Henkel Armstrong T-112

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Description for Henkel Armstrong T-112

A low viscosity system used for laminating, casting and adhesive applications. This system is a fast-curing, room temperature material containing no volatiles, being 100% reactive.

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Brand	Armstrong
Application Type	Bond, Laminate, Casting, Pot, Encapsulate
1 Part or 2 Part	2 Part
Material Form	Liquid
Substrate	Ceramic, Glass, Metal, Thermosetting Plastic, Hard Rubber, Wood
Industry	Electrical components
Manufacturer	Henkel
Chemistry	Epoxy
Cure Method	Heat, Resin/Hardener
Cure Temperature (°C)	25, 71
Cure Time (min)	Fast, 1,440, 60 to 120
Viscosity (cPs)	Low, 1,200
Chemical Resistance	Good Chemical Resistance

Best Practices for Henkel Armstrong T-112

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Technical Data

Overview

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Specifications

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Best Practices

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Comparable Materials

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Viscosity Test Methods

Viscosity	Temperature
Low
1,200 cPs	25°C

Work / Pot Time Test Methods

Work / Pot Time	Temperature
40 min	25°C

Henkel Armstrong T-112

Description for Henkel Armstrong T-112