Henkel Armstrong A-701 Epoxy Resin Datasheet Henkel Armstrong A-701 Epoxy Resin

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  • Description for Henkel Armstrong A-701 Epoxy Resin

    A one-component , thixotropic, non-sag adhesive. Offers good chemical resistance and high temperature bond strengths. Contains fillers of the inert oxide type, permitting applications where good electrical resistance is required.

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    Brand Loctite, Armstrong
    Chemical Resistance Good
    Application Type Bond
    1 Part or 2 Part 1-Part
    Material Form Liquid
    Substrate Ceramic, Most Metals, Plastics
    Industry Electrical
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Heat
    Cure Temperature (°C) 204, 260, 204
    Cure Time (min) 120, 10, 60
    Viscosity (cPs) 2,500 to 5,000
    Color Light Gray
    High Temperature Resistance (°C) 204
    Low Temperature Resistance (°C) -51

  • Technical Data for Henkel Armstrong A-701 Epoxy Resin

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    Overview
    • Chemical Resistance
      • Chemical Resistance - Good
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Liquid
    • Substrate
    • Industry
    • Chemistry
    • Cure Method
      • Heat
    • Color
      • Gray - Light Gray
    • Brand
      • Armstrong
      • Loctite
    Specifications
    Cure Specs
    Cure Temperature (°C) 204, 260, 204 Test Method
    Cure Time (min) 120, 10, 60 Test Method
    Viscosity (cPs) 2,500 to 5,000 Test Method
    Thixotropic Thixotropic
    Bond Strength
    General Bond Strength (psi) 3,500 Test Method
    Cleavage Strength (psi) 2,500 Test Method
    Tensile Strength (psi) 3,000, 3,500, 3,600, 3,500, 2,600, 1,300, 600 Test Method
    Material Resistance
    High Temperature Resistance (°C) 204
    Low Temperature Resistance (°C) -51
    Conductivity
    Filler Inert Oxide
    Insulation Resistance (O) Good electrical resistance
    Dielectric Strength (V/mil) Dielectric Strength
    Other Properties
    Specific Gravity 1.550 Test Method
    Business Information
    Shelf Life Details Store below 5°C out of sunlight and in original unopened containers. Refer to packaging specific quote for shelf life information.
    Shelf Life Temperature (°F) <41

  • Best Practices for Henkel Armstrong A-701 Epoxy Resin

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  • Comparable Materials for Henkel Armstrong A-701 Epoxy Resin

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    Spec Engine® Results

    • Henkel
      Loctite Stycast A 316-48(Henkel)

      • One component • Fast heat cure • Heat resistant • Non-conductive • Exceptional thermal stability • Excellent chemical resistance • Heat resistant adhesive • Pourable epoxy adhesive

    • Henkel
      A-702 Epoxy Resin(Henkel)

      One-component epoxy adhesives which are cured by the application of heat above 350°F. Suitable for bonding most metals, ceramics, plastics, etc. & good chemical resistance.

    • Epoxies Etc
      10-3783 One Component Epoxy Adhesive(Epoxies Etc)

      These one component heat cure epoxy adhesives are fast setting materials formulated in three different viscosities. They are known for their low temperature cure, heat and excellent chemical resistance.

    • Compare All
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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
204°C Optimum cure
260°C Fast cure
204°C
Cure Time Test Methods
Cure Time Test Method
120 min Optimum cure
10 min Fast cure
60 min
Viscosity Test Methods
Viscosity Temperature
2,500 to 5,000 cPs 25°C
Cleavage Strength Test Methods
Cleavage Strength Cure Time Cure Temperature
2,500 psi 60 min 204°C
General Bond Strength Test Methods
General Bond Strength Cure Time Cure Temperature
3,500 psi 60 min 204°C
Tensile Strength Test Methods
Tensile Strength Type Cure Time Cure Temperature Test Temperature
3,000 psi Tensile Shear Strength 60 min 204°C -51°C
3,500 psi Tensile Shear Strength 60 min 204°C 25°C
3,600 psi Tensile Shear Strength 60 min 204°C 82°C
3,500 psi Tensile Shear Strength 60 min 204°C 135°C
2,600 psi Tensile Shear Strength 60 min 204°C 160°C
1,300 psi Tensile Shear Strength 60 min 204°C 177°C
600 psi Tensile Shear Strength 60 min 204°C 204°C
Specific Gravity Test Methods
Specific Gravity Temperature Test Method Time
1.550 204°C Cured 1 hour @ 400°F 60.00 min