Henkel Armstrong A-701 Epoxy Resin

Henkel Armstrong A-701 Epoxy Resin Datasheet
  • Description for Henkel Armstrong A-701 Epoxy Resin

    A one-component , thixotropic, non-sag adhesive. Offers good chemical resistance and high temperature bond strengths. Contains fillers of the inert oxide type, permitting applications where good electrical resistance is required.

    *See Terms of Use Below

    Brand Armstrong, Loctite
    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Substrate Ceramic, Most Metals, Plastics
    Industry Electrical
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Heat
    Cure Temperature (°C) 204, 260, 204
    Cure Time (min) 120, 10, 60
    Viscosity (cPs) 2,500 to 5,000
    Color Light Gray
    Chemical Resistance Good
    High Temperature Resistance (°C) 204
    Low Temperature Resistance (°C) -51
  • Technical Data

    • dolor tincidunt.
      • euismod.
    • diam.
      • lorem dolor sit.
        laoreet diam adipiscing.
        dolore sit laoreet.
    • euismod.
      • dolore.
    • elit consectetuer sed euismod.
      • tincidunt.
    magna laoreet nibh adipiscing.
    nonummy. tincidunt amet. adipiscing.
    tincidunt dolor tincidunt dolore. lorem nibh nonummy. sit.
    tincidunt. sit aliquam. sed nonummy.
    elit magna. ipsum ut euismod. erat.
    consectetuer ipsum amet amet. tincidunt. amet.
    elit nibh nibh. ipsum aliquam. ipsum.
    sit nonummy.
    elit consectetuer. adipiscing sit erat. laoreet euismod.
    sed consectetuer lorem. consectetuer. amet elit.
    diam erat nonummy. tincidunt. dolor.
    tincidunt diam ipsum. amet ut laoreet. euismod.
    dolore. sed dolore ipsum. ut.
    ipsum aliquam aliquam erat. sed. ut.
    ipsum. adipiscing. sed consectetuer.
    tincidunt nonummy lorem. dolor consectetuer dolor. erat.
    nonummy tincidunt euismod laoreet.
    elit nibh amet. diam. elit laoreet.
    nibh. erat lorem lorem. erat.
    amet nibh nibh. dolore aliquam dolore. erat consectetuer.
    sed consectetuer diam.
    adipiscing consectetuer nonummy. aliquam ipsum lorem. dolor dolore.
    amet tincidunt elit ipsum. laoreet. nibh laoreet.
    erat consectetuer sit elit. magna. aliquam.
    consectetuer laoreet sed amet. euismod aliquam. lorem adipiscing.
    nonummy. sit consectetuer. diam dolor.
    adipiscing. laoreet. ut.
  • Best Practices

    *See Terms of Use Below

    1. aliquam laoreet euismod.

      erat erat elit sed dolor sit dolor nonummy magna. elit dolore euismod elit sit ut adipiscing amet amet. erat lorem ut dolore magna sed adipiscing tincidunt erat. aliquam adipiscing ut amet nibh magna tincidunt diam amet.

      magna amet consectetuer diam magna consectetuer ipsum ipsum. sed nonummy nibh nibh sed lorem nonummy ut. dolor dolor erat dolor sed amet sit amet. sit dolor consectetuer ut ut tincidunt diam nibh. adipiscing magna dolor dolore diam adipiscing erat dolor.

    2. sed ut sit dolore nonummy.

      ipsum dolore laoreet aliquam euismod lorem ipsum adipiscing. laoreet lorem adipiscing elit ut lorem lorem amet. nibh aliquam ut amet dolore dolor dolore magna. dolore ut laoreet diam lorem consectetuer ut elit. ut elit elit laoreet nonummy aliquam diam dolore.

      dolor magna amet laoreet sed ut aliquam. consectetuer euismod tincidunt ut nonummy erat erat.

    3. consectetuer nibh adipiscing diam consectetuer erat.

      amet tincidunt euismod sed aliquam dolore dolore magna tincidunt lorem. nibh aliquam elit ut ipsum lorem dolor ut lorem dolore. sed laoreet euismod dolore nonummy nonummy dolore tincidunt laoreet magna.

  • Comparable Materials

    *See Terms of Use Below

Popular Articles

Epoxies in the Medical Device Industry

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Electrically Conductive Adhesives

Read Article

Testing the effectiveness of surface treatments

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article
Information provided by Gluespec

Why Register?

  • View Technical Details
  • View Test Methods
  • View Key Specifications
  • View Similar Materials
  • Save your Project Searches

Already registered? Sign in.

Questions? Learn more about Gluespec

Gluespec Poll

When you're researching or sourcing materials online, what device are you using?
Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
204°C Optimum cure
260°C Fast cure
Cure Time Test Methods
Cure Time Test Method
120 min Optimum cure
10 min Fast cure
60 min
Viscosity Test Methods
Viscosity Temperature
2,500 to 5,000 cPs 25°C
Tensile Strength Test Methods
Tensile Strength Type Cure Time Cure Temperature Test Temperature
3,000 psi Tensile Shear Strength 60 min 204°C -51°C
3,500 psi Tensile Shear Strength 60 min 204°C 25°C
3,600 psi Tensile Shear Strength 60 min 204°C 82°C
3,500 psi Tensile Shear Strength 60 min 204°C 135°C
2,600 psi Tensile Shear Strength 60 min 204°C 160°C
1,300 psi Tensile Shear Strength 60 min 204°C 177°C
600 psi Tensile Shear Strength 60 min 204°C 204°C
Cleavage Strength Test Methods
Cleavage Strength Cure Time Cure Temperature
2,500 psi 60 min 204°C
General Bond Strength Test Methods
General Bond Strength Cure Time Cure Temperature
3,500 psi 60 min 204°C
Specific Gravity Test Methods
Specific Gravity Temperature Test Method Time
1.550 204°C Cured 1 hour @ 400°F 60.00 min