Henkel Armstrong A-701 Epoxy Resin

Henkel Armstrong A-701 Epoxy Resin Datasheet
  • Description for Henkel Armstrong A-701 Epoxy Resin

    A one-component , thixotropic, non-sag adhesive. Offers good chemical resistance and high temperature bond strengths. Contains fillers of the inert oxide type, permitting applications where good electrical resistance is required.

    *See Terms of Use Below

    Brand Armstrong, Loctite
    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Substrate Ceramic, Most Metals, Plastics
    Industry Electrical
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Heat
    Cure Temperature (°C) 204, 260, 204
    Cure Time (min) 120, 10, 60
    Viscosity (cPs) 2,500 to 5,000
    Color Light Gray
    Chemical Resistance Good
    High Temperature Resistance (°C) 204
    Low Temperature Resistance (°C) -51
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
204°C Optimum cure
260°C Fast cure
204°C
Cure Time Test Methods
Cure Time Test Method
120 min Optimum cure
10 min Fast cure
60 min
Viscosity Test Methods
Viscosity Temperature
2,500 to 5,000 cPs 25°C
Tensile Strength Test Methods
Tensile Strength Type Cure Time Cure Temperature Test Temperature
3,000 psi Tensile Shear Strength 60 min 204°C -51°C
3,500 psi Tensile Shear Strength 60 min 204°C 25°C
3,600 psi Tensile Shear Strength 60 min 204°C 82°C
3,500 psi Tensile Shear Strength 60 min 204°C 135°C
2,600 psi Tensile Shear Strength 60 min 204°C 160°C
1,300 psi Tensile Shear Strength 60 min 204°C 177°C
600 psi Tensile Shear Strength 60 min 204°C 204°C
Cleavage Strength Test Methods
Cleavage Strength Cure Time Cure Temperature
2,500 psi 60 min 204°C
General Bond Strength Test Methods
General Bond Strength Cure Time Cure Temperature
3,500 psi 60 min 204°C
Specific Gravity Test Methods
Specific Gravity Temperature Test Method Time
1.550 204°C Cured 1 hour @ 400°F 60.00 min