Henkel Armstrong A-297 Datasheet Henkel Armstrong A-297

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  • Description for Henkel Armstrong A-297

    Offer long working life combined with fast-elevated temperature cures required by many of today’s high-speed production lines.

    Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

    *See Terms of Use Below

    Brand Armstrong
    Application Type Adhesive
    1 Part or 2 Part 2-Part
    Material Form Liquid, Paste
    Substrate Al, ceramics, Metal, plastics
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method 2 Parts
    Cure Temperature (°C) 149
    Cure Time (min) 30
    Viscosity (cPs) Paste

  • Technical Data for Henkel Armstrong A-297

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
      • Paste
    • Substrate
    • Chemistry
    • Cure Method
      • 2-Part Cure - 2 Parts
    • Brand
      • Armstrong
    Specifications
    Cure Specs
    Cure Temperature (°C) 149
    Cure Time (min) 30
    Viscosity (cPs) Paste
    Work / Pot Time (min) Long Test Method
    Thixotropic Thixotropic
    Mix Ratio 3:2 (by volume), 3:2 (by weight)
    Bond Strength
    General Bond Strength (psi) 1,500, 1,000
    Cleavage Strength (psi) 800, 500
    Tensile Strength (psi) 3,000, 3,000, 700, 500, 2,800, 2,500, 1,000, 1,500 Test Method
    Hardness
    Elongation (%) 10
    Other Properties
    Specific Gravity 1.200 to 1.260, 1.020 to 1.080, 1.160, 1.100 Test Method
    Business Information
    Shelf Life Details Store below 25°C out of sunlight and in original unopened containers., Refer to packaging specific quote for shelf life information.
    Shelf Life Temperature (°F) <77

  • Best Practices for Henkel Armstrong A-297

    *See Terms of Use Below

    1. Surface Preparation

      Surface to be bonded should be clean and dry. For critical applications refer to Bulletin No. 964

    2. Application

      Apply the adhesive to surfaces to be bonded (preferably both surfaces) and press together.

    3. Mixing

      Thoroughly mix the Part B with the Part A in a clean, discardable container, using correct mix ratio. Avoid introduction of excess air.

    4. Curing

      Light clamping may be used to keep parts in position during cure.

      Cure as desired

  • Comparable Materials for Henkel Armstrong A-297

    *See Terms of Use Below

    Spec Engine® Results

    • Henkel
      Loctite Ablestik 64C(Henkel)

      A low cost, two component, non-silver, electrically conductive epoxy adhesive.

    • WEICON
      Aluminium Minute Adhesive(WEICON)

      An odourless, two-component epoxy adhesive filled with aluminium. It cures fast at room temperature and practically without shrinkage. is gap-filling and non-dripping (thixotropic) and shows very high tensile, impact and peel strength.

    • Epoxy Technology
      Epo-Tek H21D(Epoxy Technology)

      A two component, high Tg, silver-filled epoxy designed for chip bonding in microelectronic and optoelectronic applications. Contains no solvents or thinners. NASA approved, low outgassing epoxy.

    • Compare All
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Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
Long
Tensile Strength Test Methods
Tensile Strength Cure Time Cure Temperature Substrate Test Temperature Test Method
3,000 psi 30 min 149°C al/al 25°C CURED SYSTEM A-297, Cured 30 minutes @ 300°F
3,000 psi 30 min 149°C al/al 25°C CURED SYSTEM A-297, Cured 30 minutes @ 300°F
700 psi 30 min 149°C al/al 82°C CURED SYSTEM A-297, Cured 30 minutes @ 300°F
500 psi 30 min 149°C al/al 82°C CURED SYSTEM A-297, Cured 30 minutes @ 300°F
2,800 psi 30 min 149°C al/al -51°C CURED SYSTEM A-297, Cured 30 minutes @ 300°F
2,500 psi 30 min 149°C al/al -51°C CURED SYSTEM A-297, Cured 30 minutes @ 300°F
1,000 psi 30 min 149°C CURED SYSTEM A-297, Cured 30 minutes @ 300°F
1,500 psi 30 min 149°C CURED SYSTEM A-297, Cured 30 minutes @ 300°F
Specific Gravity Test Methods
Specific Gravity Test Method
1.200 to 1.260 A-297 "A"
1.020 to 1.080 A-297 "B"
1.160 A-297, CURED SYSTEM
1.100 A-297, CURED SYSTEM