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Description for Henkel Armstrong C-4 Epoxy Resin w/ Activator D
A clear, low viscosity epoxy adhesive which will cure at room temperature to produce a clear rigid bondline. With Activator A exhibits excellent chemical and solvent resistance as well as acting as an electrical insulator. Activator W offers maximum versatility in mixing ratios. Activator D is useful where low mixed-viscosity is needed. It may also me used for fiberglass laminating or casting.Brand Armstrong Chemical Resistance Carbonterachloride, Chemical Resistance: Excellent Solvent Resistance, Chemical Resistance: Glacial Acetic Acid, Chemical Resistance: Fluid Resistance: Water, Chlorox, Ethanol, Ether, Formaldehyde, Excellent, Good, H2SO4 30%, Haptane, HCL 37%, HNO3,10%, NaCI, 10%, NaOH 10%, Napthalene, NH2OH 10%, p-dechlorobenzene, Sodium hydrosulfide 10%, Toluene, Trichlorethane Application Type Bond 1 Part or 2 Part 2-Part Material Form Liquid Substrate Al Manufacturer Henkel Chemistry Epoxy Cure Method 2-Part Cure, Room Temperature Cure Cure Temperature (°C) 25, 66 to 79 Cure Time (min) 1,440, 60 to 120 Viscosity (cPs) 1,500, Low Color Clear Density (g/cm³) .042 (lbs./Cubic inch) -
Technical Data for Henkel Armstrong C-4 Epoxy Resin w/ Activator D
Overview
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Chemical Resistance
- Chemical Resistance : Fluid Resistance : Water Resistance - Water
- Chemical Resistance - Carbonterachloride, Chlorox, Ethanol, Ether, Formaldehyde, Good, H2SO4 30%, Haptane, HCL 37%, HNO3,10%, NaCI, 10%, NaOH 10%, Napthalene, NH2OH 10%, p-dechlorobenzene, Sodium hydrosulfide 10%, Toluene, Trichlorethane, Excellent
- Chemical Resistance : Relative Solvent Resistance - Excellent Solvent Resistance
- Chemical Resistance : Acid Resistance - Glacial Acetic Acid
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Application Type
- Adhesive - Bond
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1 Part or 2 Part
- 2-Part
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Material Form
- Liquid
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Substrate
- Aluminum - Al
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Chemistry
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Cure Method
- Room Temperature / Air Dry - Room Temperature Cure
- 2-Part Cure
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Color
- Clear / Transparent - Clear
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Brand
- Armstrong
Specifications
Cure Specs
Cure Temperature (°C) 25, 66 to 79 Cure Time (min) 1,440, 60 to 120 Viscosity (cPs) 1,500, Low Test Method Work / Pot Time (min) 40 Test Method Mix Ratio 4:1 (by volume), 4:1 (by weight) Bond Strength
General Bond Strength (psi) 1,560, 850 Test Method Cleavage Strength (psi) 540 Test Method Compressive Strength (psi) 15.7 (psi) x 1000, 18.3 (psi) x 1000 Test Method Tensile Strength (psi) 4,000, 8,500, 1,280, 600, 950, 1,590, 1,200, 1,080, 1,100, 730, 1,440, 1,200, 1,460, 1,900, 1,750, 2,680, 1,450, 1,250, 1,810, 2,530, 2,250, 2,130, 1,620, 2,600, 1,720, 2,710, 2,340, 2,190 Test Method Material Resistance
Moisture/Humidity Resistance Good Conductivity
Dielectric Strength (V/mil) 435 VPM Dielectric Constant 3.56, 3.51, 3.18 Test Method Hardness
Elongation (%) 3, 2, 5 Other Properties
Specific Gravity 1.130, 1.060 Coefficient of Thermal Expansion (CTE) 6.3e-5 (in./ in/°C) Density (g/cm³) .042 (lbs./Cubic inch) Business Information
Shelf Life Details Store below 25°C out of sunlight and in original unopened containers. -
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Viscosity Test Methods
Viscosity | Temperature |
---|---|
1,500 cPs | 25°C |
Low |
Work / Pot Time Test Methods
Work / Pot Time | Temperature |
---|---|
40 min | 25°C |
Cleavage Strength Test Methods
Cleavage Strength | Cure Time | Cure Temperature |
---|---|---|
540 psi | 120 min | 74°C |
Compressive Strength Test Methods
Compressive Strength | Cure Time | Cure Temperature |
---|---|---|
15.7 (psi) x 1000 | 10,080 min | 20 to 25°C Room Temperature |
18.3 (psi) x 1000 | 120 min | 74°C |
General Bond Strength Test Methods
General Bond Strength | Cure Time | Cure Temperature |
---|---|---|
1,560 psi | 0.00 min | 20 to 25°C Room Temperature |
850 psi | 0.00 min | 74°C |
Tensile Strength Test Methods
Tensile Strength | Cure Time | Cure Temperature | Substrate | Chemical | Test Time | Test Temperature | Test Humidity |
---|---|---|---|---|---|---|---|
4,000 psi | 10,080 min | 25°C | |||||
8,500 psi | 120 min | 74°C | |||||
1,280 psi | 10,080 min | 25°C | Al/Al | 25°C | |||
600 psi | 10,080 min | 25°C | Al/Al | <82°C | |||
950 psi | 10,080 min | 25°C | Al/Al | -51°C | |||
1,590 psi | 10,080 min | 25°C | Al/Al | Ammonia, 28% | 10,080 min | ||
1,200 psi | 10,080 min | 25°C | Al/Al | Distilled water | 10,080 min | ||
1,080 psi | 10,080 min | 25°C | Al/Al | Salt Water, 10% | 10,080 min | ||
1,100 psi | 10,080 min | 25°C | Al/Al | Acetone | 10,080 min | ||
730 psi | 10,080 min | 25°C | Al/Al | Glacial Acetic Acid | 10,080 min | ||
1,440 psi | 10,080 min | 25°C | Al/Al | Toluene | |||
1,200 psi | 10,080 min | 25°C | Al/Al | Ethylenedichloride | |||
1,460 psi | 10,080 min | 25°C | Al/Al | Ethyl Acetate | |||
1,900 psi | 10,080 min | 25°C | Al/Al | Hexane | 10,080 min | ||
1,750 psi | 10,080 min | 25°C | Al/Al | 25°C | 100 % | ||
2,680 psi | 120 min | 74°C | Al/Al | <82°C | |||
1,450 psi | 120 min | 74°C | Al/Al | 10,080 min | -51°C | ||
1,250 psi | 120 min | 74°C | Al/Al | Ammonia, 28% | 10,080 min | ||
1,810 psi | 120 min | 74°C | Al/Al | Distilled water | 10,080 min | ||
2,530 psi | 120 min | 74°C | Al/Al | Salt Water, 10% | 10,080 min | ||
2,250 psi | 120 min | 74°C | Al/Al | Acetone | 10,080 min | ||
2,130 psi | 120 min | 74°C | Al/Al | Glacial Acetic Acid | |||
1,620 psi | 120 min | 74°C | Al/Al | Toluene | |||
2,600 psi | 120 min | 74°C | Al/Al | Ethylenedichloride | |||
1,720 psi | 120 min | 74°C | Al/Al | Ethyl Acetate | 10,080 min | ||
2,710 psi | 120 min | 74°C | Al/Al | Hexane | |||
2,340 psi | 120 min | 74°C | Al/Al | ||||
2,190 psi | 120 min | 74°C | Al/Al |
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
---|---|
3.56 | 60 Cycles |
3.51 | e3 Cycles |
3.18 | e6 Cycles |

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