Henkel Armstrong C-7 w/ Activator E Datasheet Henkel Armstrong C-7 w/ Activator E

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  • Description for Henkel Armstrong C-7 w/ Activator E

    A low viscosity epoxy adhesive system designed to cure with heat. Once cured it produces an adhesive with a very rigid bond line. Exceptionally good chemical and solvent resistance.

    *See Terms of Use Below

    Brand Armstrong
    Chemical Resistance Exceptionally good, Chemical Resistance: Exceptionally good solvent resistance
    Application Type Bonding
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Substrate Al
    Industry Strain gauge transducers
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method 2 Parts Cure, Heat cure
    Cure Temperature (°C) 93, 100
    Cure Time (min) 60, 180
    Viscosity (cPs) 6,600, Low
    Color Clear, Colorless to yellow, Transparent, Colorless to yellow
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
    Density (g/cm³) 0.042 lbs/cubic inch

  • Technical Data for Henkel Armstrong C-7 w/ Activator E

    *See Terms of Use Below

    Overview
    • Chemical Resistance
      • Chemical Resistance - Exceptionally good
      • Chemical Resistance : Relative Solvent Resistance - Exceptionally good solvent resistance
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Substrate
    • Industry
      • Electronics - Strain gauge transducers
      • Industrial - Excellent part-to-part duplication
      • Other - Other strain measuring elements
    • Chemistry
    • Cure Method
      • Heat - Heat cure
      • 2-Part Cure - 2 Parts Cure
    • Color
      • Clear / Transparent - Clear, Transparent, Colorless to yellow
      • Yellow - Colorless to yellow
    • Brand
      • Armstrong
    Specifications
    Cure Specs
    Cure Temperature (°C) 93, 100 Test Method
    Cure Time (min) 60, 180 Test Method
    Viscosity (cPs) 6,600, Low Test Method
    Work / Pot Time (min) 120 to 180, Long Test Method
    Mix Ratio 100:6 (by volume), 11.93:1 (by volume), 16.67:1 (by weight)
    Bond Strength
    Shear Strength (psi) 2,100 Test Method
    Material Resistance
    Dimensional Stability (%) Dimensional stability
    High Temperature Resistance (°C) 150 Test Method
    Low Temperature Resistance (°C) -40 Test Method
    Hardness
    Shore D Hardness 85 Test Method
    Flexibility Rigid
    Other Properties
    Glass Transition Temp (Tg) (°C) 33 Test Method
    Specific Gravity 1.130 Test Method
    Density (g/cm³) 0.042 lbs/cubic inch
    Business Information
    Shelf Life Details Store below 25°C out of sunlight and in original unopened containers., 12 months at 25 °C; Specialty packaging may be less.
    Shelf Life Temperature (°F) 77, 77
    Shelf Life (mon) 12

  • Best Practices for Henkel Armstrong C-7 w/ Activator E

    *See Terms of Use Below

    1. Surface Preparation

      Clean up uncured resin with suitable organic solvent such as MEK, acetone or other organic solvent.

    2. Mixing

      Bring both components to room temperature prior to mixing. Cartridge format: Mixer should be attached keeping the cartridge vertical and any air pocket purged this way. After the mixer contains material, the mixer tip can be dropped to dispense pre-bleed amount. Attach a new static mixer with each cartridge, then pre-bleed the first 3 inches of dispensed material or until a uniform color is obtained. Maintain adequate velocity during dispensing to ensure complete mixing.

      Bulk format: weigh and mix parts A and B accurately and thoroughly, scraping sides of container often. Do not pour from mixing container, transfer to a new container as residual unmixed material may cause a tacky spot on the surface of the casting. Maintain adequate velocity during dispensing to ensure complete mixing.

    3. Curing

      Allow to cure undisturbed until product is fully gelled or tack-free to the touch.

  • Comparable Materials for Henkel Armstrong C-7 w/ Activator E

    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
93°C Extrapolated from Henkel LDS
100°C
Cure Time Test Methods
Cure Time Test Method
60 min Extrapolated from Henkel LDS
180 min
Viscosity Test Methods
Viscosity Test Method Temperature
6,600 cPs Extrapolated from Henkel LDS, Mixed 25°C
Low
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
120 to 180 min Pot Life, defined as the time it takes for initial mixed viscosity to double, Extrapolated from Henkel LDS 25°C
Long
Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Substrate Test Method
2,100 psi Lap Shear Strength 0.05 min 100°C Al to Al 0.005” bond line, 4535601224468/ASTM D1002 Tested on FPL etched Al
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
150°C Operating Temperature, Operating Temperature Range is based on average design requirements and is not intended as a guarantee of suitability for all applications operating at that temperature.
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-40°C Operating Temperature,Operating Temperature Range is based on average design requirements and is not intended as a guarantee of suitability for all applications operating at that temperature.
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
85 455300006287/ASTM D2240
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
33°C 453560822409 by DSC
Specific Gravity Test Methods
Specific Gravity Temperature
1.130 25°C