Henkel Armstrong X-81 Activator A Datasheet Henkel Armstrong X-81 Activator A

CONTACT REP
Information provided by Gluespec

  • Description for Henkel Armstrong X-81 Activator A

    A fast-setting compound that is thixotropic in nature. The systems has three components. The mixed material is dark amber in appearance.

    *See Terms of Use Below

    Brand Armstrong
    Application Type Bond, Encapsulate, Repair
    1 Part or 2 Part Three components
    Material Form Paste
    Substrate Al
    Industry Rigid Electrical components, Printed circuit boards
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Base resin/Flexible Resin #1/Activator A
    Cure Temperature (°C) 25, 74
    Cure Time (min) 1,440, 60 to 120
    Viscosity (cPs) 20,000 to 180,000, 5.00 to 15, 500 to 1,500

  • Technical Data for Henkel Armstrong X-81 Activator A

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1-Part - Three components
    • Material Form
      • Paste
    • Substrate
    • Industry
      • Electronics - Rigid Electrical components
      • Printed Circuit Board (PCB) - Printed circuit boards
      • Other - Filleting
    • Chemistry
    • Cure Method
      • 3-Part or More Cure - Base resin/Flexible Resin #1/Activator A
    • Brand
      • Armstrong
    Specifications
    Cure Specs
    Cure Temperature (°C) 25, 74
    Cure Time (min) 1,440, 60 to 120
    Viscosity (cPs) 20,000 to 180,000, 5.00 to 15, 500 to 1,500
    Set Time (min) Fast
    Work / Pot Time (min) Short, 6, 6
    Thixotropic Thixotropic
    Bond Strength
    Shear Strength (psi) >1,200, >1,000, >3,000, >1,800 Test Method
    Hardness
    Shore D Hardness >80, >70
    Other Properties
    Specific Gravity 1.200, 1.210 Test Method
    Coefficient of Thermal Expansion (CTE) 3.2 x 10(-5) (in/in°F), 4.3 x 10(-5) (in/in°F) Test Method
    Business Information
    Shelf Life Details Store below 80°F out of sunlight and in original unopened containers. Refer to packaging specific quote for shelf life information.
    Shelf Life Temperature (°F) <80

  • Best Practices for Henkel Armstrong X-81 Activator A

    *See Terms of Use Below

  • Comparable Materials for Henkel Armstrong X-81 Activator A

    *See Terms of Use Below

    Spec Engine® Results

    • Henkel
      Eccobond A329-1(Henkel)

      A one component, heat cured, sag resistant epoxy adhesive. It has excellent high temperature and bond strength properties.

    • Henkel
      Loctite Ablestik 281 BK(Henkel)

      ● One component ● High thermal conductivity ● Non-sag paste ● Thixotropic ● Good chemical resistance ● High electrical insulation ● Low coefficient of thermal expansion

    • Henkel
      Product E-310(Henkel)

      A single-component epoxy designed for structural bonding of metal, glass and plastic. The single component epoxy cures at elevated temperatures. Excellent vibration and impact resistance. High viscosity at curing temperature.

    • Compare All
  Download Technical Data Sheet   Save This Material   Compare View Saved Items

Popular Articles

Epoxy Adhesives for Medical Devices

Read Article

Electrically Conductive Adhesives

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Testing the effectiveness of surface treatments

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article

Featured Ads

Top Catalog Pages for Henkel Armstrong X-81 Activator A

All Henkel Materials
View Now

Gluespec Poll

When you're researching or sourcing materials online, what device are you using?
Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Substrate Test Method
>1,200 psi Tensile shear strength 120 min 74°C al/al X-81 & Act “A” 100/10, Cured 2 hrs 165°F
>1,000 psi Tensile shear strength 4,320 min 25°C al/al X-81 & Act “A” 100/10, Cured 3 days 77°F
>3,000 psi Tensile shear strength 120 min 74°C al/al X-81, Act A, & Flex Resin #1 100/10/20, Cured 2 hrs 165°F
>1,800 psi Tensile shear strength 4,320 min 25°C al/al X-81, Act A, & Flex Resin #1 100/10/20, Cured 3 days 77°F
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
3.2 x 10(-5) (in/in°F) X-81 & Act “A” 100/10
4.3 x 10(-5) (in/in°F) X-81, Act A, & Flex Resin #1 100/10/20
Specific Gravity Test Methods
Specific Gravity Test Method
1.200 X-81 & Act “A” 100/10
1.210 X-81, Act A, & Flex Resin #1 100/10/20