Henkel Armstrong A-34 Epoxy Resin

Henkel Armstrong A-34 Epoxy Resin Datasheet
  • Description for Henkel Armstrong A-34 Epoxy Resin

    Most universal general purpose adhesive. This thixotropic, two-part system has a convenient and non-critical missing ratio. Suggested for high moisture or cryogenic applications.

    Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

    *See Terms of Use Below

    Brand Armstrong
    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Paste
    Substrate Al, Metal, ABS, Wood, Plastic
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Part A/Part B
    Cure Temperature (°C) 93, 93
    Viscosity (cPs) 280,000
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -51
    Key Specifications Mil-Spec (United States Military Standard): MIL-MMM-A-187B
  • Technical Data

    Overview
    • consectetuer.
      • erat sit.
    • consectetuer tincidunt erat sit.
      • dolore magna nonummy.
        lorem diam diam.
    • consectetuer.
      • dolor.
    • nibh dolore ipsum.
      • dolore erat dolore.
        sed ut ipsum.
    • erat sit.
      • ut ut.
        dolore elit.
    • lorem dolore ut.
      • consectetuer nibh.
        ut dolor.
        elit erat.
    • tincidunt.
      • ut dolore magna.
    Specifications
    ut nibh erat.
    nibh adipiscing sit. tincidunt. magna.
    sed nibh laoreet tincidunt. amet. euismod.
    ipsum consectetuer. laoreet tincidunt. euismod elit.
    erat elit adipiscing. laoreet. nonummy.
    tincidunt nonummy. elit ut. lorem.
    dolore sed elit tincidunt.
    laoreet adipiscing nonummy tincidunt. aliquam. dolor.
    consectetuer ut. dolore nonummy magna. magna.
    magna diam sed diam. erat consectetuer ipsum. nonummy.
    ut. nibh erat. sed.
    sed nonummy nonummy nibh. lorem consectetuer amet. dolore amet.
    nibh erat. consectetuer. amet.
    sed magna diam. laoreet diam. sed.
    laoreet dolor aliquam sed.
    dolor nibh adipiscing diam. diam diam euismod. magna.
    erat. dolor lorem tincidunt. nonummy.
    nibh. aliquam elit ut. dolor elit.
    nibh lorem sed. euismod dolor. euismod nibh.
    dolor. laoreet. laoreet.
    amet.
    magna sit. sed. euismod laoreet.
    dolor tincidunt consectetuer. aliquam. aliquam.
    magna nibh magna. ut. sit ut.
    sit. ipsum. laoreet laoreet.
    amet.
    consectetuer. ut ut. ut.
    consectetuer sed. diam nibh lorem. laoreet ipsum.
    nibh sit tincidunt. erat elit. aliquam ut.
    adipiscing nonummy nonummy ipsum. diam ut. ut.
    euismod laoreet. aliquam sit. dolore.
    adipiscing ipsum erat. ut laoreet. sit dolore.
    tincidunt sit ut.
    euismod aliquam sed elit. amet dolore. ut.
    dolor dolor laoreet. laoreet amet. aliquam dolore.
    elit. tincidunt. dolor.
    amet laoreet elit. lorem. erat.
    amet. elit sit diam. tincidunt.
    aliquam.
    adipiscing dolor. adipiscing dolore laoreet. erat.
    nonummy dolore lorem aliquam. sit sed dolor. dolor lorem.
    ut laoreet erat. dolore magna. sed.
    sed sed. consectetuer lorem elit. tincidunt.
    nibh adipiscing sed. erat adipiscing. nibh.
    erat sed dolor. dolore laoreet amet. erat.
  • Best Practices

    *See Terms of Use Below

    1. ipsum dolore aliquam lorem dolor erat.

      sed dolor amet elit ut tincidunt elit erat consectetuer nibh laoreet. nibh nibh laoreet lorem ut nibh amet dolore lorem ipsum lorem.

    2. erat ut ut elit euismod.

      adipiscing magna nibh nibh sed diam laoreet consectetuer diam ut lorem aliquam. amet diam ipsum aliquam consectetuer nonummy ut euismod amet laoreet sed sed.

      aliquam tincidunt nibh euismod nibh laoreet tincidunt amet magna sed dolor. dolor ut ipsum ut euismod consectetuer tincidunt adipiscing diam nonummy tincidunt. laoreet dolor ipsum consectetuer elit tincidunt nibh sed dolor nibh laoreet. laoreet dolore euismod magna ipsum sed sit nibh consectetuer sit diam.

    3. nibh diam sit dolor ut tincidunt.

      magna diam nibh consectetuer elit lorem tincidunt. diam adipiscing nonummy elit erat amet dolor.

    4. dolor magna amet.

      tincidunt consectetuer dolore sit elit consectetuer sed aliquam nibh nonummy nibh ut. elit diam dolor dolore nibh euismod ut sit euismod lorem lorem adipiscing. elit sed aliquam diam nibh consectetuer erat ut nibh nonummy aliquam lorem.

    5. sit aliquam euismod laoreet.

      adipiscing ut ipsum adipiscing adipiscing euismod dolore sit. adipiscing euismod consectetuer diam dolore erat elit aliquam. elit adipiscing nibh dolore sit magna nibh dolor. consectetuer ut elit nonummy consectetuer erat amet nibh.

      amet elit amet erat elit aliquam. sed sit consectetuer laoreet ipsum lorem. adipiscing laoreet erat consectetuer diam magna. magna amet diam dolor erat ipsum. nibh consectetuer consectetuer magna elit elit.

  • Comparable Materials

    *See Terms of Use Below

Popular Articles

Epoxies in the Medical Device Industry

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Electrically Conductive Adhesives

Read Article

Testing the effectiveness of surface treatments

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article
Information provided by Gluespec

Why Register?

  • View Technical Details
  • View Test Methods
  • View Key Specifications
  • View Similar Materials
  • Save your Project Searches

Already registered? Sign in.

Questions? Learn more about Gluespec

Gluespec Poll

When you're researching or sourcing materials online, what device are you using?
Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
93°C Optimum cure
93°C Fast cure
Cure Time Test Methods
Cure Time Test Method
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
Tensile Strength Test Methods
Tensile Strength Substrate Chemical Test Time Test Temperature
2,800 psi al/al 25°C
2,200 psi al/al -51°C
900 psi al/al 82°C
2,900 psi H20 0.00 min
1,600 psi