Henkel Armstrong C-4 Epoxy Resin w/ Activator A

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Description for Henkel Armstrong C-4 Epoxy Resin w/ Activator A

A clear, low viscosity epoxy adhesive which will cure at room temperature to produce a clear rigid bondline. With Activator A exhibits excellent chemical and solvent resistance as well as acting as an electrical insulator. Activator W offers maximum versatility in mixing ratios. Activator D is useful where low mixed-viscosity is needed. It may also be used for fiberglass laminating or casting.

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Brand	Armstrong
Chemical Resistance	Excellent, Chemical Resistance: Excellent solvent resistance
Application Type	Bond
1 Part or 2 Part	2-Part
Material Form	Liquid
Substrate	Ceramics, Fiber, Most Metals, Many Plastics, Glass
Industry	Electrical, Electronic, Optic
Manufacturer	Henkel
Chemistry	Epoxy
Cure Method	Resin/Hardener
Cure Temperature (°C)	20 to 25 Room Temperature, 25, 65
Cure Time (min)	1,440, 240
Viscosity (cPs)	Low, 300
Color	Clear
High Temperature Resistance (°C)	130
Low Temperature Resistance (°C)	-60

Best Practices for Henkel Armstrong C-4 Epoxy Resin w/ Activator A

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Technical Data for Henkel Armstrong C-4 Epoxy Resin w/ Activator A

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Overview

Chemical Resistance
- Chemical Resistance - Excellent
- Chemical Resistance : Relative Solvent Resistance - Excellent solvent resistance
Application Type
- Adhesive - Bond
1 Part or 2 Part
- 2-Part
Material Form
- Liquid
Substrate
- Ceramic - Ceramics
- Glass - Fiber
- Metal - Most Metals
- Plastic - Many Plastics
Industry
- Electronics - Electrical, Electronic, Optic
Chemistry
- Epoxy
Cure Method
- 2-Part Cure - Resin/Hardener
Color
- Clear / Transparent - Clear
Brand
- Armstrong

Specifications

Cure Specs

Cure Temperature (°C)	20 to 25 Room Temperature, 25, 65
Cure Time (min)	1,440, 240
Viscosity (cPs)	Low, 300	Test Method
Mix Ratio	100:11 (by weight)

Material Resistance

High Temperature Resistance (°C)	130
Low Temperature Resistance (°C)	-60

Conductivity

Dissipation Factor	0.02000	Test Method
Dielectric Strength (V/mil)	410
Dielectric Constant	4.30	Test Method

Hardness

Shore D Hardness	88
Elongation (%)	3

Other Properties

Glass Transition Temp (Tg) (°C)	77
Specific Gravity	1.150

Business Information

Shelf Life Details	Shelf life is one year when stored below 90°F, out of sunlight, and in original unopened containers of pints or greater. Shelf life will vary with specialty packaging.
Shelf Life Temperature (°F)	<90
Shelf Life (mon)	12

Best Practices for Henkel Armstrong C-4 Epoxy Resin w/ Activator A

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Comparable Materials for Henkel Armstrong C-4 Epoxy Resin w/ Activator A

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Spec Engine^® Results
- Oxy-Bond 109-LC(Henkel)
  Low viscosity epoxy resin formulation exhibits good wetting, cures at room temperature and develops strong, low shrinkage, bonds to most materials.
- Oxy-Bond 109(Henkel)
  Low viscosity epoxy resin formulation recommended for industrial adhesive, small potting and laminating applications where sparkling clarity and excellent structural, mechanical and electrical properties are required.
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