Henkel Armstrong T-112

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Description for Henkel Armstrong T-112

A low viscosity system used for laminating, casting and adhesive applications. This system is a fast-curing, room temperature material containing no volatiles, being 100% reactive.

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Brand	Armstrong
Chemical Resistance	Good Chemical Resistance
Application Type	Bond, Casting, Pot, Laminate, Encapsulate
1 Part or 2 Part	2-Part
Material Form	Liquid
Substrate	Ceramic, Glass, Metal, Thermosetting Plastic, Hard Rubber, Wood
Industry	Electrical components
Manufacturer	Henkel
Chemistry	Epoxy
Cure Method	Resin/Hardener, Heat
Cure Temperature (°C)	25, 71
Cure Time (min)	Fast, 1,440, 60 to 120
Viscosity (cPs)	Low, 1,200

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Technical Data for Henkel Armstrong T-112

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Overview

Chemical Resistance
- Chemical Resistance - Good Chemical Resistance
Application Type
- Laminate
- Casting / Moldmaking - Casting
- Adhesive - Bond
- Pottant / Encapsulant - Pot, Encapsulate
1 Part or 2 Part
- 2-Part
Material Form
- Liquid
Substrate
- Ceramic
- Glass
- Metal
- Plastic - Thermosetting Plastic
- Rubber - Hard Rubber
- Wood
- Other - rigid material
Industry
- Electronics - Electrical components
Chemistry
- Epoxy
Cure Method
- Heat
- 2-Part Cure - Resin/Hardener
Brand
- Armstrong

Specifications

Cure Specs

Cure Temperature (°C)	25, 71
Cure Time (min)	Fast, 1,440, 60 to 120
Viscosity (cPs)	Low, 1,200	Test Method
Work / Pot Time (min)	40	Test Method

Bond Strength

General Bond Strength (psi)	Excellent

Material Resistance

Moisture/Humidity Resistance	Good Moisture Resistance

Conductivity

Dielectric Strength (V/mil)	Excellent Electrical Properties

Business Information

Shelf Life Details	Store below 25°C out of sunlight and in original unopened containers. Refer to packaging specific quote for shelf life information.
Shelf Life Temperature (°F)	<77

Best Practices for Henkel Armstrong T-112

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Comparable Materials for Henkel Armstrong T-112

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Spec Engine^® Results
- Loctite EA 3336(Henkel)
  A UV cure, medium viscosity, two-part epoxy. UV cure effects fast gelation. Heat or room temperature cure. Tough and durable. Designed for potting, bonding, and sealing.
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  A general purpose, unfilled epoxy resin can be used in many applications including adhesive, laminating and electrical/electronic insulation.
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