Henkel Armstrong A-34 Epoxy Resin

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Description for Henkel Armstrong A-34 Epoxy Resin

Most universal general purpose adhesive. This thixotropic, two-part system has a convenient and non-critical missing ratio. Suggested for high moisture or cryogenic applications.

Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

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Brand	Armstrong
Application Type	Bond
1 Part or 2 Part	2-Part
Material Form	Paste
Substrate	Al, Metal, Plastic, Wood, ABS
Manufacturer	Henkel
Chemistry	Epoxy
Cure Method	Part A/Part B
Cure Temperature (°C)	93, 93
Viscosity (cPs)	280,000
High Temperature Resistance (°C)	82
Low Temperature Resistance (°C)	-51
Key Specifications	Mil-Spec (United States Military Standard): MIL-MMM-A-187B

Best Practices for Henkel Armstrong A-34 Epoxy Resin

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Technical Data for Henkel Armstrong A-34 Epoxy Resin

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Overview

Application Type
- Adhesive - Bond
1 Part or 2 Part
- 2-Part
Material Form
- Paste
Substrate
- Metal
- Aluminum - Al
- Plastic
- ABS
- Wood
Industry
- Industrial - Cryogenic
Chemistry
- Epoxy
Cure Method
- 2-Part Cure - Part A/Part B
Key Specifications
- Mil-Spec (United States Military Standard) : MMM-A-187B - MIL-MMM-A-187B
Brand
- Armstrong

Specifications

Cure Specs

Cure Temperature (°C)	93, 93	Test Method
Viscosity (cPs)	280,000
Thixotropic	Thixotropic
Mix Ratio	1:1 (by volume), 1:1 (by weight)

Bond Strength

General Bond Strength (psi)	1,500
Cleavage Strength (psi)	1,500
Tensile Strength (psi)	2,800, 2,200, 900, 2,900, 1,600	Test Method

Material Resistance

High Temperature Resistance (°C)	82
Low Temperature Resistance (°C)	-51

Hardness

Shore D Hardness	84
Elongation (%)	<5

Other Properties

Specific Gravity	1.450
Coefficient of Thermal Expansion (CTE)	4.2e-5 (in./ in/°C)

Business Information

Shelf Life Details	Shelf life is one year when stored below 90°F out of sunlight and in original unopened containers of pints or greater. Shelf life will vary with specialty packages.
Shelf Life Temperature (°F)	<90
Shelf Life (mon)	12

Best Practices for Henkel Armstrong A-34 Epoxy Resin

*See Terms of Use Below
1. Surface Preparation
  
  Surfaced to be bonded should be clean and dry. For critical applications refer to Bulletin No. 964
2. Application
  
  Apply the adhesive to surfaces to be bonded (preferably both surfaces) and press together. Light clamping may be used to keep parts in position during cure.
3. Mixing
  
  Thoroughly mix A-34 Part B with A-34 Part A in a clean, discardable container, suing correct mix ratio. Avoid introduction of excess air.
Comparable Materials for Henkel Armstrong A-34 Epoxy Resin

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Spec Engine^® Results
- EP1026T3 Clear(Resinlab)
  A two part component unfilled epoxy adhesive designed for high-speed bonding of metals, ceramics, and most plastics an it will have good resistance to water, salt spray, inorganic acids and bases, and most organic solvents.
- Epo-Tek 930(Epoxy Technology)
  A two-part thermally conductive epoxy for heat sinking electronics and hybrids. It can be used at the PCB level for circuit assembly.
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- Armstrong A-2 Epoxy Resin w/ A Activator(Henkel)
  An off-white, versatile, filled paste resin that has low coefficient of thermal expansion making it ideal for bonding porcelain, glass and ceramics. Exhibits excellent wetting properties and provides strong bonds to rigid materials. Versatility is achieved by selecting one of four recommended activators. Non-metallic oxide fillers provide excellent electrical insulation properties.
- Armstrong A-2 Epoxy Resin w/ W Activator(Henkel)
  An off-white, versatile, filled paste resin that has low coefficient of thermal expansion making it ideal for bonding porcelain, glass and ceramics. Exhibits excellent wetting properties and provides strong bonds to rigid materials. Versatility is achieved by selecting one of four recommended activators. Non-metallic oxide fillers provide excellent electrical insulation properties.
- Armstrong A-2 Epoxy Resin w/ E Activator(Henkel)
  An off-white, versatile, filled paste resin that has low coefficient of thermal expansion making it ideal for bonding porcelain, glass and ceramics. Exhibits excellent wetting properties and provides strong bonds to rigid materials. Versatility is achieved by selecting one of four recommended activators. Non-metallic oxide fillers provide excellent electrical insulation properties.
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