Henkel Armstrong A-3 Epoxy Resin w/ A Activator Datasheet Henkel Armstrong A-3 Epoxy Resin w/ A Activator

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  • Description for Henkel Armstrong A-3 Epoxy Resin w/ A Activator

    Adhesive formulated from specification controlled epoxy resins and inert, high purity filler materials. Contain ingredients that impart low, surface free energy characteristics, giving it excellent wettability to adherents that are traditionally hard to bond.

    Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

    *See Terms of Use Below

    Brand Armstrong
    Chemical Resistance Acetone, Chemical Resistance: Fluid Resistance: Salt water, Chemical Resistance: Glacial Acetic Acid, Ammonia, 28%, Chemical Resistance: Fluid Resistance: Distilled Water, Hexane, Ethyl Acetate, Ethylenedichloride, Toluene
    Application Type Bond
    1 Part or 2 Part 2-Part
    Material Form Paste
    Substrate Ceramics, Glass, Metal, Thermosetting Plastics, Rubber, Wood, Steel
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method 2 Parts
    Cure Temperature (°C) 20 to 25, 74
    Cure Time (min) 10,080, 120
    Viscosity (cPs) 5,000
    Color Black
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -51
    Volume Resistivity (O) 3.0e14 (ohms/cm)
    Density (g/cm³) 0.000 0.058 (lbs/cubic in)

  • Technical Data for Henkel Armstrong A-3 Epoxy Resin w/ A Activator

    *See Terms of Use Below

    Overview
    • Chemical Resistance
      • Chemical Resistance : Fluid Resistance : Water Resistance - Distilled Water, Salt water
      • Chemical Resistance - Acetone, Ammonia, 28%, Ethyl Acetate, Ethylenedichloride, Hexane, Toluene
      • Chemical Resistance : Acid Resistance - Glacial Acetic Acid
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Paste
    • Substrate
    • Chemistry
    • Cure Method
      • 2-Part Cure - 2 Parts
    • Color
      • Black
    • Brand
      • Armstrong
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25, 74
    Cure Time (min) 10,080, 120
    Viscosity (cPs) 5,000 Test Method
    Set Time (min) Fast
    Work / Pot Time (min) 30 Test Method
    Mix Ratio 100:4 (by weight)
    Bond Strength
    General Bond Strength (psi) 1,110, 2,130 Test Method
    Cleavage Strength (psi) 770, 1,400 Test Method
    Compressive Strength (psi) 10.8 (psi) X 1000, 13.3 (psi) x1000 Test Method
    Tensile Strength (psi) 3,070, 4,740, 1,530, 880, 890, 2,380, 1,750, 2,300, 2,280, 1,830, 2,050, 2,200, 1,200, 950, 1,530, 2,160, 3,250, 1,425, 1,970, 1,600, 1,720, 1,730, 1,510, 1,700, 1,470, 1,560, 1,970, 1,900 Test Method
    Material Resistance
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -51
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Filler Inert, High purity materials
    Volume Resistivity (O) 3.0e14 (ohms/cm) Test Method
    Hardness
    Elongation (%) 1, 2 Test Method
    Other Properties
    Specific Gravity 1.600
    Coefficient of Thermal Expansion (CTE) 4.2e-5 (in./ in/°C) Test Method
    Density (g/cm³) 0.000 0.058 (lbs/cubic in)
    Business Information
    Shelf Life Details Store below 25°C out of sunlight and in original unopened containers. Refer to packaging specific quote for shelf life information.
    Shelf Life Temperature (°F) <77

  • Best Practices

    Best Practices information currently not available.

  • Comparable Materials for Henkel Armstrong A-3 Epoxy Resin w/ A Activator

    *See Terms of Use Below

    Spec Engine® Results

    • Henkel
      Armstrong A-2 Epoxy Resin w/ A Activator(Henkel)

      An off-white, versatile, filled paste resin that has low coefficient of thermal expansion making it ideal for bonding porcelain, glass and ceramics. Exhibits excellent wetting properties and provides strong bonds to rigid materials. Versatility is achieved by selecting one of four recommended activators. Non-metallic oxide fillers provide excellent electrical insulation properties.

