Henkel Armstrong C-4 Epoxy Resin w/ Activator D

Henkel Armstrong C-4 Epoxy Resin w/ Activator D Datasheet
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  • Description for Henkel Armstrong C-4 Epoxy Resin w/ Activator D

    A clear, low viscosity epoxy adhesive which will cure at room temperature to produce a clear rigid bondline. With Activator A exhibits excellent chemical and solvent resistance as well as acting as an electrical insulator. Activator W offers maximum versatility in mixing ratios. Activator D is useful where low mixed-viscosity is needed. It may also me used for fiberglass laminating or casting.

    *See Terms of Use Below

    Brand Armstrong
    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Al
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method 2-Part Cure, Room Temperature Cure
    Cure Temperature (°C) 25, 66 to 79
    Cure Time (min) 1,440, 60 to 120
    Viscosity (cPs) 1,500, Low
    Color Clear
    Chemical Resistance Carbonterachloride, Chlorox, Ethanol, Ether, Formaldehyde, Glacial Acetic Acid, Good, H2SO4 30%, Haptane, HCL 37%, HNO3,10%, NaCI, 10%, NaOH 10%, Napthalene, NH2OH 10%, p-dechlorobenzene, Sodium hydrosulfide 10%, Toluene, Trichlorethane, Water, Excellent
    Relative Solvent Resistance Chemical Resistance: Excellent Solvent Resistance
    Density (g/cm³) .042 (lbs./Cubic inch)

  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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  • Comparable Materials

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Viscosity Test Methods
Viscosity Temperature
1,500 cPs 25°C
Low
Work / Pot Time Test Methods
Work / Pot Time Temperature
40 min 25°C
Tensile Strength Test Methods
Tensile Strength Cure Time Cure Temperature Substrate Chemical Test Time Test Temperature Test Humidity
4,000 psi 10,080 min 25°C
8,500 psi 120 min 74°C
1,280 psi 10,080 min 25°C Al/Al 25°C
600 psi 10,080 min 25°C Al/Al <82°C
950 psi 10,080 min 25°C Al/Al -51°C
1,590 psi 10,080 min 25°C Al/Al Ammonia, 28% 10,080 min
1,200 psi 10,080 min 25°C Al/Al Distilled water 10,080 min
1,080 psi 10,080 min 25°C Al/Al Salt Water, 10% 10,080 min
1,100 psi 10,080 min 25°C Al/Al Acetone 10,080 min
730 psi 10,080 min 25°C Al/Al Glacial Acetic Acid 10,080 min
1,440 psi 10,080 min 25°C Al/Al Toluene
1,200 psi 10,080 min 25°C Al/Al Ethylenedichloride
1,460 psi 10,080 min 25°C Al/Al Ethyl Acetate
1,900 psi 10,080 min 25°C Al/Al Hexane 10,080 min
1,750 psi 10,080 min 25°C Al/Al 25°C 100 %
2,680 psi 120 min 74°C Al/Al <82°C
1,450 psi 120 min 74°C Al/Al 10,080 min -51°C
1,250 psi 120 min 74°C Al/Al Ammonia, 28% 10,080 min
1,810 psi 120 min 74°C Al/Al Distilled water 10,080 min
2,530 psi 120 min 74°C Al/Al Salt Water, 10% 10,080 min
2,250 psi 120 min 74°C Al/Al Acetone 10,080 min
2,130 psi 120 min 74°C Al/Al Glacial Acetic Acid
1,620 psi 120 min 74°C Al/Al Toluene
2,600 psi 120 min 74°C Al/Al Ethylenedichloride
1,720 psi 120 min 74°C Al/Al Ethyl Acetate 10,080 min
2,710 psi 120 min 74°C Al/Al Hexane
2,340 psi 120 min 74°C Al/Al
2,190 psi 120 min 74°C Al/Al
Cleavage Strength Test Methods
Cleavage Strength Cure Time Cure Temperature
540 psi 120 min 74°C
Compressive Strength Test Methods
Compressive Strength Cure Time Cure Temperature
15.7 (psi) x 1000 10,080 min 20 to 25°C Room Temperature
18.3 (psi) x 1000 120 min 74°C
General Bond Strength Test Methods
General Bond Strength Cure Time Cure Temperature
1,560 psi 0.00 min 20 to 25°C Room Temperature
850 psi 0.00 min 74°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.56 60 Cycles
3.51 e3 Cycles
3.18 e6 Cycles