Henkel Armstrong A-3 Epoxy Resin w/ E Activator Datasheet Henkel Armstrong A-3 Epoxy Resin w/ E Activator

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  • Description for Henkel Armstrong A-3 Epoxy Resin w/ E Activator

    Adhesive formulated from specification controlled epoxy resins and inert, high purity filler materials. Contain ingredients that impart low, surface free energy characteristics, giving it excellent wettability to adherents that are traditionally hard to bond.

    Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

    *See Terms of Use Below

    Brand Armstrong
    Chemical Resistance Acetone, Chemical Resistance: Fluid Resistance: Distilled Water, Chemical Resistance: Glacial Acetic Acid, Ammonia, 28%, Chemical Resistance: Fluid Resistance: Salt water, 10%, Hexane, Ethyl Acetate, Ethylenedichloride, Toluene
    Application Type Bond
    1 Part or 2 Part 2-Part
    Material Form Paste
    Substrate Ceramics, Glass, Metal, Thermosetting Plastics, Rubber, Wood, Steel
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method 2 Parts
    Cure Temperature (°C) 93
    Cure Time (min) 60
    Viscosity (cPs) 4,900
    Color Black
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -51
    Volume Resistivity (O) 3.0e14 (Ohm/cm)

  • Technical Data for Henkel Armstrong A-3 Epoxy Resin w/ E Activator

    *See Terms of Use Below

    Overview
    • Chemical Resistance
      • Chemical Resistance : Fluid Resistance : Water Resistance - Distilled Water, Salt water, 10%
      • Chemical Resistance - Acetone, Ammonia, 28%, Ethyl Acetate, Ethylenedichloride, Hexane, Toluene
      • Chemical Resistance : Acid Resistance - Glacial Acetic Acid
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Paste
    • Substrate
    • Chemistry
    • Cure Method
      • 2-Part Cure - 2 Parts
    • Color
      • Black
    • Brand
      • Armstrong
    Specifications
    Cure Specs
    Cure Temperature (°C) 93
    Cure Time (min) 60
    Viscosity (cPs) 4,900 Test Method
    Set Time (min) Fast initial
    Work / Pot Time (min) 120 to 180 Test Method
    Mix Ratio 100:6 (by weight)
    Bond Strength
    General Bond Strength (psi) 4,500 Test Method
    Compressive Strength (psi) 13.1 (psi) x 1000 Test Method
    Tensile Strength (psi) 5,180, 2,250, 1,700, 1,980, 3,030, 3,130, 3,100, 2,830, 2,350, 2,780, 2,800, 2,000, 2,180, 2,390, 3,350 Test Method
    Material Resistance
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -51
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Filler Inert, High purity materials
    Volume Resistivity (O) 3.0e14 (Ohm/cm) Test Method
    Hardness
    Shore D Hardness 85
    Elongation (%) 2
    Other Properties
    Specific Gravity 1.600
    Coefficient of Thermal Expansion (CTE) 4.4e-5 (in./ in/°C)
    Business Information
    Shelf Life Details Stored below 25°C out of sunlight and in original unopened containers. Refer to packaging specific quote for shelf life information.
    Shelf Life Temperature (°F) <77

  • Best Practices

    Best Practices information currently not available.

  • Comparable Materials for Henkel Armstrong A-3 Epoxy Resin w/ E Activator

    *See Terms of Use Below

    Spec Engine® Results

    • Henkel
      Armstrong A-2 Epoxy Resin w/ A Activator(Henkel)

      An off-white, versatile, filled paste resin that has low coefficient of thermal expansion making it ideal for bonding porcelain, glass and ceramics. Exhibits excellent wetting properties and provides strong bonds to rigid materials. Versatility is achieved by selecting one of four recommended activators. Non-metallic oxide fillers provide excellent electrical insulation properties.

    • Henkel
      Armstrong A-2 Epoxy Resin w/ W Activator(Henkel)

      An off-white, versatile, filled paste resin that has low coefficient of thermal expansion making it ideal for bonding porcelain, glass and ceramics. Exhibits excellent wetting properties and provides strong bonds to rigid materials. Versatility is achieved by selecting one of four recommended activators. Non-metallic oxide fillers provide excellent electrical insulation properties.

    • Henkel
      Armstrong A-2 Epoxy Resin w/ H20 Activator(Henkel)

      An off-white, versatile, filled paste resin that has low coefficient of thermal expansion making it ideal for bonding porcelain, glass and ceramics. Exhibits excellent wetting properties and provides strong bonds to rigid materials. Versatility is achieved by selecting one of four recommended activators. Non-metallic oxide fillers provide excellent electrical insulation properties.

    • Compare All
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Viscosity Test Methods
Viscosity Temperature
4,900 cPs 25°C
Work / Pot Time Test Methods
Work / Pot Time Temperature
120 to 180 min 25°C
Tensile Strength Test Methods
Tensile Strength Cure Time Cure Temperature Substrate Chemical Test Time Test Temperature Test Humidity
5,180 psi 60 min 93°C
2,250 psi 60 min 93°C 25°C
1,700 psi 60 min 93°C 82°C
1,980 psi 60 min 93°C -51°C
3,030 psi 60 min 93°C Ammonia, 28% 10,080 min
3,130 psi 60 min 93°C Distilled Water 10,080 min
3,100 psi 60 min 93°C Salt Water, 10% 10,080 min
2,830 psi 60 min 93°C Acetone 10,080 min
2,350 psi 60 min 93°C Glacial Acetic Acid 10,080 min
2,780 psi 60 min 93°C Toluene 10,080 min
2,800 psi 60 min 93°C Ethylenedichloride 10,080 min
2,000 psi 60 min 93°C Ethyl Acetate 10,080 min
2,180 psi 60 min 93°C Hexane 10,080 min
2,390 psi 60 min 93°C 43,200 min 100 %
3,350 psi 60 min 93°C Steel to Steel
Cleavage Strength Test Methods
Cleavage Strength Cure Time Cure Temperature
Compressive Strength Test Methods
Compressive Strength Cure Time Cure Temperature Test Method
13.1 (psi) x 1000 60 min 93°C Ult.
General Bond Strength Test Methods
General Bond Strength Cure Time Cure Temperature
4,500 psi 60 min 93°C
Volume Resistivity Test Methods
Volume Resistivity Temp (°C)
3.0e14 (Ohm/cm) 14,653°C