Henkel Armstrong C-1 Epoxy Resin w/ Activator A

Overview

• Application Type

  • Laminate - Laminating
  • Adhesive - Bond
  • Pottant / Encapsulant - Pot

• 1 Part or 2 Part

  • 1 Part or 2 Part - 2 Part

• Material Form

  • Liquid

• Substrate

  • Steel
  • Aluminum - Aluminum

• Industry

  • Electronics - Electrical

• Chemistry

  • Epoxy
  • Other - Versatile

• Cure Method

  • 2-Part Cure - 2 Parts

• Color

  • Red - Amber

• Brand

  • Armstrong

Specifications

Cure Specs

Cure Temperature (°C)	20 to 25 Room Temperature, 74
Cure Time (min)	10,080, 120
Viscosity (cPs)	Low, 3,500, 5 to 15, 2,200	Test Method
Set Time (min)	Fast initial
Work / Pot Time (min)	30	Test Method
Mix Ratio	100:8 (by weight)

Bond Strength

General Bond Strength (psi)	1,340	Test Method
Shear Strength (psi)	1,780, 200, 1,560, 1,530, 1,600, 1,780, 1,350, 630, 1,550, 1,650, 1,400, 1,890, 2,200, 3,250, 180, 2,810, 2,190, 2,320, 2,400, 2,010, 2,170, 3,140, 2,070, 2,220, 2,760, 2,750, 2,320	Test Method
Cleavage Strength (psi)	1,120	Test Method
Compressive Strength (psi)	13,900, 15,500	Test Method
Tensile Strength (psi)	7,650, 8,380	Test Method

Material Resistance

Chemical Resistance	Acetone, Ammonia, 28%, Distilled Water, Ethyl Acetate, Ethylenedichloride, Glacial Acetic Acid, Hexane, Salt Water, Toluene
High Temperature Resistance (°C)	74
Low Temperature Resistance (°C)	-51

Conductivity

Unfilled	Unfilled
Dielectric Strength (V/mil)	>450

Hardness

Shore D Hardness	84
Elongation (%)	4, 6, 5

Other Properties

Specific Gravity	1.180, 0.950
Coefficient of Thermal Expansion (CTE)	7.3e-5 (in./ in/°C), 50 (ppm/°C)	Test Method
Density (g/cm³)	0.043 lbs/cubic inch

Business Information

Shelf Life Details	Shelf life is one year when stored below 90°F out of sunlight and in original unopened containers of pints or greater. Shelf life will vary with specialty packages.
Shelf Life Temperature (°F)	<90
Shelf Life (mon)	12