Henkel Bondmaster Double Bubble Datasheet Henkel Bondmaster Double Bubble

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  • Description for Henkel Bondmaster Double Bubble

    Bond to a wide variety of materials (i.e. wood, metal, plastic and ceramic) and cures rapidly to give handling strength in approximately 5 minutes.

    *See Terms of Use Below

    Brand Bondmaster
    Application Type Bond
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Substrate Aluminum, Ceramic, Composite, Copper alloys, Metal, Plastic, Steel, Wood
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Resin/Hardener
    Cure Temperature (°C) 23, 60
    Cure Time (min) rapidly
    Viscosity (cPs) 35,000
    Color Clear
    High Temperature Resistance (°C) 100, 200
    Low Temperature Resistance (°C) -55

  • Technical Data for Henkel Bondmaster Double Bubble

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Substrate
    • Chemistry
    • Cure Method
      • 2-Part Cure - Resin/Hardener
    • Color
      • Clear / Transparent - Clear
    • Brand
      • Bondmaster
    • Also Known As
      • Old Name - Mix & Fix
    Specifications
    Cure Specs
    Cure Temperature (°C) 23, 60
    Cure Time (min) rapidly
    Viscosity (cPs) 35,000
    Fixture or Handling Strength Time (min) 5.00 Test Method
    Work / Pot Time (min) 30, 2.00 Test Method
    Mix Ratio 1:1 (by volume), 100:94 (by weight)
    Bond Strength
    Shear Strength (psi) 9 (Mpa) Test Method
    Material Resistance
    High Temperature Resistance (°C) 100, 200
    Low Temperature Resistance (°C) -55
    Other Properties
    Specific Gravity 1.160
    Business Information
    Shelf Life Details When stored in the original unopened containers at 5-25°C, the shelf life of this product is 36 months from date of manufacture.
    Shelf Life Temperature (°F) 41 to 77
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 36

  • Best Practices for Henkel Bondmaster Double Bubble

    *See Terms of Use Below

    1. Surface Preparation

      Surfaces should be clean, dry and grease free before applying the adhesive.

      Where maximum strength is required then the surfaces should be shot blasted, or lightly abraded, in the presence of Bondmaster SIP.

    2. Mixing

      Thoroughly mix Resin (A) and Hardener(B)in the correct proportion. Do not mix more material than can be applied during the 'usable life' of the product.

    3. Curing

      Bondmaster Double Bubble can be cured at temperatures down to 0°C but care must be taken to ensure the surfaces are not coated with condensation.

  • Comparable Materials for Henkel Bondmaster Double Bubble

    *See Terms of Use Below

    Spec Engine® Results

    • Henkel
      E01(Henkel)

      A two-part, epoxy adhesive that is easy to use and apply. It comes to a full cure at room temperature, is non-flammable, has low shrinkage and adheres to a wide variety of substrates. Has a soft paste consistency for precise application to parts.

    • Resinlab
      PX800F(Resinlab)

      A two component very fast curing multi-purpose epoxy adhesive for bonding and sealing. High adhesion to a wide variety of substrates, rapid curing, structural support.

    • Henkel
      Oxy-Bond 1105(Henkel)

      High performance, medium viscosity, 5 minute fixture adhesive.

    • Compare All
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Fixture or Handling Strength Time Test Methods
Fixture or Handling Strength Time Fixture-Handling Strength Test Method
5.00 min Approximately
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
30 min The cure speed of 2 part epoxy resins is generally affected by the ambient temperature. A fall of 8°C will roughly double the cure time;a rise of 8°C will tend to halve it 23°C
2.00 min The cure speed of 2 part epoxy resins is generally affected by the ambient temperature. A fall of 8°C will roughly double the cure time;a rise of 8°C will tend to halve it. 60°C
Shear Strength Test Methods
Shear Strength Type Substrate
9 (Mpa) Lap shear strength Steel