Brand Armstrong Application Type Bond 1 Part or 2 Part 2 Part Material Form Liquid Substrate Metal, Wood Manufacturer Henkel Chemistry Epoxy, Polyamide amide Application Method Metal spatula, Trowel Cure Method Part A/Part B Cure Temperature (°C) 20 to 25 Room Temperature, 99 Cure Time (min) 10,080, 120 Chemical Resistance Anti-icing fluid, Hydraulic oil, Hydrocarbon fuel, Jet fuel, Salt spray Key Specifications Mil-Spec (United States Military Standard): MMM-A-134: MIL-MMM-A-134, Type II
Technical Data for Henkel Armstrong A-40 Epoxy Resin
- Adhesive - Bond
1 Part or 2 Part
- 1 Part or 2 Part - 2 Part
- Other - Polyamide amide
- Dispenser - Mechanical applicator, Wooden coffee-stirrer
- Spatula/Trowel - Metal spatula, Trowel
- 2-Part Cure - Part A/Part B
- Mil-Spec (United States Military Standard): MMM-A-134: Type II - MIL-MMM-A-134, Type II
Cure Temperature (°C) 20 to 25 Room Temperature, 99 Cure Time (min) 10,080, 120 Work / Pot Time (min) 180, 120 to 630, 45 Test Method Mix Ratio 5:2 (by weight)
Chemical Resistance Anti-icing fluid, Hydraulic oil, Hydrocarbon fuel, Jet fuel, Salt spray Environmental Resistance Exceptional
Filler Polyamide amide, Inert
Shore D Hardness 77 Elongation (%) 2
Shelf Life Details Store below 25°C out of sunlight and in original unopened containers. Refer to packaging specific quote for shelf life information. Shelf Life Temperature (°F) <77
Best Practices for Henkel Armstrong A-40 Epoxy Resin
Surfaces to be bonded should be clean and dry. For critical applications, refer to our suggested surface preparation procedures — Bulletin No. 964
Property mixed material may be applied to the surfaces being bonded with a mechanical applicator or any clean tool such as a metal spatula, trowel, wooden coffeestirrer, or equivalent. The material should be spread thinly and evenly. Glue lines as thick as .101” will provide good strength but the general rule is—the thinner the better. The important thing is that the surfaces being bonded are thoroughly “welted out” with the resin system. Once applied, the joints being bonded should be assembled immediately
under no circumstances would this open assembly times exceed 30 minutes. No pressure is required other than that necessary to hold to assembly in position until the resin cures. Then uncured material may be removed from mixing utensils etc. with solvent such as Methyl Ethyl ketone (MEK) and/ or Cellosolve or equivalent.
The mix ratio for A-40 is 5 parts of Part A to 2 parts of Part B by weight. The concentration of Part B may be varied = 10% of the recommended amount without seriously affecting the physical properties other than the working life. For best results, the temperature of the Part A and Part B should be between 70° to 90°F. before mixing. Lower and higher temperatures can be employed but the working life will be reduced as the temperature is increased and the working life will be extended as the temperature decreases. At lower temperatures, the material is quiet vouches and not as easy to mix.
A-40 should not be thinned with solvent at any time. The Part A and the Part B must be thoroughly mixed before the system is ready for use.
A-40 should be cured as follows: 7 days at room temperature or 2 hours at 210°F. Where military specification qualification is necessary the 2 hour cure at 210°F must be followed.
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