Henkel Armstrong T-112 Datasheet Henkel Armstrong T-112

Information provided by Gluespec
  • Description for Henkel Armstrong T-112

    A low viscosity system used for laminating, casting and adhesive applications. This system is a fast-curing, room temperature material containing no volatiles, being 100% reactive.

    *See Terms of Use Below

    Brand Armstrong
    Application Type Bond, Laminate, Casting, Pot, Encapsulate
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Ceramic, Glass, Metal, Thermosetting Plastic, Hard Rubber, Wood
    Industry Electrical components
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Heat, Resin/Hardener
    Cure Temperature (°C) 25, 71
    Cure Time (min) Fast, 1,440, 60 to 120
    Viscosity (cPs) Low, 1,200
    Chemical Resistance Good Chemical Resistance
  • Technical Data for Henkel Armstrong T-112

    Overview
    Specifications
    Cure Specs
    Cure Temperature (°C) 25, 71
    Cure Time (min) Fast, 1,440, 60 to 120
    Viscosity (cPs) Low, 1,200 Test Method
    Work / Pot Time (min) 40 Test Method
    Bond Strength
    General Bond Strength (psi) Excellent
    Material Resistance
    Chemical Resistance Good Chemical Resistance
    Moisture/Humidity Resistance Good Moisture Resistance
    Conductivity
    Dielectric Strength (V/mil) Excellent Electrical Properties
    Business Information
    Shelf Life Details Store below 25°C out of sunlight and in original unopened containers. Refer to packaging specific quote for shelf life information.
    Shelf Life Temperature (°F) <77
  • Best Practices for Henkel Armstrong T-112

    *See Terms of Use Below

  • Comparable Materials for Henkel Armstrong T-112

    *See Terms of Use Below

    Spec Engine® Results

Popular Articles

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Electrically Conductive Adhesives

Read Article

Testing the effectiveness of surface treatments

Read Article

Epoxies in the Medical Device Industry

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article

Featured Ads

1775 Materials
View Henkel Catalog >

Request Quote: Henkel Armstrong T-112

Gluespec Poll

When you're researching or sourcing materials online, what device are you using?
Viscosity Test Methods
Viscosity Temperature
Low
1,200 cPs 25°C
Work / Pot Time Test Methods
Work / Pot Time Temperature
40 min 25°C