• Description for Henkel Armstrong C-4 Epoxy Resin w/ Activator A

    A clear, low viscosity epoxy adhesive which will cure at room temperature to produce a clear rigid bondline. With Activator A exhibits excellent chemical and solvent resistance as well as acting as an electrical insulator. Activator W offers maximum versatility in mixing ratios. Activator D is useful where low mixed-viscosity is needed. It may also be used for fiberglass laminating or casting.

    *See Terms of Use Below

    Brand Armstrong
    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Ceramics, Fiber, Most Metals, Many Plastics, Glass
    Industry Electrical, Electronic, Optic
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Resin/Hardener
    Cure Temperature (°C) 20 to 25 Room Temperature, 25, 65
    Cure Time (min) 1,440, 240
    Viscosity (cPs) Low, 300
    Color Clear
    Chemical Resistance Excellent
    Relative Solvent Resistance Chemical Resistance: Excellent solvent resistance
    High Temperature Resistance (°C) 130
    Low Temperature Resistance (°C) -60
  • Technical Data

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  • Best Practices

    *See Terms of Use Below

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Viscosity Test Methods
Viscosity Temperature
300 cPs 25°C
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
4.30 25°C 1KHz @ 25°C
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.02000 25°C 1KHz @ 25°C