Henkel Armstrong A-661 Epoxy Resin Adhesive

Henkel Armstrong A-661 Epoxy Resin Adhesive Datasheet
  • Description for Henkel Armstrong A-661 Epoxy Resin Adhesive

    A two-component, room temperature curing adhesive which produces bonds with excellent shear strength, even after long-term exposure at temperatures up to 400°F.

    *See Terms of Use Below

    Brand Armstrong
    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Paste
    Substrate Aluminium, Ceramic, Metal, Plastic, Steel, Wood
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method 2-Part Cure, Room temperature curing
    Cure Temperature (°C) 20 to 25 Room Temperature, 74, 149
    Cure Time (min) Over night
    Viscosity (cPs) Non sag, Thixotropic
  • Technical Data for Henkel Armstrong A-661 Epoxy Resin Adhesive

    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Paste
    • Substrate
    • Chemistry
    • Application Method
      • Brush
    • Cure Method
      • Room Temperature / Air Dry - Room temperature curing
      • 2-Part Cure
    • Brand
      • Armstrong
    Cure Specs
    Cure Temperature (°C) 20 to 25 Room Temperature, 74, 149 Test Method
    Cure Time (min) Over night Test Method
    Viscosity (cPs) Non sag, Thixotropic Test Method
    Work / Pot Time (min) 180 Test Method
    Thixotropic Thixotropic
    Mix Ratio 4:1 (by weight)
    Bond Strength
    General Bond Strength (psi) 5,300
    Shear Strength (psi) Excellent
    Tensile Strength (psi) 3,300, 3,460, 760, 430, 2,800 Test Method
    Elongation (%) <2
    Business Information
    Shelf Life Details Store below 25°C out of sunlight and in original unopened containers. Refer to packaging specific quote for shelf life information.
    Shelf Life Temperature (°F) <77
  • Best Practices for Henkel Armstrong A-661 Epoxy Resin Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      The surfaces to be bonded should be clean and dry (for critical applications refer to our suggested surface preparation procedures - Bulletin No. 964)

    2. Application

      Apply the adhesive to surfaces to be bonded (preferably both surfaces) and press together. Light clamping may be used to keep parts in position during curing.

    3. Mixing

      Thoroughly mix the A-661 Part B with the A-661 part A in a clean discardable container using correct mix ratio. Avoid the introduction of excess air.

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C Room Temperature
149°C Cured 10’
Cure Time Test Methods
Cure Time Test Method
Over night
Viscosity Test Methods
Viscosity Test Method Temperature
Non sag
Thixotropic Mixed 25°C
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
180 min 100 grams, Approx, mixed 25°C
Tensile Strength Test Methods
Tensile Strength Cure Temperature Substrate Test Temperature Test Method
3,300 psi 149°C al/al 25°C Cured 10’
3,460 psi 149°C al/al 82°C Cured 10’
760 psi 149°C al/al 149°C Cured 10’
430 psi 149°C al/al 204°C Cured 10’
2,800 psi 149°C Cured 10’