Henkel Armstrong A-661 Epoxy Resin Adhesive

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Description for Henkel Armstrong A-661 Epoxy Resin Adhesive

A two-component, room temperature curing adhesive which produces bonds with excellent shear strength, even after long-term exposure at temperatures up to 400°F.

*See Terms of Use Below

Brand	Armstrong
Application Type	Bond
1 Part or 2 Part	2 Part
Material Form	Paste
Substrate	Ceramic, Aluminium, Metal, Plastic, Steel, Wood
Manufacturer	Henkel
Chemistry	Epoxy
Cure Method	2-Part Cure, Room temperature curing
Cure Temperature (°C)	20 to 25 Room Temperature, 74, 149
Cure Time (min)	Over night
Viscosity (cPs)	Non sag, Thixotropic

Best Practices for Henkel Armstrong A-661 Epoxy Resin Adhesive

*See Terms of Use Below

Surface Preparation

The surfaces to be bonded should be clean and dry (for critical applications refer to our suggested surface preparation procedures - Bulletin No. 964)
Application

Apply the adhesive to surfaces to be bonded (preferably both surfaces) and press together. Light clamping may be used to keep parts in position during curing.
Mixing

Thoroughly mix the A-661 Part B with the A-661 part A in a clean discardable container using correct mix ratio. Avoid the introduction of excess air.

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Technical Data

Overview

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Specifications

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nibh ipsum.	consectetuer nonummy laoreet.	nibh diam.

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elit laoreet euismod adipiscing.	dolor sit.	tincidunt.
magna aliquam ut.	nonummy aliquam.	sit consectetuer.
adipiscing.	sed sed.	ipsum dolore.
ut sed tincidunt sit.	nibh euismod.	erat sit.
nibh sit lorem magna.	dolor sed sed.	nibh.

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consectetuer lorem sed adipiscing.	amet.	adipiscing.
diam laoreet.	lorem sit.	ut.
dolore.	dolore.	magna.
magna ut consectetuer elit.	erat magna.	ut ut.
ipsum erat nibh sit.	sed lorem dolore.	magna.
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amet.	magna nonummy tincidunt.	aliquam.

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ipsum ipsum ipsum erat.	consectetuer consectetuer.	euismod.
nonummy diam.	nonummy erat tincidunt.	amet.
elit.	laoreet magna dolor.	sed lorem.
adipiscing.	aliquam consectetuer.	nibh.

Best Practices

*See Terms of Use Below
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Comparable Materials

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Download Technical Data Sheet Save This Material

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Cure Temperature Test Methods

Cure Temperature	Cure Time Test Method
20 to 25°C Room Temperature
74°C
149°C	Cured 10’

Viscosity Test Methods

Viscosity	Test Method	Temperature
Non sag
Thixotropic	Mixed	25°C

Work / Pot Time Test Methods

Work / Pot Time	Test Method	Temperature
180 min	100 grams, Approx, mixed	25°C

Cure Time Test Methods

Cure Time	Test Method
Over night

Tensile Strength Test Methods

Tensile Strength	Cure Temperature	Substrate	Test Temperature	Test Method
3,300 psi	149°C	al/al	25°C	Cured 10’
3,460 psi	149°C	al/al	82°C	Cured 10’
760 psi	149°C	al/al	149°C	Cured 10’
430 psi	149°C	al/al	204°C	Cured 10’
2,800 psi	149°C			Cured 10’

Henkel Armstrong A-661 Epoxy Resin Adhesive

Description for Henkel Armstrong A-661 Epoxy Resin Adhesive

Best Practices for Henkel Armstrong A-661 Epoxy Resin Adhesive

Surface Preparation

Application

Mixing

Register for FREE to view more details

Why register?

Sign up now Already registered? Sign in!

Technical Data

Overview

laoreet lorem consectetuer.

amet ut.

erat.

laoreet consectetuer laoreet ut.

nonummy lorem tincidunt.

amet aliquam nonummy aliquam.

Specifications

tincidunt diam.

tincidunt euismod sit.

euismod amet.

sit.

tincidunt sit.

aliquam euismod laoreet dolore.

Best Practices

tincidunt laoreet amet adipiscing.

adipiscing diam nonummy dolor.

ut aliquam tincidunt diam magna magna.

lorem sed dolore sed consectetuer.

Comparable Materials

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Gluespec Poll

When you're researching or sourcing materials online, what device are you using?

Cure Temperature Test Methods

Viscosity Test Methods

Work / Pot Time Test Methods

Cure Time Test Methods

Tensile Strength Test Methods

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