Henkel Armstrong X-81 Activator A

Henkel Armstrong X-81 Activator A Datasheet
CONTACT REP

  • Description for Henkel Armstrong X-81 Activator A

    A fast-setting compound that is thixotropic in nature. The systems has three components. The mixed material is dark amber in appearance.

    *See Terms of Use Below

    Brand Armstrong
    Application Type Bond, Encapsulate, Repair
    1 Part or 2 Part Three components
    Material Form Paste
    Substrate Al
    Industry Rigid Electrical components, Printed circuit boards
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Temperature (°C) 25, 74
    Cure Time (min) 1,440, 60 to 120
    Viscosity (cPs) 20,000 to 180,000, 5 to 15, 500 to 1,500

  • Technical Data for Henkel Armstrong X-81 Activator A

    *See Terms of Use Below

    Overview
    Specifications
    Cure Specs
    Cure Temperature (°C) 25, 74
    Cure Time (min) 1,440, 60 to 120
    Viscosity (cPs) 20,000 to 180,000, 5 to 15, 500 to 1,500
    Set Time (min) Fast
    Work / Pot Time (min) Short, 6, 6
    Thixotropic Thixotropic
    Bond Strength
    Shear Strength (psi) >1,200, >1,000, >3,000, >1,800 Test Method
    Hardness
    Shore D Hardness >80, >70
    Other Properties
    Specific Gravity 1.200, 1.210 Test Method
    Coefficient of Thermal Expansion (CTE) 3.2 x 10(-5) (in/in°F), 4.3 x 10(-5) (in/in°F) Test Method
    Business Information
    Shelf Life Details Store below 80°F out of sunlight and in original unopened containers. Refer to packaging specific quote for shelf life information.
    Shelf Life Temperature (°F) <80

  • Best Practices for Henkel Armstrong X-81 Activator A

    *See Terms of Use Below

  • Comparable Materials for Henkel Armstrong X-81 Activator A

    *See Terms of Use Below

    Spec Engine® Results

  Download Technical Data Sheet   Save This Material Saved Items

Questions about this material?

Henkel - Armstrong X-81 Activator A

Get personal assistance with your specific application needs.

Your Profile Edit
Submit

Popular Articles

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Testing the effectiveness of surface treatments

Read Article

Electrically Conductive Adhesives

Read Article

Epoxies in the Medical Device Industry

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article
Information provided by Gluespec

Why Register?

  • View Technical Details
  • View Test Methods
  • View Key Specifications
  • View Similar Materials
  • Save your Project Searches

Already registered? Sign in.

Questions? Learn more about Gluespec

Gluespec Poll

What level of expertise do you have in specialty chemicals like adhesives, sealants, conformal coatings, etc.?
Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Substrate Test Method
>1,200 psi Tensile shear strength 120 min 74°C al/al X-81 & Act “A” 100/10, Cured 2 hrs 165°F
>1,000 psi Tensile shear strength 4,320 min 25°C al/al X-81 & Act “A” 100/10, Cured 3 days 77°F
>3,000 psi Tensile shear strength 120 min 74°C al/al X-81, Act A, & Flex Resin #1 100/10/20, Cured 2 hrs 165°F
>1,800 psi Tensile shear strength 4,320 min 25°C al/al X-81, Act A, & Flex Resin #1 100/10/20, Cured 3 days 77°F
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
3.2 x 10(-5) (in/in°F) X-81 & Act “A” 100/10
4.3 x 10(-5) (in/in°F) X-81, Act A, & Flex Resin #1 100/10/20
Specific Gravity Test Methods
Specific Gravity Test Method
1.200 X-81 & Act “A” 100/10
1.210 X-81, Act A, & Flex Resin #1 100/10/20