    • Henkel
      Armstrong A-2 Epoxy Resin w/ W Activator(Henkel)

      An off-white, versatile, filled paste resin that has low coefficient of thermal expansion making it ideal for bonding porcelain, glass and ceramics. Exhibits excellent wetting properties and provides strong bonds to rigid materials. Versatility is achieved by selecting one of four recommended activators. Non-metallic oxide fillers provide excellent electrical insulation properties.

    • Henkel
      Armstrong A-2 Epoxy Resin w/ H20 Activator(Henkel)

      An off-white, versatile, filled paste resin that has low coefficient of thermal expansion making it ideal for bonding porcelain, glass and ceramics. Exhibits excellent wetting properties and provides strong bonds to rigid materials. Versatility is achieved by selecting one of four recommended activators. Non-metallic oxide fillers provide excellent electrical insulation properties.

    • Compare All
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Viscosity Test Methods
Viscosity Temperature
5,000 cPs 25°C
Work / Pot Time Test Methods
Work / Pot Time Temperature
30 min 25°C
Tensile Strength Test Methods
Tensile Strength Cure Time Cure Temperature Substrate Chemical Test Time Test Temperature Test Humidity
3,070 psi 10,080 min 25°C
4,740 psi 120 min 74°C
1,530 psi 10,080 min 25°C 25°C
880 psi 10,080 min 25°C 82°C
890 psi 10,080 min 25°C -51°C
2,380 psi 10,080 min 25°C Ammonia, 28% >0.00 min
1,750 psi 10,080 min 25°C Distilled Water >0.00 min
2,300 psi 10,080 min 25°C Salt water. 10% >0.00 min
2,280 psi 10,080 min 25°C Acetone >0.00 min
1,830 psi 10,080 min 25°C Glacial Acetic Acid >0.00 min
2,050 psi 10,080 min 25°C Toluene >0.00 min
2,200 psi 10,080 min 25°C Ethylenedichloride >0.00 min
1,200 psi 10,080 min 25°C Ethyl Acetate >0.00 min
950 psi 10,080 min 25°C Hexane >0.00 min
1,530 psi 10,080 min 25°C >0.00 min 100 %
2,160 psi 120 min 74°C 82°C
3,250 psi 120 min 74°C -51°C
1,425 psi 120 min 74°C Ammonia, 28% >0.00 min
1,970 psi 120 min 74°C Distilled Water >0.00 min
1,600 psi 120 min 74°C Salt water. 10% >0.00 min
1,720 psi 120 min 74°C Acetone >0.00 min
1,730 psi 120 min 74°C Glacial Acetic Acid >0.00 min
1,510 psi 120 min 74°C Toluene >0.00 min
1,700 psi 120 min 74°C Ethylenedichloride >0.00 min
1,470 psi 120 min 74°C Ethyl Acetate >0.00 min
1,560 psi 120 min 74°C Hexane >0.00 min
1,970 psi 120 min 74°C >0.00 min
1,900 psi 120 min 74°C 100 %
Cleavage Strength Test Methods
Cleavage Strength Cure Time Cure Temperature
770 psi 10,080 min 25°C
1,400 psi 120 min 74°C
Compressive Strength Test Methods
Compressive Strength Cure Time Cure Temperature Test Method
10.8 (psi) X 1000 10,080 min 25°C Ult.
13.3 (psi) x1000 120 min 74°C Ult.
General Bond Strength Test Methods
General Bond Strength Cure Time Cure Temperature
1,110 psi 0.00 min 25°C
2,130 psi 0.00 min
Volume Resistivity Test Methods
Volume Resistivity Temp (°C)
3.0e14 (ohms/cm) 93°C
Elongation Test Methods
Elongation Test Method
1 % 7 days @ R.T
2 % 2 hrs @ 165°F
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
4.2e-5 (in./ in/°C) 7 days @ R.T.