Brand Armstrong Application Type Bonding, Potting 1 Part or 2 Part 2 Part Material Form Liquid Substrate Al, Ceramics, Glass, Metal, Plastics, Wood Manufacturer Henkel Chemistry Epoxy Cure Method 2-Part Cure Cure Temperature (°C) 93, 148, 25, 25 Cure Time (min) 30, 5.00, 20,160, 1,440 Viscosity (cPs) 9,000, Non sag, Wetting Color Amber, Clear Chemical Resistance Good High Temperature Resistance (°C) <107, 150 Low Temperature Resistance (°C) -40
Technical Data for Henkel Armstrong A-271
1 Part or 2 Part
- 1 Part or 2 Part - 2 Part
- 2-Part Cure
- Clear / Transparent - Clear
- Red - Amber
Cure Temperature (°C) 93, 148, 25, 25 Test Method Cure Time (min) 30, 5.00, 20,160, 1,440 Test Method Viscosity (cPs) 9,000, Non sag, Wetting Test Method Linear Shrinkage (%) Low Work / Pot Time (min) 90, 60, 53 Test Method Mix Ratio 1.97:1 (by volume), 7:3 (by weight)
General Bond Strength (psi) 2,500, Good Test Method Shear Strength (psi) 2,000, 2,800, 2,500 Test Method Cleavage Strength (psi) 1,500 Test Method Tensile Strength (psi) 8,700 Test Method
Chemical Resistance Good High Temperature Resistance (°C) <107, 150 Test Method Low Temperature Resistance (°C) -40 Test Method Moisture/Humidity Resistance Good moisture resistance
Elongation (%) 10
Specific Gravity 1.100 Test Method Coefficient of Thermal Expansion (CTE) 49 (ppm/ °C) Test Method
Shelf Life Details Store below 25ºC out of sunlight and in original unopened containers. Refer to packaging specific quote for shelf life information., 12 months at 25 °C, Specialty packaging may be less. Shelf Life Temperature (°F) <77, 77 Shelf Life (mon) 12
Best Practices for Henkel Armstrong A-271
Surfaced to be bonded should be clean and dry. For critical applications refer to Bulletin No. 964.
Apply the adhesive to surfaces to be bonded (preferably both surfaces) and press together. Light clamping may be used to keep parts in position during cure.
Bring both components to room temperature prior to mixing.
Cartridge format: Mixer should be attached keeping the cartridge vertical and any air pocket purged this way. After the mixer contains material, the mixer tip can be dropped to dispense pre-bleed amount. Attach a new static mixer with each cartridge, then pre-bleed the first 3 inches of dispensed material or until a uniform color is obtained. Maintain adequate velocity during dispensing to ensure complete mixing.
Bulk format: weigh and mix parts A and B accurately and thoroughly, scraping sides of container often. Do not pour from mixing container, transfer to a new container as residual unmixed material may cause a tacky spot on the surface of the casting. Maintain adequate velocity during dispensing to ensure complete mixing.
Allow to cure undisturbed until product is fully gelled or tack-free to the touch.
Clean up uncured resin with suitable organic solvent such as MEK, acetone or other organic solvent.
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Cure Temperature Test Methods
|Cure Temperature||Cure Time Test Method|
|93°C||Extrapolated from Henkel LDS|
|148°C||Extrapolated from Henkel LDS|
|25°C||Optimum, Extrapolated from Henkel LDS|
|25°C||Extrapolated from Henkel LDS|
Cure Time Test Methods
|Cure Time||Test Method|
|30 min||Extrapolated from Henkel LDS|
|5.00 min||Extrapolated from Henkel LDS|
|20,160 min||Optimum, Extrapolated from Henkel LDS|
|1,440 min||Extrapolated from Henkel LDS|
Viscosity Test Methods
|9,000 cPs||Mixed, @1/s, Rheometer parallel plate 25mm 455300006291||25°C|
Work / Pot Time Test Methods
|Work / Pot Time||Test Method||Temperature|
|90 min||100 g mass, Extrapolated from Henkel LDS||25°C|
|60 min||1 lb mass, Extrapolated from Henkel LDS||25°C|
|53 min||Pot Life, defined as the time it takes for initial mixed viscosity to double, Rheometer parallel plate 25mm@1/s 455300006291,||25°C|
Cleavage Strength Test Methods
|Cleavage Strength||Cure Time||Cure Temperature||Test Method|
|1,500 psi||30 min||93°C||Extrapolated from Henkel LDS|
General Bond Strength Test Methods
|General Bond Strength||Cure Time||Cure Temperature||Test Method|
|2,500 psi||30 min||93°C||Extrapolated from Henkel LDS|
Tensile Strength Test Methods
|Tensile Strength||Cure Time||Cure Temperature||Test Method|
|8,700 psi||30 min||93°C||Extrapolated from Henkel LDS|
Shear Strength Test Methods
|Shear Strength||Cure Time||Cure Temperature||Substrate||Test Temperature||Test Method|
|2,000 psi||30 min||93°C||Al to Al||-51°C|
|2,800 psi||30 min||93°C||Al to Al||25°C|
|2,500 psi||30 min||93°C||Al to Al||82°C|
High Temperature Resistance Test Methods
|High Temperature Resistance||Test Method|
|<107°C||Intermediate “in service” temperatures|
|150°C||Operating Temperature, Operating Temperature Range is based on average design requirements and is not intended as a guarantee of suitability for all applications operating at that temperature.|
Low Temperature Resistance Test Methods
|Low Temperature Resistance||Test Method|
|-40°C||Operating Temperature, Operating Temperature Range is based on average design requirements and is not intended as a guarantee of suitability for all applications operating at that temperature.|
Coefficient of Thermal Expansion (CTE) Test Methods
|Coefficient of Thermal Expansion (CTE)||CTE Temperature (°C)||CTE Test Method|
|49 (ppm/ °C)||25°C||Below Tg, Extrapolated from Henkel LDS|
Specific Gravity Test Methods
|Specific Gravity||Temperature||Test Method|
|1.100||25°C||Mixed, calculated, Measured WPG cup|