• Description for Henkel Armstrong A-271 Epoxy Resin

    Exhibits good moisture and chemical resistance and is suitable for use at intermediate “in service” temperatures up to 225ºF. Because of its low shrinkage and low exotherm, it can be used as a potting compound where glass and strain sensitive elements are being potted.

    *See Terms of Use Below

    Brand Armstrong
    Application Type Bond, Pot
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Ceramic, Glass, Metal, Plastic, Wood, Aluminum
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Part A/Part B
    Cure Temperature (°C) 93, 149
    Cure Time (min) 30, 5.00
    Viscosity (cPs) 1,400,000, Non sag
    Color Amber
    Chemical Resistance Good
    High Temperature Resistance (°C) <107
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
>90 min 100 gm @ 77°F 25°C
>60 min 1 lb. @ 77ºF 25°C
Tensile Strength Test Methods
Tensile Strength Cure Time Cure Temperature Substrate Test Temperature
2,800 psi 30 min 25°C Aluminum 25°C
2,000 psi 30 min -51°C Aluminum -51°C
2,500 psi 30 min 82°C Aluminum 82°C
8,700 psi 30 min
Cleavage Strength Test Methods
Cleavage Strength Cure Time Cure Temperature
1,500 psi 30 min 93°C
General Bond Strength Test Methods
General Bond Strength Cure Time Cure Temperature
2,500 psi 30 min 93°C