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Description for Henkel Armstrong A-271
An amber-colored clear two-part epoxy bonding adhesive, good adhesion to glass due to its wetting ability, good moisture and chemical resistance.Brand Armstrong Chemical Resistance Good Application Type Bonding, Potting 1 Part or 2 Part 2 Part Material Form Liquid Substrate Al, Ceramics, Glass, Metal, Plastics, Wood Manufacturer Henkel Chemistry Epoxy Cure Method 2-Part Cure Cure Temperature (°C) 93, 148, 25, 25 Cure Time (min) 30, 5.00, 20,160, 1,440 Viscosity (cPs) 9,000, Non sag, Wetting Color Amber, Clear High Temperature Resistance (°C) <107, 150 Low Temperature Resistance (°C) -40
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Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
---|---|
93°C | Extrapolated from Henkel LDS |
148°C | Extrapolated from Henkel LDS |
25°C | Optimum, Extrapolated from Henkel LDS |
25°C | Extrapolated from Henkel LDS |
Cure Time Test Methods
Cure Time | Test Method |
---|---|
30 min | Extrapolated from Henkel LDS |
5.00 min | Extrapolated from Henkel LDS |
20,160 min | Optimum, Extrapolated from Henkel LDS |
1,440 min | Extrapolated from Henkel LDS |
Viscosity Test Methods
Viscosity | Test Method | Temperature |
---|---|---|
9,000 cPs | Mixed, @1/s, Rheometer parallel plate 25mm 455300006291 | 25°C |
Non sag | ||
Wetting |
Work / Pot Time Test Methods
Work / Pot Time | Test Method | Temperature |
---|---|---|
90 min | 100 g mass, Extrapolated from Henkel LDS | 25°C |
60 min | 1 lb mass, Extrapolated from Henkel LDS | 25°C |
53 min | Pot Life, defined as the time it takes for initial mixed viscosity to double, Rheometer parallel plate 25mm@1/s 455300006291, | 25°C |
Cleavage Strength Test Methods
Cleavage Strength | Cure Time | Cure Temperature | Test Method |
---|---|---|---|
1,500 psi | 30 min | 93°C | Extrapolated from Henkel LDS |
General Bond Strength Test Methods
General Bond Strength | Cure Time | Cure Temperature | Test Method |
---|---|---|---|
2,500 psi | 30 min | 93°C | Extrapolated from Henkel LDS |
Good |
Tensile Strength Test Methods
Tensile Strength | Cure Time | Cure Temperature | Test Method |
---|---|---|---|
8,700 psi | 30 min | 93°C | Extrapolated from Henkel LDS |
Shear Strength Test Methods
Shear Strength | Cure Time | Cure Temperature | Substrate | Test Temperature | Test Method |
---|---|---|---|---|---|
2,000 psi | 30 min | 93°C | Al to Al | -51°C | |
2,800 psi | 30 min | 93°C | Al to Al | 25°C | |
2,500 psi | 30 min | 93°C | Al to Al | 82°C |
High Temperature Resistance Test Methods
High Temperature Resistance | Test Method |
---|---|
<107°C | Intermediate “in service” temperatures |
150°C | Operating Temperature, Operating Temperature Range is based on average design requirements and is not intended as a guarantee of suitability for all applications operating at that temperature. |
Low Temperature Resistance Test Methods
Low Temperature Resistance | Test Method |
---|---|
-40°C | Operating Temperature, Operating Temperature Range is based on average design requirements and is not intended as a guarantee of suitability for all applications operating at that temperature. |
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) | CTE Temperature (°C) | CTE Test Method |
---|---|---|
49 (ppm/ °C) | 25°C | Below Tg, Extrapolated from Henkel LDS |
Specific Gravity Test Methods
Specific Gravity | Temperature | Test Method |
---|---|---|
1.100 | 25°C | Mixed, calculated, Measured WPG cup |