Henkel Armstrong X-81 Activator A Datasheet Henkel Armstrong X-81 Activator A

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  • Description for Henkel Armstrong X-81 Activator A

    A fast-setting compound that is thixotropic in nature. The systems has three components. The mixed material is dark amber in appearance.

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    Brand Armstrong
    Application Type Bond, Encapsulate, Repair
    1 Part or 2 Part Three components
    Material Form Paste
    Substrate Al
    Industry Rigid Electrical components, Printed circuit boards
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Base resin/Flexible Resin #1/Activator A
    Cure Temperature (°C) 25, 74
    Cure Time (min) 1,440, 60 to 120
    Viscosity (cPs) 20,000 to 180,000, 5.00 to 15, 500 to 1,500

  • Technical Data for Henkel Armstrong X-81 Activator A

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    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1-Part - Three components
    • Material Form
      • Paste
    • Substrate
    • Industry
      • Electronics - Rigid Electrical components
      • Printed Circuit Board (PCB) - Printed circuit boards
      • Other - Filleting
    • Chemistry
    • Cure Method
      • 3-Part or More Cure - Base resin/Flexible Resin #1/Activator A
    • Brand
      • Armstrong
    Specifications
    Cure Specs
    Cure Temperature (°C) 25, 74
    Cure Time (min) 1,440, 60 to 120
    Viscosity (cPs) 20,000 to 180,000, 5.00 to 15, 500 to 1,500
    Set Time (min) Fast
    Work / Pot Time (min) Short, 6, 6
    Thixotropic Thixotropic
    Bond Strength
    Shear Strength (psi) >1,200, >1,000, >3,000, >1,800 Test Method
    Hardness
    Shore D Hardness >80, >70
    Other Properties
    Specific Gravity 1.200, 1.210 Test Method
    Coefficient of Thermal Expansion (CTE) 3.2 x 10(-5) (in/in°F), 4.3 x 10(-5) (in/in°F) Test Method
    Business Information
    Shelf Life Details Store below 80°F out of sunlight and in original unopened containers. Refer to packaging specific quote for shelf life information.
    Shelf Life Temperature (°F) <80

  • Best Practices for Henkel Armstrong X-81 Activator A

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  • Comparable Materials for Henkel Armstrong X-81 Activator A

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    Spec Engine® Results

    • Henkel
      Eccobond A329-1(Henkel)

      A one component, heat cured, sag resistant epoxy adhesive. It has excellent high temperature and bond strength properties.

    • Henkel
      Loctite Ablestik 281 BK(Henkel)

      ● One component ● High thermal conductivity ● Non-sag paste ● Thixotropic ● Good chemical resistance ● High electrical insulation ● Low coefficient of thermal expansion

    • Henkel
      Product E-310(Henkel)

      A single-component epoxy designed for structural bonding of metal, glass and plastic. The single component epoxy cures at elevated temperatures. Excellent vibration and impact resistance. High viscosity at curing temperature.

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Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Substrate Test Method
>1,200 psi Tensile shear strength 120 min 74°C al/al X-81 & Act “A” 100/10, Cured 2 hrs 165°F
>1,000 psi Tensile shear strength 4,320 min 25°C al/al X-81 & Act “A” 100/10, Cured 3 days 77°F
>3,000 psi Tensile shear strength 120 min 74°C al/al X-81, Act A, & Flex Resin #1 100/10/20, Cured 2 hrs 165°F
>1,800 psi Tensile shear strength 4,320 min 25°C al/al X-81, Act A, & Flex Resin #1 100/10/20, Cured 3 days 77°F
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
3.2 x 10(-5) (in/in°F) X-81 & Act “A” 100/10
4.3 x 10(-5) (in/in°F) X-81, Act A, & Flex Resin #1 100/10/20
Specific Gravity Test Methods
Specific Gravity Test Method
1.200 X-81 & Act “A” 100/10
1.210 X-81, Act A, & Flex Resin #1 100/10/20