Henkel Armstrong A-42

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Description for Henkel Armstrong A-42

Two components Part A and Part B which are mixed together prior to use. Part A consists of an epoxy resin and inert fillers. Part B consists of a polyamide amide.

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Brand	Armstrong
Application Type	Bond
1 Part or 2 Part	2 Part
Material Form	Liquid
Substrate	Al
Manufacturer	Henkel
Chemistry	Epoxy
Application Method	Trowel, metal spatula
Cure Method	Resin/hardener
Cure Temperature (°C)	25 Room Temperature, 100
Cure Time (min)	10,080, 120
Viscosity (cPs)	280,000

Best Practices for Henkel Armstrong A-42

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Technical Data for Henkel Armstrong A-42

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Overview

Application Type
- Adhesive - Bond
1 Part or 2 Part
- 1 Part or 2 Part - 2 Part
Material Form
- Liquid
Substrate
- Aluminum - Al
Chemistry
- Epoxy
Application Method
- Dispenser - mechanical applicator, any clean tool, wooden coffee-stirrer or equivalent
- Spray
- Spatula/Trowel - metal spatula, Trowel
Cure Method
- 2-Part Cure - Resin/hardener
Brand
- Armstrong

Specifications

Cure Specs

Application Temperature (°F)	70 to 90
Cure Temperature (°C)	25 Room Temperature, 100
Cure Time (min)	10,080, 120
Viscosity (cPs)	280,000
Fixture or Handling Strength Time (min)	Overnight	Test Method
Work / Pot Time (min)	90	Test Method

Bond Strength

Shear Strength (psi)	>2,500, >1,500	Test Method

Business Information

Shelf Life Details	Storage: Store below 25°C out of sunlight and in original unopened containers. Refer to packaging specific quote for shlef life information.
Shelf Life Temperature (°F)	<77

Best Practices for Henkel Armstrong A-42

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1. Surface Preparation
  
  Surface to be bonded should be clean and dry.
2. Application
  
  The material should be spread thinly and evenly. Glue lines as thick as .101" will provide good strength but the general rule is--- the thinner the better. The important thing is that the surfaces being bonded are thoroughly "welted out" with the resin system. Once applied, the joints being bonded should be assembled immediately, under no circumstances would this open assembly times exceed 30 minutes. No pressure is required other than that necessary to hold to assembly in position until the resin cures.
3. Mixing
  
  The Part A and Part B must be thoroughly mixed before the system is ready for use.
4. Curing
  
  Lower and higher temperatures can be employed but the working life will be reduced as the temperature is increased and the working life will be extended as the temperature decreases. At lower temperatures, the material is quiet vouches and not as easy to mix.
5. Curing
  
  Either mixture may be cured for 24 hours @ 77°F. Curing can be accelerated by heating for 1 - 2 hours at 165°F.
6. Clean-Up
  
  Then uncured material may be removed from mixing utensils etc. with solvent such as Methyl Ethyl ketone (MEK) and/or Cellosolve or equivalent.
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