Henkel Armstrong C-1 Epoxy Resin w/ Activator A Datasheet Henkel Armstrong C-1 Epoxy Resin w/ Activator A

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  • Description for Henkel Armstrong C-1 Epoxy Resin w/ Activator A

    A versatile, low viscosity, unfilled resin that is an excellent insulator, and provides outstanding chemical resistance to most compounds.

    *See Terms of Use Below

    Brand Armstrong
    Chemical Resistance Acetone, Chemical Resistance: Fluid Resistance: Salt Water, Chemical Resistance: Glacial Acetic Acid, Ammonia, 28%, Chemical Resistance: Fluid Resistance: Distilled Water, Hexane, Ethyl Acetate, Ethylenedichloride, Toluene
    Application Type Bond, Pot, Laminating
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Substrate Aluminum , Steel
    Industry Electrical
    Manufacturer Henkel
    Chemistry Epoxy, Versatile
    Cure Method 2 Parts
    Cure Temperature (°C) 20 to 25 Room Temperature, 74
    Cure Time (min) 10,080, 120
    Viscosity (cPs) Low, 3,500, 5.00 to 15, 2,200
    Color Amber
    High Temperature Resistance (°C) 74
    Low Temperature Resistance (°C) -51
    Density (g/cm³) 0.043 lbs/cubic inch

  • Technical Data for Henkel Armstrong C-1 Epoxy Resin w/ Activator A

    *See Terms of Use Below

    Overview
    • Chemical Resistance
      • Chemical Resistance : Fluid Resistance : Water Resistance - Distilled Water, Salt Water
      • Chemical Resistance - Acetone, Ammonia, 28%, Ethyl Acetate, Ethylenedichloride, Hexane, Toluene
      • Chemical Resistance : Acid Resistance - Glacial Acetic Acid
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Substrate
    • Industry
    • Chemistry
      • Epoxy
      • Other - Versatile
    • Cure Method
      • 2-Part Cure - 2 Parts
    • Color
      • Red - Amber
    • Brand
      • Armstrong
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25 Room Temperature, 74
    Cure Time (min) 10,080, 120
    Viscosity (cPs) Low, 3,500, 5.00 to 15, 2,200 Test Method
    Set Time (min) Fast initial
    Work / Pot Time (min) 30 Test Method
    Mix Ratio 100:8 (by weight)
    Bond Strength
    General Bond Strength (psi) 1,340 Test Method
    Shear Strength (psi) 1,780, 200, 1,560, 1,530, 1,600, 1,780, 1,350, 630, 1,550, 1,650, 1,400, 1,890, 2,200, 3,250, 180, 2,810, 2,190, 2,320, 2,400, 2,010, 2,170, 3,140, 2,070, 2,220, 2,760, 2,750, 2,320 Test Method
    Cleavage Strength (psi) 1,120 Test Method
    Compressive Strength (psi) 13,900, 15,500 Test Method
    Tensile Strength (psi) 7,650, 8,380 Test Method
    Material Resistance
    High Temperature Resistance (°C) 74
    Low Temperature Resistance (°C) -51
    Conductivity
    Unfilled Unfilled
    Dielectric Strength (V/mil) >450
    Hardness
    Shore D Hardness 84
    Elongation (%) 4, 6, 5
    Other Properties
    Specific Gravity 1.180, 0.950
    Coefficient of Thermal Expansion (CTE) 7.3e-5 (in./ in/°C), 50 (ppm/°C) Test Method
    Density (g/cm³) 0.043 lbs/cubic inch
    Business Information
    Shelf Life Details Shelf life is one year when stored below 90°F out of sunlight and in original unopened containers of pints or greater. Shelf life will vary with specialty packages.
    Shelf Life Temperature (°F) <90
    Shelf Life (mon) 12

  • Best Practices for Henkel Armstrong C-1 Epoxy Resin w/ Activator A

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  • Comparable Materials for Henkel Armstrong C-1 Epoxy Resin w/ Activator A

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Viscosity Test Methods
Viscosity Temperature
Low
3,500 cPs 25°C
5.00 to 15 cPs 25°C
2,200 cPs 25°C
Work / Pot Time Test Methods
Work / Pot Time Temperature
30 min 25°C
Cleavage Strength Test Methods
Cleavage Strength Cure Time Cure Temperature
1,120 psi 120 min 74°C
Compressive Strength Test Methods
Compressive Strength Cure Time Cure Temperature
13,900 psi 10,080 min 20 to 25°C Room Temperature
15,500 psi 120 min 74°C
General Bond Strength Test Methods
General Bond Strength Cure Time Cure Temperature
1,340 psi 120 min 74°C
Tensile Strength Test Methods
Tensile Strength Cure Time Cure Temperature
7,650 psi 10,080 min 20 to 25°C Room Temperature
8,380 psi 120 min 74°C
Shear Strength Test Methods
Shear Strength Cure Time Cure Temperature Substrate Chemical Test Time Test Temperature
1,780 psi 10,080 min 25°C Aluminum to Aluminum 20 to 25°C Room Temperature
200 psi 10,080 min 25°C Aluminum to Aluminum 82°C
1,560 psi 10,080 min 25°C Aluminum to Aluminum -51°C
1,530 psi 10,080 min 25°C Aluminum to Aluminum Ammonia, 28% 604,800 sec
1,600 psi 10,080 min 25°C Aluminum to Aluminum Distilled Water 604,800 sec
1,780 psi 10,080 min 25°C Aluminum to Aluminum Salt water 10% 604,800 sec
1,350 psi 10,080 min 25°C Aluminum to Aluminum Acetone 604,800 sec
630 psi 10,080 min 25°C Aluminum to Aluminum Glacial Acetic Acid 604,800 sec
1,550 psi 10,080 min 25°C Aluminum to Aluminum Toluene 604,800 sec
1,650 psi 10,080 min 25°C Aluminum to Aluminum Ethylenedichloride 604,800 sec
1,400 psi 10,080 min 25°C Aluminum to Aluminum Ethyl Acetate 604,800 sec
1,890 psi 10,080 min 25°C Aluminum to Aluminum Hexane 604,800 sec
2,200 psi 10,080 min 25°C Aluminum to Aluminum 604,800 sec
3,250 psi 120 min 74°C Aluminum to Aluminum 82°C
180 psi 120 min 74°C Aluminum to Aluminum -51°C
2,810 psi 120 min 74°C Aluminum to Aluminum Ammonia, 28% 604,800 sec
2,190 psi 120 min 74°C Aluminum to Aluminum Distilled Water 604,800 sec
2,320 psi 120 min 74°C Aluminum to Aluminum Salt water 10% 604,800 sec
2,400 psi 120 min 74°C Aluminum to Aluminum Acetone 604,800 sec
2,010 psi 120 min 74°C Aluminum to Aluminum Glacial Acetic Acid 604,800 sec
2,170 psi 120 min 74°C Aluminum to Aluminum Toluene 604,800 sec
3,140 psi 120 min 74°C Aluminum to Aluminum Ethylenedichloride 604,800 sec
2,070 psi 120 min 74°C Aluminum to Aluminum Ethyl Acetate 604,800 sec
2,220 psi 120 min 74°C Aluminum to Aluminum Hexane 604,800 sec
2,760 psi 120 min 74°C Aluminum to Aluminum 604,800 sec
2,750 psi 120 min 74°C Aluminum to Aluminum 604,800 sec
2,320 psi 120 min 74°C Steel to Steel
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C)
7.3e-5 (in./ in/°C) 25°C
50 (ppm/°C) 93°C