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Description for Henkel Armstrong T-112
A low viscosity system used for laminating, casting and adhesive applications. This system is a fast-curing, room temperature material containing no volatiles, being 100% reactive.Brand Armstrong Chemical Resistance Good Chemical Resistance Application Type Bond, Casting, Pot, Laminate, Encapsulate 1 Part or 2 Part 2-Part Material Form Liquid Substrate Ceramic, Glass, Metal, Thermosetting Plastic, Hard Rubber, Wood Industry Electrical components Manufacturer Henkel Chemistry Epoxy Cure Method Resin/Hardener, Heat Cure Temperature (°C) 25, 71 Cure Time (min) Fast, 1,440, 60 to 120 Viscosity (cPs) Low, 1,200 -
Technical Data for Henkel Armstrong T-112
Overview
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Chemical Resistance
- Chemical Resistance - Good Chemical Resistance
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Application Type
- Laminate
- Casting / Moldmaking - Casting
- Adhesive - Bond
- Pottant / Encapsulant - Pot, Encapsulate
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1 Part or 2 Part
- 2-Part
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Material Form
- Liquid
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Industry
- Electronics - Electrical components
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Chemistry
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Cure Method
- Heat
- 2-Part Cure - Resin/Hardener
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Brand
- Armstrong
Specifications
Cure Specs
Cure Temperature (°C) 25, 71 Cure Time (min) Fast, 1,440, 60 to 120 Viscosity (cPs) Low, 1,200 Test Method Work / Pot Time (min) 40 Test Method Bond Strength
General Bond Strength (psi) Excellent Material Resistance
Moisture/Humidity Resistance Good Moisture Resistance Conductivity
Dielectric Strength (V/mil) Excellent Electrical Properties Business Information
Shelf Life Details Store below 25°C out of sunlight and in original unopened containers. Refer to packaging specific quote for shelf life information. Shelf Life Temperature (°F) <77 -
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Best Practices for Henkel Armstrong T-112
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Comparable Materials for Henkel Armstrong T-112
Spec Engine® Results
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