• Description for Henkel Armstrong A-661 Epoxy Resin Adhesive

    A two-component, room temperature curing adhesive which produces bonds with excellent shear strength, even after long-term exposure at temperatures up to 400°F.

    *See Terms of Use Below

    Brand Armstrong
    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Paste
    Substrate Ceramic, Aluminium, Metal, Plastic, Steel, Wood
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method 2-Part Cure, Room temperature curing
    Cure Temperature (°C) 20 to 25 Room Temperature, 74, 149
    Cure Time (min) Over night
    Viscosity (cPs) Non sag, Thixotropic
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C Room Temperature
74°C
149°C Cured 10’
Viscosity Test Methods
Viscosity Test Method Temperature
Non sag
Thixotropic Mixed 25°C
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
180 min 100 grams, Approx, mixed 25°C
Cure Time Test Methods
Cure Time Test Method
Over night
Tensile Strength Test Methods
Tensile Strength Cure Temperature Substrate Test Temperature Test Method
3,300 psi 149°C al/al 25°C Cured 10’
3,460 psi 149°C al/al 82°C Cured 10’
760 psi 149°C al/al 149°C Cured 10’
430 psi 149°C al/al 204°C Cured 10’
2,800 psi 149°C Cured 10’