Henkel Armstrong C-4 Epoxy Resin w/ Activator D Datasheet Henkel Armstrong C-4 Epoxy Resin w/ Activator D

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  • Description for Henkel Armstrong C-4 Epoxy Resin w/ Activator D

    A clear, low viscosity epoxy adhesive which will cure at room temperature to produce a clear rigid bondline. With Activator A exhibits excellent chemical and solvent resistance as well as acting as an electrical insulator. Activator W offers maximum versatility in mixing ratios. Activator D is useful where low mixed-viscosity is needed. It may also me used for fiberglass laminating or casting.

    *See Terms of Use Below

    Brand Armstrong
    Chemical Resistance Carbonterachloride, Chemical Resistance: Excellent Solvent Resistance, Chemical Resistance: Glacial Acetic Acid, Chemical Resistance: Fluid Resistance: Water, Chlorox, Ethanol, Ether, Formaldehyde, Excellent, Good, H2SO4 30%, Haptane, HCL 37%, HNO3,10%, NaCI, 10%, NaOH 10%, Napthalene, NH2OH 10%, p-dechlorobenzene, Sodium hydrosulfide 10%, Toluene, Trichlorethane
    Application Type Bond
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Substrate Al
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method 2-Part Cure, Room Temperature Cure
    Cure Temperature (°C) 25, 66 to 79
    Cure Time (min) 1,440, 60 to 120
    Viscosity (cPs) 1,500, Low
    Color Clear
    Density (g/cm³) .042 (lbs./Cubic inch)

  • Technical Data for Henkel Armstrong C-4 Epoxy Resin w/ Activator D

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    Overview
    • Chemical Resistance
      • Chemical Resistance : Fluid Resistance : Water Resistance - Water
      • Chemical Resistance - Carbonterachloride, Chlorox, Ethanol, Ether, Formaldehyde, Good, H2SO4 30%, Haptane, HCL 37%, HNO3,10%, NaCI, 10%, NaOH 10%, Napthalene, NH2OH 10%, p-dechlorobenzene, Sodium hydrosulfide 10%, Toluene, Trichlorethane, Excellent
      • Chemical Resistance : Relative Solvent Resistance - Excellent Solvent Resistance
      • Chemical Resistance : Acid Resistance - Glacial Acetic Acid
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Substrate
    • Chemistry
    • Cure Method
      • Room Temperature / Air Dry - Room Temperature Cure
      • 2-Part Cure
    • Color
      • Clear / Transparent - Clear
    • Brand
      • Armstrong
    Specifications
    Cure Specs
    Cure Temperature (°C) 25, 66 to 79
    Cure Time (min) 1,440, 60 to 120
    Viscosity (cPs) 1,500, Low Test Method
    Work / Pot Time (min) 40 Test Method
    Mix Ratio 4:1 (by volume), 4:1 (by weight)
    Bond Strength
    General Bond Strength (psi) 1,560, 850 Test Method
    Cleavage Strength (psi) 540 Test Method
    Compressive Strength (psi) 15.7 (psi) x 1000, 18.3 (psi) x 1000 Test Method
    Tensile Strength (psi) 4,000, 8,500, 1,280, 600, 950, 1,590, 1,200, 1,080, 1,100, 730, 1,440, 1,200, 1,460, 1,900, 1,750, 2,680, 1,450, 1,250, 1,810, 2,530, 2,250, 2,130, 1,620, 2,600, 1,720, 2,710, 2,340, 2,190 Test Method
    Material Resistance
    Moisture/Humidity Resistance Good
    Conductivity
    Dielectric Strength (V/mil) 435 VPM
    Dielectric Constant 3.56, 3.51, 3.18 Test Method
    Hardness
    Elongation (%) 3, 2, 5
    Other Properties
    Specific Gravity 1.130, 1.060
    Coefficient of Thermal Expansion (CTE) 6.3e-5 (in./ in/°C)
    Density (g/cm³) .042 (lbs./Cubic inch)
    Business Information
    Shelf Life Details Store below 25°C out of sunlight and in original unopened containers.

  • Best Practices for Henkel Armstrong C-4 Epoxy Resin w/ Activator D

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Viscosity Test Methods
Viscosity Temperature
1,500 cPs 25°C
Low
Work / Pot Time Test Methods
Work / Pot Time Temperature
40 min 25°C
Cleavage Strength Test Methods
Cleavage Strength Cure Time Cure Temperature
540 psi 120 min 74°C
Compressive Strength Test Methods
Compressive Strength Cure Time Cure Temperature
15.7 (psi) x 1000 10,080 min 20 to 25°C Room Temperature
18.3 (psi) x 1000 120 min 74°C
General Bond Strength Test Methods
General Bond Strength Cure Time Cure Temperature
1,560 psi 0.00 min 20 to 25°C Room Temperature
850 psi 0.00 min 74°C
Tensile Strength Test Methods
Tensile Strength Cure Time Cure Temperature Substrate Chemical Test Time Test Temperature Test Humidity
4,000 psi 10,080 min 25°C
8,500 psi 120 min 74°C
1,280 psi 10,080 min 25°C Al/Al 25°C
600 psi 10,080 min 25°C Al/Al <82°C
950 psi 10,080 min 25°C Al/Al -51°C
1,590 psi 10,080 min 25°C Al/Al Ammonia, 28% 10,080 min
1,200 psi 10,080 min 25°C Al/Al Distilled water 10,080 min
1,080 psi 10,080 min 25°C Al/Al Salt Water, 10% 10,080 min
1,100 psi 10,080 min 25°C Al/Al Acetone 10,080 min
730 psi 10,080 min 25°C Al/Al Glacial Acetic Acid 10,080 min
1,440 psi 10,080 min 25°C Al/Al Toluene
1,200 psi 10,080 min 25°C Al/Al Ethylenedichloride
1,460 psi 10,080 min 25°C Al/Al Ethyl Acetate
1,900 psi 10,080 min 25°C Al/Al Hexane 10,080 min
1,750 psi 10,080 min 25°C Al/Al 25°C 100 %
2,680 psi 120 min 74°C Al/Al <82°C
1,450 psi 120 min 74°C Al/Al 10,080 min -51°C
1,250 psi 120 min 74°C Al/Al Ammonia, 28% 10,080 min
1,810 psi 120 min 74°C Al/Al Distilled water 10,080 min
2,530 psi 120 min 74°C Al/Al Salt Water, 10% 10,080 min
2,250 psi 120 min 74°C Al/Al Acetone 10,080 min
2,130 psi 120 min 74°C Al/Al Glacial Acetic Acid
1,620 psi 120 min 74°C Al/Al Toluene
2,600 psi 120 min 74°C Al/Al Ethylenedichloride
1,720 psi 120 min 74°C Al/Al Ethyl Acetate 10,080 min
2,710 psi 120 min 74°C Al/Al Hexane
2,340 psi 120 min 74°C Al/Al
2,190 psi 120 min 74°C Al/Al
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.56 60 Cycles
3.51 e3 Cycles
3.18 e6 Cycles