Henkel Bondmaster Double Bubble

Henkel Bondmaster Double Bubble Datasheet
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  • Description for Henkel Bondmaster Double Bubble

    Bond to a wide variety of materials (i.e. wood, metal, plastic and ceramic) and cures rapidly to give handling strength in approximately 5 minutes.

    *See Terms of Use Below

    Brand Bondmaster
    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Aluminum, Ceramic, Composite, Copper alloys, Metal, Plastic, Steel, Wood
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Resin/Hardener
    Cure Temperature (°C) 23, 60
    Cure Time (min) rapidly
    Viscosity (cPs) 35,000
    Color Clear
    High Temperature Resistance (°C) 100, 200
    Low Temperature Resistance (°C) -55

  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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  • Comparable Materials

    *See Terms of Use Below

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Fixture or Handling Strength Time Test Methods
Fixture or Handling Strength Time Fixture-Handling Strength Test Method
5.00 min Approximately
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
30 min The cure speed of 2 part epoxy resins is generally affected by the ambient temperature. A fall of 8°C will roughly double the cure time;a rise of 8°C will tend to halve it 23°C
2.00 min The cure speed of 2 part epoxy resins is generally affected by the ambient temperature. A fall of 8°C will roughly double the cure time;a rise of 8°C will tend to halve it. 60°C
Shear Strength Test Methods
Shear Strength Type Substrate
9 (Mpa) Lap shear strength Steel