Henkel Armstrong X-81 Activator A

Henkel Armstrong X-81 Activator A Datasheet
  • Description for Henkel Armstrong X-81 Activator A

    A fast-setting compound that is thixotropic in nature. The systems has three components. The mixed material is dark amber in appearance.

    *See Terms of Use Below

    Brand Armstrong
    Application Type Bond, Encapsulate, Repair
    1 Part or 2 Part Three components
    Material Form Paste
    Substrate Al
    Industry Rigid Electrical components, Electronics: Printed circuit boards
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Temperature (°C) 25, 74
    Cure Time (min) 1,440, 60 to 120
    Viscosity (cPs) 20,000 to 180,000, 5 to 15, 500 to 1,500
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Substrate Test Method
>1,200 psi Tensile shear strength 120 min 74°C al/al X-81 & Act “A” 100/10, Cured 2 hrs 165°F
>1,000 psi Tensile shear strength 4,320 min 25°C al/al X-81 & Act “A” 100/10, Cured 3 days 77°F
>3,000 psi Tensile shear strength 120 min 74°C al/al X-81, Act A, & Flex Resin #1 100/10/20, Cured 2 hrs 165°F
>1,800 psi Tensile shear strength 4,320 min 25°C al/al X-81, Act A, & Flex Resin #1 100/10/20, Cured 3 days 77°F
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
3.2 x 10(-5) (in/in°F) X-81 & Act “A” 100/10
4.3 x 10(-5) (in/in°F) X-81, Act A, & Flex Resin #1 100/10/20
Specific Gravity Test Methods
Specific Gravity Test Method
1.200 X-81 & Act “A” 100/10
1.210 X-81, Act A, & Flex Resin #1 100/10/20