Henkel Armstrong C-1 Epoxy Resin w/ Activator E Datasheet Henkel Armstrong C-1 Epoxy Resin w/ Activator E

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  • Description for Henkel Armstrong C-1 Epoxy Resin w/ Activator E

    A versatile, low viscosity, unfilled resin that is an excellent insulator, and provides outstanding chemical resistance to most compounds.

    *See Terms of Use Below

    Brand Armstrong
    Chemical Resistance Acetone, Chemical Resistance: Glacial Acetic Acid, Chemical Resistance: Fluid Resistance: Distilled Water, Ammonia, 28%, Chemical Resistance: Fluid Resistance: Salt Water, Hexane, Ethyl Acetate, Ethylenedichloride, Toluene
    Application Type Bond, Pot, Laminating
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Substrate Aluminum , Steel
    Manufacturer Henkel
    Chemistry Epoxy, Versatile
    Cure Method 2 Parts
    Cure Temperature (°C) 93
    Cure Time (min) 60
    Viscosity (cPs) Low, 3,500, 5.00 to 15, 1,000
    Color Amber
    Volume Resistivity (O) 7.0e14 (ohms/cm)
    Density (g/cm³) 0.043 lbs/cubic inch

  • Technical Data for Henkel Armstrong C-1 Epoxy Resin w/ Activator E

    *See Terms of Use Below

    Overview
    • Chemical Resistance
      • Chemical Resistance : Fluid Resistance : Water Resistance - Distilled Water, Salt Water
      • Chemical Resistance - Acetone, Ammonia, 28%, Ethyl Acetate, Ethylenedichloride, Hexane, Toluene
      • Chemical Resistance : Acid Resistance - Glacial Acetic Acid
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Substrate
    • Chemistry
      • Epoxy
      • Other - Versatile
    • Cure Method
      • 2-Part Cure - 2 Parts
    • Color
      • Red - Amber
    • Brand
      • Armstrong
    Specifications
    Cure Specs
    Cure Temperature (°C) 93
    Cure Time (min) 60
    Viscosity (cPs) Low, 3,500, 5.00 to 15, 1,000 Test Method
    Work / Pot Time (min) 120 to 180 Test Method
    Mix Ratio 100:12 (by volume)
    Bond Strength
    General Bond Strength (psi) 1,590 Test Method
    Shear Strength (psi) 3,120, 900, 2,970, 2,670, 3,390, 2,730, 3,100, 2,170, 3,170, 2,430, 2,770, 2,570, 3,100 Test Method
    Cleavage Strength (psi) 840 Test Method
    Compressive Strength (psi) 20,200 Test Method
    Tensile Strength (psi) 9,180 Test Method
    Material Resistance
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Unfilled Unfilled
    Dissipation Factor 0.07000 Test Method
    Dielectric Constant 5.00 Test Method
    Volume Resistivity (O) 7.0e14 (ohms/cm) Test Method
    Hardness
    Elongation (%) 6, 6
    Other Properties
    Specific Gravity 1.180, 0.830
    Coefficient of Thermal Expansion (CTE) 7.3e-5 (in./ in/°C), 7.4e-5 (in./ in/°C)
    Density (g/cm³) 0.043 lbs/cubic inch
    Business Information
    Shelf Life Details Shelf life is one year when stored below 90°F out of sunlight and in original unopened containers of pints or greater. Shelf life will vary with specialty packages.
    Shelf Life Temperature (°F) <90
    Shelf Life (mon) 12

  • Best Practices for Henkel Armstrong C-1 Epoxy Resin w/ Activator E

    *See Terms of Use Below

  • Comparable Materials for Henkel Armstrong C-1 Epoxy Resin w/ Activator E

    *See Terms of Use Below

    Spec Engine® Results

    • Resinlab
      EP1282 Black(Resinlab)

      A two part unfilled epoxy encapsulant designed for medium sized castings. It has very good resistance to water, acids and bases and most organic solvents.

    • 3M
      DP270(3M)

      A two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black.

    • Henkel
      Armstrong A-271(Henkel)

      An amber-colored clear two-part epoxy bonding adhesive, good adhesion to glass due to its wetting ability, good moisture and chemical resistance.

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Viscosity Test Methods
Viscosity Temperature
Low
3,500 cPs 25°C
5.00 to 15 cPs 25°C
1,000 cPs 25°C
Work / Pot Time Test Methods
Work / Pot Time Temperature
120 to 180 min 25°C
Cleavage Strength Test Methods
Cleavage Strength Cure Time Cure Temperature
840 psi 60 min 93°C
Compressive Strength Test Methods
Compressive Strength Cure Time Cure Temperature
20,200 psi 60 min 93°C
General Bond Strength Test Methods
General Bond Strength Cure Time Cure Temperature
1,590 psi 60 min 93°C
Tensile Strength Test Methods
Tensile Strength Cure Time Cure Temperature
9,180 psi 60 min 93°C
Shear Strength Test Methods
Shear Strength Cure Time Cure Temperature Substrate Chemical Test Time Test Temperature
3,120 psi 60 min 93°C Aluminum to Aluminum 20 to 25°C Room Temperature
900 psi 60 min 93°C Aluminum to Aluminum 82°C
2,970 psi 60 min 93°C Aluminum to Aluminum -51°C
2,670 psi 60 min 93°C Aluminum to Aluminum Ammonia, 28% 604,800 sec
3,390 psi 60 min 93°C Aluminum to Aluminum Distilled Water 604,800 sec
2,730 psi 60 min 93°C Aluminum to Aluminum Salt water 10% 604,800 sec
3,100 psi 60 min 93°C Aluminum to Aluminum Acetone 604,800 sec
2,170 psi 60 min 93°C Aluminum to Aluminum Glacial Acetic Acid 604,800 sec
3,170 psi 60 min 93°C Aluminum to Aluminum Toluene 604,800 sec
2,430 psi 60 min 93°C Aluminum to Aluminum Ethylenedichloride 604,800 sec
2,770 psi 60 min 93°C Aluminum to Aluminum Ethyl Acetate 604,800 sec
2,570 psi 60 min 93°C Aluminum to Aluminum Hexane 604,800 sec
3,100 psi 60 min 93°C Aluminum to Aluminum 604,800 sec
Dielectric Constant Test Methods
Dielectric Constant Test Method
5.00 Dielectric Constant, 1 kc
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.07000 Dissipation Factor, 1kc
Volume Resistivity Test Methods
Volume Resistivity Temp (°C)
7.0e14 (ohms/cm) 93°C