D-1002
5,100 psi ASTM D638
Cleavage Strength Test Methods
Cleavage Strength Test Method
1,700 psi ASTM D1602
General Bond Strength Test Methods
General Bond Strength Test Method
4,700 psi ASTM D897
Elongation Test Methods
Elongation Test Method
6 % ASTM D638