Henkel Armstrong A-271 Datasheet Henkel Armstrong A-271

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  • Description for Henkel Armstrong A-271

    An amber-colored clear two-part epoxy bonding adhesive, good adhesion to glass due to its wetting ability, good moisture and chemical resistance.

    *See Terms of Use Below

    Brand Armstrong
    Chemical Resistance Good
    Application Type Bonding, Potting
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Substrate Al, Ceramics, Glass, Metal, Plastics, Wood
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method 2-Part Cure
    Cure Temperature (°C) 93, 148, 25, 25
    Cure Time (min) 30, 5.00, 20,160, 1,440
    Viscosity (cPs) 9,000, Non sag, Wetting
    Color Amber, Clear
    High Temperature Resistance (°C) <107, 150
    Low Temperature Resistance (°C) -40

  • Technical Data for Henkel Armstrong A-271

    *See Terms of Use Below

    Overview
    • Chemical Resistance
      • Chemical Resistance - Good
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Substrate
    • Chemistry
    • Cure Method
      • 2-Part Cure
    • Color
      • Clear / Transparent - Clear
      • Red - Amber
    • Brand
      • Armstrong
    Specifications
    Cure Specs
    Cure Temperature (°C) 93, 148, 25, 25 Test Method
    Cure Time (min) 30, 5.00, 20,160, 1,440 Test Method
    Viscosity (cPs) 9,000, Non sag, Wetting Test Method
    Linear Shrinkage (%) Low
    Work / Pot Time (min) 90, 60, 53 Test Method
    Mix Ratio 1.97:1 (by volume), 7:3 (by weight)
    Bond Strength
    General Bond Strength (psi) 2,500, Good Test Method
    Shear Strength (psi) 2,000, 2,800, 2,500 Test Method
    Cleavage Strength (psi) 1,500 Test Method
    Tensile Strength (psi) 8,700 Test Method
    Material Resistance
    High Temperature Resistance (°C) <107, 150 Test Method
    Low Temperature Resistance (°C) -40 Test Method
    Moisture/Humidity Resistance Good moisture resistance
    Hardness
    Elongation (%) 10
    Other Properties
    Specific Gravity 1.100 Test Method
    Coefficient of Thermal Expansion (CTE) 49 (ppm/ °C) Test Method
    Business Information
    Shelf Life Details Store below 25ºC out of sunlight and in original unopened containers. Refer to packaging specific quote for shelf life information., 12 months at 25 °C, Specialty packaging may be less.
    Shelf Life Temperature (°F) <77, 77
    Shelf Life (mon) 12

  • Best Practices for Henkel Armstrong A-271

    *See Terms of Use Below

    1. Surface Preparation

      Surfaced to be bonded should be clean and dry. For critical applications refer to Bulletin No. 964.

    2. Application

      Apply the adhesive to surfaces to be bonded (preferably both surfaces) and press together. Light clamping may be used to keep parts in position during cure.

    3. Mixing

      Bring both components to room temperature prior to mixing.

      Cartridge format: Mixer should be attached keeping the cartridge vertical and any air pocket purged this way. After the mixer contains material, the mixer tip can be dropped to dispense pre-bleed amount. Attach a new static mixer with each cartridge, then pre-bleed the first 3 inches of dispensed material or until a uniform color is obtained. Maintain adequate velocity during dispensing to ensure complete mixing.

      Bulk format: weigh and mix parts A and B accurately and thoroughly, scraping sides of container often. Do not pour from mixing container, transfer to a new container as residual unmixed material may cause a tacky spot on the surface of the casting. Maintain adequate velocity during dispensing to ensure complete mixing.

    4. Curing

      Allow to cure undisturbed until product is fully gelled or tack-free to the touch.

    5. Clean-Up

      Clean up uncured resin with suitable organic solvent such as MEK, acetone or other organic solvent.

  • Comparable Materials for Henkel Armstrong A-271

    *See Terms of Use Below

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    • Resinlab
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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
93°C Extrapolated from Henkel LDS
148°C Extrapolated from Henkel LDS
25°C Optimum, Extrapolated from Henkel LDS
25°C Extrapolated from Henkel LDS
Cure Time Test Methods
Cure Time Test Method
30 min Extrapolated from Henkel LDS
5.00 min Extrapolated from Henkel LDS
20,160 min Optimum, Extrapolated from Henkel LDS
1,440 min Extrapolated from Henkel LDS
Viscosity Test Methods
Viscosity Test Method Temperature
9,000 cPs Mixed, @1/s, Rheometer parallel plate 25mm 455300006291 25°C
Non sag
Wetting
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
90 min 100 g mass, Extrapolated from Henkel LDS 25°C
60 min 1 lb mass, Extrapolated from Henkel LDS 25°C
53 min Pot Life, defined as the time it takes for initial mixed viscosity to double, Rheometer parallel plate 25mm@1/s 455300006291, 25°C
Cleavage Strength Test Methods
Cleavage Strength Cure Time Cure Temperature Test Method
1,500 psi 30 min 93°C Extrapolated from Henkel LDS
General Bond Strength Test Methods
General Bond Strength Cure Time Cure Temperature Test Method
2,500 psi 30 min 93°C Extrapolated from Henkel LDS
Good
Tensile Strength Test Methods
Tensile Strength Cure Time Cure Temperature Test Method
8,700 psi 30 min 93°C Extrapolated from Henkel LDS
Shear Strength Test Methods
Shear Strength Cure Time Cure Temperature Substrate Test Temperature Test Method
2,000 psi 30 min 93°C Al to Al -51°C
2,800 psi 30 min 93°C Al to Al 25°C
2,500 psi 30 min 93°C Al to Al 82°C
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
<107°C Intermediate “in service” temperatures
150°C Operating Temperature, Operating Temperature Range is based on average design requirements and is not intended as a guarantee of suitability for all applications operating at that temperature.
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-40°C Operating Temperature, Operating Temperature Range is based on average design requirements and is not intended as a guarantee of suitability for all applications operating at that temperature.
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C) CTE Test Method
49 (ppm/ °C) 25°C Below Tg, Extrapolated from Henkel LDS
Specific Gravity Test Methods
Specific Gravity Temperature Test Method
1.100 25°C Mixed, calculated, Measured WPG cup