Henkel Armstrong T-112

Henkel Armstrong T-112 Datasheet
  • Description for Henkel Armstrong T-112

    A low viscosity system used for laminating, casting and adhesive applications. This system is a fast-curing, room temperature material containing no volatiles, being 100% reactive.

    *See Terms of Use Below

    Brand Armstrong
    Application Type Bond, Laminate, Casting, Pot, Encapsulate
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Ceramic, Glass, Metal, Thermosetting Plastic, Hard Rubber, Wood
    Industry Electrical components
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Heat, Resin/Hardener
    Cure Temperature (°C) 25, 71
    Cure Time (min) Fast, 1,440, 60 to 120
    Viscosity (cPs) Low, 1,200
    Chemical Resistance Good Chemical Resistance
  • Technical Data for Henkel Armstrong T-112

    Overview
    Specifications
    Cure Specs
    Cure Temperature (°C) 25, 71
    Cure Time (min) Fast, 1,440, 60 to 120
    Viscosity (cPs) Low, 1,200 Test Method
    Work / Pot Time (min) 40 Test Method
    Bond Strength
    General Bond Strength (psi) Excellent
    Material Resistance
    Chemical Resistance Good Chemical Resistance
    Moisture/Humidity Resistance Good Moisture Resistance
    Conductivity
    Dielectric Strength (V/mil) Excellent Electrical Properties
    Business Information
    Shelf Life Details Store below 25°C out of sunlight and in original unopened containers. Refer to packaging specific quote for shelf life information.
    Shelf Life Temperature (°F) <77
  • Best Practices for Henkel Armstrong T-112

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  • Comparable Materials for Henkel Armstrong T-112

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Viscosity Test Methods
Viscosity Temperature
Low
1,200 cPs 25°C
Work / Pot Time Test Methods
Work / Pot Time Temperature
40 min 25°C